10AS048E2F29I2LG - Arria 10 SX SoC FPGA, 480K LE, Dual A9 | Intel
MPN: 10AS048E2F29I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2720 | $27,200.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2440 | $1,220,000.00 |
| 1,000 | $2295 | $2,295,000.00 |
Drop-in alternatives for 10AS048E2F29I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048E2F29I1HG
✅ Drop-In✓ In Stock
$2120 / Unit
View Datasheet →10AS048E2F29E2LG
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →10AS048E2F29E2SG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AS048E2F29E1HG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AS048E1F29I1HG
✅ Drop-In✓ In Stock
$1920 / Unit
View Datasheet →10AS048E2F29I2LG Maximum Ratings & Electrical Characteristics
| Product Type | SoC FPGA (System-on-Chip with ARM Cortex-A9 HPS) |
| Family | Arria 10 SX |
| Device Designator | 10AS048 |
| Logic Elements | 480,000 |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 780-pin FC-FBGA, 29 x 29 mm |
| Speed Grade | -2 |
| RoHS Status | Compliant (per manufacturer ordering page) |
| Mounting Type | Surface Mount (BGA) |
| Maximum Fabric Frequency | 1.5 GHz (core fabric performance per distributor description) |
| Hard Memory Controller | DDR3/DDR4 (HPS) |
10AS048E2F29I2LG 780-pin fc-fbga, 29 x 29 mm Pin Configuration Guide
Complete pinout information for 10AS048E2F29I2LG (780-pin fc-fbga, 29 x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048E2F29I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E2F29I2LG is suitable for 6 applications: Wireless Baseband Processing, Radar and SIGINT Front-End Processing, Industrial Machine Vision, Avionics and Defense LRUs, Medical Imaging Equipment, High-Performance Embedded Computing.
Wireless Baseband Processing
The 10AS048E2F29I2LG is well suited to wireless baseband processing where a programmable RF data path and a Linux-capable host processor are co-located. Its 480K logic elements and hardened DSP blocks deliver the gate density required for LTE/5G NR PHY channel coding, FFT/iFFT, and digital pre-distortion loops, while the dual-core ARM Cortex-A9 HPS runs the MAC scheduler and OAM stack over DDR3/DDR4. The industrial -40C to +100C temperature range lets the same part serve outdoor small-cell enclosures, and the 0.9 V core rail keeps dynamic power within the budget of a fanless chassis.
Recommended
Radar and SIGINT Front-End Processing
The 10AS048E2F29I2LG is widely deployed in defense and SIGINT signal pipelines where wideband ADC data must be decimated, pulse-compressed, and Doppler-processed in real time. The Arria 10 SX 480K-LE fabric delivers the FFT and vector-matrix throughput required by phased-array radar, while the HPS runs Linux + RFNoC-style drivers to push detection events upstream. Industrial temperature screening and a 20 nm low-power process keep thermal envelopes manageable for ruggedized enclosures.
Recommended
Industrial Machine Vision
The 10AS048E2F29I2LG suits high-frame-rate industrial machine vision systems where MIPI or GigE Vision cameras must be aggregated, undistorted, and inspected with CNN-style classifiers in real time. The dual ARM Cortex-A9 HPS handles Ethernet protocols and HMI/PLC integration, while the FPGA fabric accelerates Bayer demosaicing, lens correction, and ROI cropping. The 780-pin FC-FBGA footprint supports the high I/O count needed for multi-camera aggregation.
Recommended
Avionics and Defense LRUs
The 10AS048E2F29I2LG is used in avionics Line Replaceable Units (LRUs) where DO-254 design assurance and MIL-STD-810 environmental screening are required. The industrial -40C to +100C temperature range supports non-pressurized sections, the Arria 10 SX fabric provides SEU-mitigation through partial reconfiguration and scrubbing, and the HPS runs ARINC 653 / VxWorks or a DAL-B Linux profile. The 780-pin FC-FBGA package integrates cleanly into conduction-cooled chassis.
Recommended
Medical Imaging Equipment
The 10AS048E2F29I2LG is well matched to ultrasound, endoscopy, and MRI gradient-control systems where deterministic real-time DSP and a managed Linux application plane coexist. The FPGA fabric delivers beamforming and front-end filtering for ultrasound channels, while the dual-core ARM HPS handles the user interface, DICOM, and PACS integration. The industrial temperature screening supports portable cart-side equipment.
Recommended
High-Performance Embedded Computing
The 10AS048E2F29I2LG serves as the core of HPEC nodes where one FPGA must accelerate a single workload (compression, crypto, AI inference) while the HPS orchestrates data ingest and dispatch. The 480K-LE fabric holds multi-lane PCIe Gen2/Gen3 hard IP, and the dual-core ARM Cortex-A9 cluster runs Linux user-plane stacks. Industrial temperature and the F29 FC-FBGA footprint make it drop-in compatible with many existing Arria 10 SX carrier designs.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E2F29I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048E2F29I1HG | 10AS048E2F29E2LG | 10AS048E2F29E2SG | 10AS048E2F29E1HG | 10AS048E1F29I1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-pin FC-FBGA (F29, 29x29 mm) | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | -2 | -1 | -2 | -2 | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Parametric Match to This Part | 100% (baseline) | 90% | 90% | 90% | 80% | 80% |
Key Differentiators
- Highest speed grade available in the 10AS048 F29 family (vs 10AS048E2F29I1HG (E1))
- Industrial -40C to +100C temperature screening (vs 10AS048E2F29E2LG (E temperature))
- Full HPS + 480K-LE SoC FPGA integration (vs 10AS048E2F29I1HG)
Design Notes
The Arria 10 SX core rail is 0.9 V nominal and can transient-load into the 20-40 A range when the FPGA fabric toggles high-utilization DSP blocks. Use a multi-phase buck regulator (e.g. TPS53681 or LTC3877) with at least 4 phases and place 4-6 x 22 uF polymer bulk capacitors plus 0.1 uF / 1 nF high-frequency ceramics within 100 mils of the BGA core power balls. Ensure the regulator's per-phase inductor saturates above the worst-case peak current; the 0.9 V rail droop during GHRD burst writes must stay inside +/- 3% for HPS reset to remain asserted.
The 780-pin FC-FBGA exposes the die through internal thermal vias. For industrial-temperature deployments, attach a heat spreader or low-profile heat sink with thermal interface material of <= 0.2 C/W. At -2 speed grade and >85% LUT utilization, design-time junction-to-ambient thermal resistance should target <= 1.5 C/W to keep Tj under 100C at 100C ambient. Derate by 10% margin for altitude derating above 15,000 ft in avionics enclosures.
Use a 1.0 mm pitch BGA PCB land pattern with via-in-pad filled and capped per IPC-7093. Match all differential pairs (transceiver lanes, HPS DDR3/DDR4) to a 100 ohm +/-10% differential impedance with intra-pair skew < 1.5 ps. Length-match the HPS DDR4 byte lanes to within 5 mils and the transceiver TX/RX pairs to within 0.05 mm to avoid bit-error-rate degradation above 10 Gbps.
Do not populate HPS boot mode strapping resistors inconsistently - the HPS boots from QSPI, NAND, SD, or eMMC based on boot pin sampling at cold-boot. If the QSPI flash is left disconnected, the HPS may stall and appear 'dead' even though the FPGA fabric loads correctly. Also confirm the FPGA configuration source matches the Quartus Programming File Generator output (.sof + .jic for ASx4 configuration). Mixed pull-ups/pull-downs on CFG pins cause intermittent configuration failure.
Compliance Information
RoHS compliance and lead-free finish confirmed per the Intel/Altera ordering page for 10AS048E2F29I2LG. REACH, halogen-free, and conflict-minerals status require the device-specific Material Declaration (MDDS) from Intel; not present in the verified web data.
