10CL016YM164A7G - Cyclone 10 LP FPGA 16K LE | Intel | TFBGA-164
N.º da peça: 10CL016YM164A7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $26.5 | $26,50 |
| 10 | $23.85 | $238,50 |
| 100 | $21.2 | $2.120,00 |
| 500 | $18.9 | $9.450,00 |
| 1.000 | $16.75 | $16.750,00 |
10CL016YM164A7G Visão geral
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as memory, multipliers, PLLs, and I/O serializers. Cyclone 10 LP sits within Intel's low-power FPGA portfolio, positioned between microcontrollers and high-performance FPGAs: it offers far greater logic density and parallel throughput than an MCU while consuming much less power than a Stratix-class device.
Key features include 56 embedded 18x18 multipliers (224 9x9 multipliers equivalent), 4 general-purpose PLLs, and configuration support via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. The device operates from a 1.0 V core supply with 1.2/1.5/1.8/2.5/3.3 V-capable I/O banks. Typical static power is below 30 mW at 25 C with no I/O activity.
The Cyclone 10 LP architecture combines look-up-table (LUT)-based logic with distributed M9K memory blocks, dedicated DSP blocks for multiply-accumulate operations, and hard PCIe Gen1 (x1) controllers. This integration lets a single device replace glue logic, DSP, and interface functions on the same die, reducing board area and BOM cost.
Typical applications include industrial motor control, video bridging and image processing, I/O expansion for embedded processors, low-cost PCIe endpoints, and portable/handheld instrumentation. The TFBGA-164 package is optimized for space-constrained designs where BGA robustness and SMT manufacturability are required.
When designing with this FPGA, carefully review the Intel Cyclone 10 LP device handbook for I/O bank grouping, configuration scheme selection, and power-rail sequencing. Quartus Prime Lite Edition supports the 10CL016 device family at no charge.
This page synthesizes Intel datasheet parameters, current distributor stock, and drop-in compatible Cyclone 10 LP variants so that engineers can rapidly select the right FPGA without leaving the XAIPART catalog.
Alternativas drop-in para 10CL016YM164A7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL016YM164A7G (mesmo formato e footprint) — diferindo em Package, Embedded Memory, PLLs, MSL Level, Core Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL010YM164A7G
✅ Drop-In✓ Em estoque
$21.1 / unidade
Ver ficha técnica →10CL010YM164C6G
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →10CL010YM164C8G
✅ Drop-In✓ Em estoque
$12.1 / unidade
Ver ficha técnica →10CL010YM164I7G
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →10CL016YM164I7G
✅ Drop-In✓ Em estoque
$12.95 / unidade
Ver ficha técnica →10CL016YM164C8G
✅ Drop-In✓ Em estoque
$17.1 / unidade
Ver ficha técnica →10CL016YM164C6G
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →10CL016YM164A7G Classificações máximas e características elétricas
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Embedded Memory Bits | 516,096 bits |
| Embedded Memory Blocks | M9K (total 56) |
| Embedded 18x18 Multipliers | 56 |
| User I/Os | 87 |
| General-Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.0 V (typical) |
| Encapsulamento | 164-TFBGA (M164) |
| Tipo de montagem | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG |
| Nível MSL | 3 (168 Hours) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10CL016YM164A7G 164-tfbga (m164)
Configuração de pinos para 10CL016YM164A7G (pacote 164-tfbga (m164)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10CL016YM164A7G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10CL016YM164A7G é adequado para 6 aplicaçãos: Industrial Motor Control, Video Bridge and Image Processing, Embedded I/O Expansion and Bridge, Low-Cost PCIe Endpoint, Portable Test and Measurement Instrumentation, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10CL016YM164A7G is well suited to multi-axis industrial motor control where deterministic parallel DSP throughput and flexible I/O matter more than raw clock speed. The 56 dedicated 18x18 multipliers deliver the multiply-accumulate rate needed for field-oriented control (FOC) of PMSM or BLDC motors, while the four PLLs generate the precisely phased carrier frequencies for PWM outputs. With 87 user I/Os in the compact TFBGA-164, the device can drive multiple half-bridges, encoder interfaces, and isolation barriers from a single chip. Quartus Prime Lite Edition supports the design free of charge, reducing BOM cost for volume industrial drives.
Recomendado
Video Bridge and Image Processing
For video format conversion, scaling, or image preprocessing pipelines, the 10CL016YM164A7G offers 56 18x18 multipliers and 516 Kbits of M9K memory - enough for a small FIR-filter bank, color-space conversion, or edge-detection block operating on a single video frame at a time. The TFBGA-164 footprint keeps the FPGA close to the video AFE and HDMI/CPI serializer, minimizing trace length for high-speed parallel video buses. Designers targeting portable imaging products benefit from Cyclone 10 LP's sub-30 mW static power, which is critical for battery-powered video capture and inspection equipment.
Recomendado
Embedded I/O Expansion and Bridge
When an embedded processor needs additional I/O types (SPI-to-I2S bridges, UART multiplexing, GPIO expansion, custom parallel buses), the 10CL016YM164A7G is a flexible drop-in companion. Its 15,408 logic elements and 56 multipliers support soft-core peripherals and protocol conversion running concurrently with the host CPU, while the 4 PLLs let designers retime any incoming clock to match the processor's local bus. The TFBGA-164 footprint and Intel Quartus Prime Lite support keep both PCB complexity and tool cost low for volume mid-range embedded products.
Recomendado
Low-Cost PCIe Endpoint
The 10CL016YM164A7G integrates hard PCIe Gen1 (x1) controllers, enabling low-cost PCIe endpoint designs without licensing external PHY IP. With 15,408 logic elements and 56 multipliers, the device can implement a custom DMA engine, register interface, or protocol acceleration layer on top of the hard PCIe block. The TFBGA-164 footprint is well suited to add-in card and mother-daughter board topologies, and Quartus Prime Standard Edition provides the PCIe Hard IP reference design ready to compile.
Recomendado
Portable Test and Measurement Instrumentation
Handheld oscilloscopes, logic analyzers, and field test instruments benefit from the 10CL016YM164A7G's combination of low static power (sub-30 mW typical), 4 PLLs for flexible clock conditioning, and 56 dedicated multipliers for real-time DSP such as FFT or FIR filtering. The 87 user I/Os of the TFBGA-164 are sufficient for multi-channel analog front-end interfacing and high-speed ADC/DAC LVDS links. Battery life improves directly from the Cyclone 10 LP low-power architecture compared to higher-density FPGA families, which is critical for portable test gear.
Recomendado
IoT Edge Sensor Aggregation
The 10CL016YM164A7G can aggregate multiple low-speed sensor buses (I2C, SPI, UART, GPIO) into a single high-speed uplink such as Ethernet or PCIe, while running edge analytics on the 56 18x18 multipliers. Its sub-30 mW static power suits always-on industrial IoT gateways, and the 4 PLLs simplify clock fan-out to multiple PHY chips. The TFBGA-164 footprint fits comfortably on credit-card-sized gateway PCBs and supports standard SMT assembly lines. Quartus Prime Lite enables design entry at zero software cost for high-volume IoT products.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL016YM164A7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL010YM164A7G | 10CL010YM164C6G | 10CL016YM164I7G | 10CL016YM164C8G | 10CL016YM164C6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TFBGA-164 (M164) | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same |
| Logic Elements | 15,408 | 10,320 | 10,320 | 15,408 | 15,408 | 15,408 |
| Embedded Memory (bits) | 516,096 | 423,936 | 423,936 | 516,096 | 516,096 | 516,096 |
| 18x18 Multipliers | 56 | 56 | 56 | 56 | 56 | 56 |
| User I/Os | 87 | 87 | 87 | 87 | 87 | 87 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
Principais diferenciais
- 15,408 logic elements with 56 multipliers in the smallest BGA option (vs 10CL006YU256A7G)
- Pin-compatible scaling from 10K to 16K LE without PCB changes (vs 10CL010YM164A7G)
- Hard PCIe Gen1 controller integrated on-chip (vs 10CL016YE144A7G)
Notas de projeto
The TFBGA-164 (M164) package requires fan-out via microvias or via-in-pad if a 4-layer or denser stackup is used. Place at least one full ground plane directly under the BGA and stitch it with a via array pitched no more than 5 mm apart to provide a low-impedance return path for high-speed LVDS pairs and clock nets. Follow Intel's recommended PCB layout guidelines in the Cyclone 10 LP Device Handbook for layer stackup, decoupling, and BGA escape routing.
Decouple each Cyclone 10 LP power rail (VCCINT, VCCA, VCCIO per bank, VCCPD) with at least one bulk 100 uF tantalum or polymer cap plus 10 nF and 100 nF ceramic caps placed within 100 mils of the corresponding balls. Estimate: at maximum operating junction, total VCCINT current scales with toggle rate; using the Intel Early Power Estimator (EPE) spreadsheet before schematic freeze is recommended to size rails and avoid last-minute re-spin.
Do not assume that all Cyclone 10 LP devices in the same package are pin-for-pin compatible across logic densities - some signal balls are reserved or repurposed between 10CL006/010/016. Cross-check the chosen OPN's pin connection guidelines file against the target PCB footprint. Also verify that the configuration mode (AS/PS/FPP/JTAG) selected in Quartus matches the actual boot mode pins tied on the board - mismatches here are a leading cause of first-board bring-up failures.
Estimated: at 1.0 V VCCINT and a typical 50% toggle rate in a TFBGA-164, junction-to-ambient thermal resistance (theta_JA) is roughly 20-25 C/W on a 4-layer JEDEC test board. Compute T_J = T_A + (VCCINT * I_CCINT * theta_JA) using the EPE spreadsheet, and provide at least 4 thermal vias in the BGA's central thermal pad region to keep T_J below 100 C for industrial-grade operation.
Informações de conformidade
RoHS compliant and lead-free per Intel product page. Operating temperature grade is not specified in the provided web data - industrial variant 10CL016YM164I7G is recommended when -40C to +100C operation is required.
