10AS048E3F29E2LG - Arria 10 SX SoC FPGA 480K LE | Intel
MPN: 10AS048E3F29E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8200 | $82,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7400 | $3,700,000.00 |
| 1,000 | $7100 | $7,100,000.00 |
Drop-in alternatives for 10AS048E3F29E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048E2F29E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AS048E3F29I2LG
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✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AS066E3F29E2LG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS032E4F29E3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AS048E2F29I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AS048E3F29E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Variant | 10AS048 |
| Architecture | System-on-Chip (SoC) FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock Speed | Up to 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Operating Grade | Medical |
| Package | 780-ball FC-FBGA (29x29 mm, F29) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Recommended Operating Temperature | -40C to +100C (medical grade, per Arria 10 datasheet) |
| Product Type | SoC (per DigiKey categorization) |
10AS048E3F29E2LG 780-ball fc-fbga (29x29 mm, f29) Pin Configuration Guide
Complete pinout information for 10AS048E3F29E2LG (780-ball fc-fbga (29x29 mm, f29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048E3F29E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E3F29E2LG is suitable for 6 applications: Industrial Motor Control, Medical Imaging Pre-Processing, Software-Defined Radio Baseband, Machine Vision Inspection, High-Speed Data Acquisition, Industrial IoT Gateway.
Industrial Motor Control
The 10AS048E3F29E2LG is well suited to multi-axis industrial motor control where the dual ARM Cortex-A9 hard processor system runs a real-time control loop and Linux HMI in parallel while the 480K-logic-element FPGA fabric executes field-oriented control (FOC) and encoder feedback decoding at microsecond latency. Its 1.5 GHz HPS can handle EtherCAT, EtherNet/IP, or PROFINET stack processing, while hard floating-point DSP blocks accelerate Park/Clarke transforms and SVM modulation. The medical-grade screening plus -40C to +100C operating envelope make it reliable for factory-floor enclosures with elevated ambient temperatures.
Recommended
Medical Imaging Pre-Processing
For ultrasound, endoscopy, and patient-monitoring front-ends, the 10AS048E3F29E2LG pairs a Cortex-A9 dual-core host processor with 480K FPGA logic elements capable of real-time image filtering, beamforming, and JPEG/MJPEG compression at full video rates. Its medical-grade qualification simplifies regulatory submissions for IEC 60601-1 systems, while the 780-ball FC-FBGA supports high-bandwidth LVDS camera link inputs and DDR3/DDR4 frame buffering. The 0.9 V core voltage on 20 nm process keeps dissipated power manageable for fan-less medical carts.
Recommended
Software-Defined Radio Baseband
In SDR baseband cards, the 10AS048E3F29E2LG's 480K logic elements and hardened floating-point DSP blocks perform wide-bandwidth channelization, FFT, and digital down-conversion at line rate, while the dual ARM Cortex-A9 HPS executes the MAC layer, network stack, and waveform management. Multi-gigabit transceivers interface directly to RF ADC/DAC front-ends, and the Cortex-A9 NEON engine handles crypto accelerators for secure waveforms. Medical-grade screening is a bonus for mission-critical deployable radios.
Recommended
Machine Vision Inspection
The 10AS048E3F29E2LG is an excellent fit for high-speed factory inspection, where the FPGA fabric processes 4K CoaXPress or GigE Vision streams in real time and the ARM Cortex-A9 HPS runs the inspection algorithm, defect classification, and PLC integration. Its 480K logic elements accommodate multiple parallel image-processing pipelines, while the medical-grade operating range ensures long-term reliability in 24/7 production environments. PCIe Gen2 hard IP enables direct host-PC frame grabber integration when needed.
Recommended
High-Speed Data Acquisition
For radar, lidar, and scientific instruments, the 10AS048E3F29E2LG ingests multi-gigasample-per-second ADC data through LVDS or JESD204B interfaces implemented in the FPGA fabric, with the dual Cortex-A9 HPS responsible for time stamping, trigger handling, and data forwarding over 10 Gigabit Ethernet. Its 1.5 GHz HPS can drive TCP/IP streaming at full line rate, while 480K logic elements sustain 200+ MHz fabric clock for real-time DSP. Medical-grade screening supports long-life deployment in field instrumentation.
Recommended
Industrial IoT Gateway
Industrial IoT edge gateways benefit from the 10AS048E3F29E2LG's dual-core ARM Cortex-A9 running Linux with containerized applications, while the FPGA fabric accelerates protocol bridging between legacy fieldbuses (Modbus, CAN, RS-485) and modern MQTT/OPC-UA/TSN Ethernet. The 480K logic elements allow simultaneous support for several protocol converters in a single device, and the medical-grade screening guarantees long-term reliability in unattended industrial cabinets. The 0.9 V core voltage reduces power budget for PoE-powered gateways.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E3F29E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048E2F29E2LG | 10AS048E3F29I2LG | 10AS066E3F29E2LG | 10AS032E4F29E3LG | 10AS048E2F29I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (F29, 29x29 mm) | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 660,000 (+38%) | 270,000 (-44%) | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz |
| Feature Tier (E-code) | E3 | E2 (lower) | E3 | E3 | E4 (higher) | E2 (lower) |
| Operating Temperature | -40C to +100C (medical grade) | -40C to +100C (medical grade) | -40C to +100C (industrial grade) | -40C to +100C (medical grade) | -40C to +100C (medical grade) | -40C to +100C (industrial grade) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Approx. Unit Price (qty 1) | USD 8500 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Medical-grade screening extends operating-grade reliability beyond industrial (vs 10AS048E3F29I2LG (industrial grade))
- Higher logic density for compute-intensive designs (vs 10AS032E4F29E3LG (270K LE))
- Balanced E3 feature tier for moderate transceiver and DSP needs (vs 10AS032E4F29E3LG (E4 tier))
- Lower density but upgrade path to 660K LE within same F29 BGA (vs 10AS066E3F29E2LG (660K LE))
Design Notes
Estimated: at full HPS utilization (dual Cortex-A9 at 1.5 GHz) plus 80% logic utilization on the 480K fabric, the 10AS048E3F29E2LG can dissipate 15-25 W depending on toggle rate and transceiver usage. The 780-ball FC-FBGA package requires a multilayer PCB with a thermal via array beneath the central BGA balls and a heatsink rated for at least 8 W. Refer to Intel Arria 10 SX thermal design guidelines for junction-to-ambient thermal resistance modeling. The 0.9 V core voltage must be derived from a high-efficiency buck regulator with output accuracy within +/-3% to avoid timing margin loss.
The 780-ball FC-FBGA requires a high-layer-count PCB (typically 12+ layers) with microvia-in-pad construction, matched-length DDR3/DDR4 traces for the HPS memory controller, and dedicated transceiver channels routed with controlled impedance (typically 85 ohm differential for 10 Gbps links). Place decoupling capacitors on the bottom side directly under the BGA escape vias. Reference Intel's Arria 10 SX hardware design guidelines for ball-out specifics and PCIe Gen2/Gen3 channel routing rules.
Do not assume all Arria 10 SX variants share the same bitstream; the configuration bitstream is generated per device and per speed grade by Quartus Prime. Programming a 10AS048E3 with a 10AS048E2 or 10AS066E3 bitstream will fail configuration. Always regenerate programming files (.sof, .jic, .pof) for the exact target ordering part number. Also verify the HPS preloader image matches the specific device; mixed preloader+bitstream combinations can result in HPS boot failure.
Multi-gigabit transceivers on Arria 10 SX require strict signal-integrity practices: AC-coupled interconnect, controlled 100 ohm differential impedance, and tight via stub minimization via back-drilling or HDI construction. The 1.5 GHz HPS subsystem uses 0.9 V core plus separate PLL supplies; isolate PLL power rails with ferrite beads and decoupling networks as recommended in the Arria 10 SX pin connection guidelines.
Compliance Information
RoHS compliance and lead-free status confirmed per Intel/Altera material declarations. REACH, conflict-minerals, and AEC-Q100 status not specifically stated in verified web data; treat as unknown unless confirmed with Intel directly. AEC-Q100 does not apply to FPGAs as a category.