10AS057K2F35E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
N.º da peça: 10AS057K2F35E1HG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2485 | $2.485,00 |
| 10 | $2358 | $23.580,00 |
| 100 | $2195 | $219.500,00 |
| 250 | $2085 | $521.250,00 |
| 500 | $1995 | $997.500,00 |
10AS057K2F35E1HG Visão geral
A SoC FPGA (System-on-Chip FPGA) is an integrated device that combines a programmable FPGA fabric with a hard processor subsystem (typically ARM Cortex-A cores) on a single die. The Arria 10 SX SoC FPGA is a heterogeneous computing platform that places the FPGA logic and the HPS in separate but tightly coupled power and clock domains, connected by a high-bandwidth coherent interconnect. In the broader taxonomy, this device sits within FPGA & CPLD -> SoC FPGA -> Arria 10 family -> Intel programmable logic devices. The hard processor cores execute real-time operating systems (RTOS) or Linux, while the FPGA fabric handles high-throughput data-plane workloads such as DSP, video processing, and protocol bridging.
Key features of the 10AS057K2F35E1HG include 570K logic elements, approximately 29.4 Mbits of embedded memory (M20K + MLAB), 1,566 18x19 multipliers, 24 transceivers at up to 17.4 Gbps, hard PCIe Gen3 and Gen2 IP blocks, and the dual ARM Cortex-A9 MPCore with CoreSight running up to 1.5 GHz. The device also integrates a feature-rich HPS with DDR4/DDR3/LPDDR3 controllers, USB 3.0, Gigabit Ethernet, and UART/SPI/I2C peripherals. The 1152-ball FC-BGA delivers high I/O density for parallel memory and high-speed serial interfaces.
Architecturally, the 20 nm Arria 10 device combines a logic fabric optimized for DSP and transceiver-based designs, with variable-precision DSP blocks supporting fixed-point and floating-point arithmetic. The HPS is implemented in a separate voltage and clock domain with its own dedicated PLL, allowing the FPGA and processor subsystems to operate independently for power optimization. Compared to previous Arria V / Cyclone V generations, Arria 10 SX doubles the logic capacity at the same power envelope and adds 14.1 Gbps / 17.4 Gbps transceivers, enabling 100G and emerging 400G interface designs.
Typical applications include wireless baseband processing, radar and electronic warfare, military signal intelligence, broadcast video and image processing, medical imaging systems, industrial motor control with HMI, automotive ADAS prototyping, high-speed test and measurement, and PCIe accelerator cards. The integrated HPS is well-suited for protocol-stack processing (e.g., Ethernet switching, PCIe endpoint stack), while the FPGA fabric accelerates the data plane (FFT, FIR, encoding/decoding, encryption).
Alternativas drop-in para 10AS057K2F35E1HG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS057K2F35E1HG (mesmo formato e footprint) — diferindo em Speed Grade, Package, Logic Elements, Operating Temperature, Transceivers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS057K2F35I1HG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3820 / unidade
Ver ficha técnica →10AS057K1F35E1HG
✅ Drop-In✓ Em estoque
$1280 / unidade
Ver ficha técnica →10AS057K3F35E1HG
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10AS066K2F35E1HG
✅ Drop-In✓ Em estoque
$3290 / unidade
Ver ficha técnica →10AS048K2F35E1HG
✅ Drop-In✓ Em estoque
$2650 / unidade
Ver ficha técnica →10AS057K2F35E1HG Classificações máximas e características elétricas
| Family | Arria 10 SX |
| Logic Elements | 570,000 |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) |
| DSP Blocks (18x19 Multipliers) | 1,566 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Transceivers | 24 (up to 17.4 Gbps) |
| PCIe Hard IP | Gen2/Gen3 x8 |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 |
| Encapsulamento | 1152-ball FC-BGA (F35), 35x35 mm |
| Process Technology | 20 nm TSMC |
| Operating Temperature Grade | Industrial |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10AS057K2F35E1HG 1152-ball fc-bga (f35), 35x35 mm
Configuração de pinos para 10AS057K2F35E1HG (pacote 1152-ball fc-bga (f35), 35x35 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS057K2F35E1HG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS057K2F35E1HG é adequado para 6 aplicaçãos: Wireless Baseband Processing, Radar and Electronic Warfare, Broadcast Video Processing and Encoding, Medical Imaging Systems, Industrial Motor Control and HMI, PCIe Accelerator Cards.
Wireless Baseband Processing
The 10AS057K2F35E1HG is well-suited for 4G LTE and 5G NR wireless baseband units where multiple antenna streams require high-throughput DSP acceleration. The 1,566 18x19 multipliers support massive FFT, channel estimation, and MIMO decoding at sample rates above 245.76 MHz, while the dual ARM Cortex-A9 cores at 1.5 GHz run the MAC scheduler and protocol stack with Linux. The 24 transceivers at up to 17.4 Gbps aggregate CPRI/OBSAI links from remote radio heads, and the hard PCIe Gen3 x8 IP links to a host SoC for upper-layer processing. Compared to a DSP-only architecture, the integrated HPS eliminates an external processor and reduces BOM by ~$30 per unit.
Recomendado
Radar and Electronic Warfare
The 10AS057K2F35E1HG's 570K logic elements and 1,566 DSP blocks handle multi-channel phased-array radar signal processing, including pulse compression, MTI filtering, and CFAR detection in real time. The 24 transceivers at 17.4 Gbps accept digitized RF directly from high-speed ADCs, and the dual ARM Cortex-A9 cores run the tracker, classifier, and threat-database lookup. Hard PCIe Gen3 x8 enables host-side display and recording. For phased-array systems with more channels, the pin-compatible 10AS066K2F35E1HG provides 660K logic elements without PCB redesign. Industrial temperature grade options (10AS057K2F35I1HG) support harsh environments.
Recomendado
Broadcast Video Processing and Encoding
The 10AS057K2F35E1HG accelerates HEVC/H.265 and AVC/H.264 encoding/decoding for broadcast contribution feeds, video-over-IP gateways, and live production switchers. The 570K logic elements and 1,566 multipliers handle 4K60p encode at low latency, while the 24 transceivers at 17.4 Gbps aggregate SMPTE ST 2110 (SMPTE 2022-5/6) IP streams and 12G-SDI interfaces. The dual ARM Cortex-A9 MPCore runs the controller software and NMOS IS-04/IS-05 discovery stack. Compared to ASIC encoders, the SoC FPGA adds multi-format flexibility for emerging codecs and HDR pipelines without hardware respin.
Recomendado
Medical Imaging Systems
The 10AS057K2F35E1HG serves CT, MRI, ultrasound, and digital X-ray imaging back-ends where FPGA-accelerated reconstruction (back-projection, FBP, iterative reconstruction) and ARM-based patient-data handling must coexist on one device. The 29.4 Mbits of embedded memory (M20K + MLAB) buffers large image frames, while the 1,566 DSP blocks accelerate 2D/3D FFT and convolution at line rates. The dual ARM Cortex-A9 cores run the DICOM stack, user interface, and image archive transfers over Gigabit Ethernet. Industrial-temperature and long-lifecycle support make it suitable for IEC 62304-compliant medical device designs.
Recomendado
Industrial Motor Control and HMI
The 10AS057K2F35E1HG combines high-resolution PWM generation, encoder feedback decoding, and field-oriented control (FOC) algorithms in the FPGA fabric with the ARM Cortex-A9 cores running the HMI stack (Qt/Linux) and EtherCAT/PROFINET master. The 24 transceivers support industrial Ethernet protocols, while 29.4 Mbits of embedded memory handle multi-axis trajectory buffers. Compared to a microcontroller-plus-FPGA discrete design, the SoC FPGA reduces board area by ~40% and BOM cost by ~$25 in multi-axis servo drives. Industrial temperature variants are available with the I-grade ordering code.
Recomendado
PCIe Accelerator Cards
The 10AS057K2F35E1HG fits standard PCIe Gen3 x8 add-in cards for datacenter acceleration, offloading workloads such as compression, encryption, database query, and machine-learning inference from the host CPU. The hard PCIe Gen3 x8 IP delivers up to 8 GB/s of host bandwidth, the 24 transceivers provide expansion to external memory or coprocessors, and the dual ARM Cortex-A9 cores manage the device side of the driver stack. Compared to GPU-based accelerators, the SoC FPGA delivers deterministic latency and lower power for streaming workloads. The 570K LE margin supports complex on-card data reduction and DMA engines.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS057K2F35E1HG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS057K2F35I1HG | 10AS057K1F35E1HG | 10AS066K2F35E1HG | 10AS048K2F35E1HG |
|---|---|---|---|---|---|
| Package | 1152-ball FC-BGA (F35, 35x35 mm) | 1152-ball FC-BGA (F35, 35x35 mm) | 1152-ball FC-BGA (F35, 35x35 mm) | 1152-ball FC-BGA (F35, 35x35 mm) | 1152-ball FC-BGA (F35, 35x35 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 570,000 | 570,000 | 570,000 | 660,000 | 480,000 |
| Embedded Memory | 29.4 Mbits | 29.4 Mbits | 29.4 Mbits | 32.6 Mbits | 24.8 Mbits |
| DSP Blocks (18x19) | 1,566 | 1,566 | 1,566 | 1,879 | 1,318 |
| HPS Cores / Frequency | Dual ARM Cortex-A9 / 1.5 GHz | Dual ARM Cortex-A9 / 1.5 GHz | Dual ARM Cortex-A9 / 1.5 GHz | Dual ARM Cortex-A9 / 1.5 GHz | Dual ARM Cortex-A9 / 1.5 GHz |
| Transceivers / Max Rate | 24 / 17.4 Gbps | 24 / 17.4 Gbps | 24 / 17.4 Gbps | 24 / 17.4 Gbps | 24 / 17.4 Gbps |
| Hard PCIe IP | Gen2/Gen3 x8 | Gen2/Gen3 x8 | Gen2/Gen3 x8 | Gen2/Gen3 x8 | Gen2/Gen3 x8 |
| Temperature Grade | Extended (-40C to +85C) | Industrial (-40C to +100C) | Extended (-40C to +85C) | Extended (-40C to +85C) | Extended (-40C to +85C) |
Principais diferenciais
- Higher logic capacity for compute-intensive applications (vs 10AS048K2F35E1HG)
- Cost-optimized lower-capacity drop-in (vs 10AS066K2F35E1HG)
- Higher Fmax in same footprint (vs 10AS057K1F35E1HG)
Notas de projeto
Estimated: At full utilization with 24 transceivers at 12.5 Gbps and the dual ARM Cortex-A9 cores at 1.5 GHz, the 10AS057K2F35E1HG can dissipate up to ~25 W. The 1152-ball FC-BGA (F35) requires a high-performance thermal interface (TIM) and a heatsink with at least 0.5 C/W junction-to-ambient resistance to keep Tj below 100C in a typical enclosure with 5 C/W airflow. Use the Arria 10 PowerPlay early-power estimator in Quartus Prime to refine these figures for your design's actual toggle rate, logic utilization, and HPS workload.
Use at least an 8-layer PCB with the F35 footprint. The 1152-ball FC-BGA at 1.0 mm pitch demands laser-drilled microvias, mixed-dielectric stackup, and matched-length impedance control for all 24 transceiver lanes. Each transceiver pair needs 85-ohm differential routing with loss-budget analysis (typically <6 dB at 12.5 GHz Nyquist). Reference Intel's Arria 10 F35 PCB Design Guidelines and the High-Speed Serial Interface Design Guidelines for stackup and via-pattern recommendations.
Do not confuse the F35 package (1152-ball FC-BGA, 35x35 mm) with the F34 (780-ball FC-BGA, 31x31 mm) or F29 (780-ball, 29x29 mm). The 'F35' code in the MPN must match your PCB land pattern. A common pitfall is attempting to migrate a F35 design to F29 for cost savings — the F29 is a smaller BGA with fewer transceivers and reduced GPIO, and the migration is not drop-in. Always validate pin compatibility using the Arria 10 Pin-Out Files before re-laying out a board.
Decouple the FPGA core and HPS power domains separately. Arria 10 SX places the HPS in an independent voltage and clock domain from the FPGA fabric; each domain requires its own decoupling network of 0.1 uF + 10 uF + 47 uF capacitors within 5 mm of the BGA balls. Place the HPS DDR4/DDR3 interface on dedicated layers with matched-length routing, and isolate the PCIe Gen3 clock from the HPS reference clock with separate guard traces to avoid jitter coupling.
Informações de conformidade
RoHS and REACH compliance per Intel Arria 10 SX product family documentation. AEC-Q100 not applicable — this is an industrial / commercial grade FPGA, not an automotive-qualified part. Contact Intel for automotive-grade Arria 10 SX variants (typically with -A suffix or different ordering code).
