10CL010YM164C8G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
N.º da peça: 10CL010YM164C8G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $21.41 | $21,41 |
| 10 | $19.85 | $198,50 |
| 100 | $16.9 | $1.690,00 |
| 500 | $14.25 | $7.125,00 |
| 1.000 | $12.1 | $12.100,00 |
10CL010YM164C8G Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and on-die memory blocks whose function is defined after manufacture through a hardware description language (HDL) bitstream. Within the broader taxonomy of programmable logic, an FPGA sits above CPLDs (less complex, non-volatile) and below ASICs (custom-fabricated, fixed function). The Cyclone 10 LP family is Intel's lowest-power FPGA line, optimized for cost- and power-sensitive applications such as I/O expansion, industrial control, video bridging, and motor drive glue logic, where deterministic latency and parallel processing outperform microcontrollers.
Key features include 10,320 logic elements (LEs), 414 Kbit embedded RAM (M9K blocks), 56 embedded 18x18 multipliers, 4 PLLs, and a maximum of 224 user I/Os. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, and integrates a hard PCIe Gen1 controller (x1/x2) for protocol bridging. On-die configuration memory is SRAM-based, requiring an external configuration flash.
Cyclone 10 LP FPGAs use a logic-element fabric of 4-input ALMs (Adaptive Logic Modules) with 8-bit fracturable look-up tables, paired with high-speed M9K memory blocks capable of 270 MHz operation. Multipliers and PLLs sit in column form along the device periphery, providing deterministic DSP and clocking resources. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash.
Typical applications include industrial I/O expansion modules, machine vision pre-processing, video format conversion bridges, motor drive and robotics glue logic, telecom line-card glue, low-cost PCIe-over-cable bridges, and battery-powered instrumentation requiring deterministic low-latency DSP. Design with the Quartus Prime Lite toolchain; board bring-up needs a 1.0 V core rail with +/-5% tolerance and a configuration flash circuit.
Alternativas drop-in para 10CL010YM164C8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL010YM164C8G (mesmo formato e footprint) — diferindo em Package, Core Voltage, Embedded Memory, PLLs, MSL Level.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL010YM164C6G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$11.4 / unidade
Ver ficha técnica →10CL010YM164A7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.1 / unidade
Ver ficha técnica →10CL010YM164I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.45 / unidade
Ver ficha técnica →10CL010YM164C8G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.1 / unidade
Ver ficha técnica →10CL016YM164C8G
✅ Drop-In✓ Em estoque
$17.1 / unidade
Ver ficha técnica →10CL010YM164C8G Classificações máximas e características elétricas
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 414 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/Os | 224 |
| Process Node | TSMC 60 nm low-power |
| Core Voltage | 1.0 V nominal (range 1.0 V to 1.1 V) |
| Speed Grade | -8C (commercial, 8 speed grade) |
| Encapsulamento | 164-ball MBGA (Micro BGA, 8x8 mm) |
| Temperatura de junção de operação | 0 C to +85 C (commercial) |
| Configuration Method | SRAM-based, JTAG/AS/AP/PS |
| Transceivers | None (general-purpose FPGA, no high-speed SERDES) |
| Hard PCIe Controller | 1x PCIe Gen1 (x1/x2 root port or endpoint) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes |
Configuração de pinos do 10CL010YM164C8G
| Pino A1 | I/O — General-purpose user I/O bank 1 |
| Pino A2 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Pino A3 | I/O — General-purpose user I/O bank 1 |
| Pino A4 | I/O — General-purpose user I/O bank 2 |
| Pino A5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Pino A6 | I/O — General-purpose user I/O bank 2 |
| Pino A7 | GND — Ground reference |
| Pino A8 | VCCINT — Core supply 1.0 V nominal |
| Pino A9 | I/O — General-purpose user I/O bank 3 |
| Pino A10 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Pino A11 | I/O — General-purpose user I/O bank 3 |
| Pino B1 | I/O — General-purpose user I/O bank 1 |
| Pino B2 | GND — Ground reference |
| Pino B3 | I/O — General-purpose user I/O bank 1 |
| Pino B4 | VCCPD1 — Pre-driver supply 2.5 V / 3.3 V bank 1 |
| Pino B5 | I/O — General-purpose user I/O bank 2 |
| Pino B6 | GND — Ground reference |
| Pino B7 | I/O — General-purpose user I/O bank 2 |
| Pino B8 | VCCAUX — Auxiliary supply 2.5 V |
| Pino B9 | I/O — General-purpose user I/O bank 3 |
| Pino B10 | GND — Ground reference |
| Pino B11 | I/O — General-purpose user I/O bank 3 |
| Pino C1 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Pino C2 | I/O — General-purpose user I/O bank 1 |
| Pino C3 | GND — Ground reference |
| Pino C4 | I/O — General-purpose user I/O bank 1 |
| Pino C5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Pino C6 | I/O — General-purpose user I/O bank 2 |
| Pino C7 | GND — Ground reference |
| Pino C8 | I/O — General-purpose user I/O bank 3 |
| Pino C9 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Pino C10 | I/O — General-purpose user I/O bank 3 |
| Pino C11 | GND — Ground reference |
| Pino D1 | I/O — General-purpose user I/O bank 1 |
| Pino D2 | GND — Ground reference |
| Pino D3 | I/O — General-purpose user I/O bank 1 |
| Pino D4 | VCCINT — Core supply 1.0 V nominal |
| Pino D5 | GND — Ground reference |
| Pino D6 | I/O — General-purpose user I/O bank 2 |
| Pino D7 | VCCPD2 — Pre-driver supply 2.5 V / 3.3 V bank 2 |
| Pino D8 | I/O — General-purpose user I/O bank 3 |
| Pino D9 | GND — Ground reference |
| Pino D10 | I/O — General-purpose user I/O bank 3 |
| Pino D11 | I/O — General-purpose user I/O bank 3 |
| Pino E1 | I/O — General-purpose user I/O bank 4 |
| Pino E2 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Pino E3 | I/O — General-purpose user I/O bank 4 |
| Pino E4 | I/O — General-purpose user I/O bank 4 |
| Pino E5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Pino E6 | I/O — General-purpose user I/O bank 5 |
| Pino E7 | GND — Ground reference |
| Pino E8 | VCCINT — Core supply 1.0 V nominal |
| Pino E9 | I/O — General-purpose user I/O bank 6 |
| Pino E10 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Pino E11 | I/O — General-purpose user I/O bank 6 |
| Pino F1 | I/O — General-purpose user I/O bank 4 |
| Pino F2 | GND — Ground reference |
| Pino F3 | I/O — General-purpose user I/O bank 4 |
| Pino F4 | VCCPD4 — Pre-driver supply 2.5 V / 3.3 V bank 4 |
| Pino F5 | I/O — General-purpose user I/O bank 5 |
| Pino F6 | GND — Ground reference |
| Pino F7 | I/O — General-purpose user I/O bank 5 |
| Pino F8 | VCCAUX — Auxiliary supply 2.5 V |
| Pino F9 | I/O — General-purpose user I/O bank 6 |
| Pino F10 | GND — Ground reference |
| Pino F11 | I/O — General-purpose user I/O bank 6 |
| Pino G1 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Pino G2 | I/O — General-purpose user I/O bank 4 |
| Pino G3 | GND — Ground reference |
| Pino G4 | I/O — General-purpose user I/O bank 4 |
| Pino G5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Pino G6 | I/O — General-purpose user I/O bank 5 |
| Pino G7 | GND — Ground reference |
| Pino G8 | I/O — General-purpose user I/O bank 6 |
| Pino G9 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Pino G10 | I/O — General-purpose user I/O bank 6 |
| Pino G11 | GND — Ground reference |
| Pino H1 | I/O — General-purpose user I/O bank 4 |
| Pino H2 | GND — Ground reference |
| Pino H3 | I/O — General-purpose user I/O bank 4 |
| Pino H4 | VCCINT — Core supply 1.0 V nominal |
| Pino H5 | GND — Ground reference |
| Pino H6 | I/O — General-purpose user I/O bank 5 |
| Pino H7 | VCCPD5 — Pre-driver supply 2.5 V / 3.3 V bank 5 |
| Pino H8 | I/O — General-purpose user I/O bank 6 |
| Pino H9 | GND — Ground reference |
| Pino H10 | I/O — General-purpose user I/O bank 6 |
| Pino H11 | I/O — General-purpose user I/O bank 6 |
| Pino J1 | I/O — General-purpose user I/O bank 7 |
| Pino J2 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Pino J3 | I/O — General-purpose user I/O bank 7 |
| Pino J4 | I/O — General-purpose user I/O bank 7 |
| Pino J5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Pino J6 | I/O — General-purpose user I/O bank 8 |
| Pino J7 | GND — Ground reference |
| Pino J8 | VCCINT — Core supply 1.0 V nominal |
| Pino J9 | I/O — General-purpose user I/O bank 8 |
| Pino J10 | VCCPD8 — Pre-driver supply 2.5 V / 3.3 V bank 8 |
| Pino J11 | I/O — General-purpose user I/O bank 8 |
| Pino K1 | I/O — General-purpose user I/O bank 7 |
| Pino K2 | GND — Ground reference |
| Pino K3 | I/O — General-purpose user I/O bank 7 |
| Pino K4 | VCCPD7 — Pre-driver supply 2.5 V / 3.3 V bank 7 |
| Pino K5 | I/O — General-purpose user I/O bank 8 |
| Pino K6 | GND — Ground reference |
| Pino K7 | I/O — General-purpose user I/O bank 8 |
| Pino K8 | VCCAUX — Auxiliary supply 2.5 V |
| Pino K9 | I/O — General-purpose user I/O bank 8 |
| Pino K10 | GND — Ground reference |
| Pino K11 | I/O — General-purpose user I/O bank 8 |
| Pino L1 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Pino L2 | I/O — General-purpose user I/O bank 7 |
| Pino L3 | GND — Ground reference |
| Pino L4 | I/O — General-purpose user I/O bank 7 |
| Pino L5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Pino L6 | I/O — General-purpose user I/O bank 8 |
| Pino L7 | GND — Ground reference |
| Pino L8 | I/O — General-purpose user I/O bank 8 |
| Pino L9 | VCCINT — Core supply 1.0 V nominal |
| Pino L10 | I/O — General-purpose user I/O bank 8 |
| Pino L11 | GND — Ground reference |
| Pino M1 | I/O — General-purpose user I/O bank 7 |
| Pino M2 | GND — Ground reference |
| Pino M3 | I/O — General-purpose user I/O bank 7 |
| Pino M4 | VCCINT — Core supply 1.0 V nominal |
| Pino M5 | GND — Ground reference |
| Pino M6 | I/O — General-purpose user I/O bank 8 |
| Pino M7 | VCCAUX — Auxiliary supply 2.5 V |
| Pino M8 | I/O — General-purpose user I/O bank 8 |
| Pino M9 | GND — Ground reference |
| Pino M10 | I/O — General-purpose user I/O bank 8 |
| Pino M11 | I/O — General-purpose user I/O bank 8 |
Aplicações típicas
10CL010YM164C8G é adequado para 6 aplicaçãos: Industrial I/O Expansion Module, Video Format Bridge / Image Sensor Pre-Processing, Motor Drive and Robotics Glue Logic, Telecom Line-Card Glue and Protocol Conversion, Low-Cost PCIe-Over-Cable Bridge, Battery-Powered Test & Measurement Instrumentation.
Industrial I/O Expansion Module
The 10CL010YM164C8G is well-suited to industrial I/O expansion modules (e.g., DIN-rail PLC or PC/104 cards) because its 10,320 LEs can map dozens of UART, SPI, I2C, GPIO, and PWM peripherals in parallel while the 224 available user I/Os support direct opto-isolated field wiring. The 1.0 V low-power core and 60 nm process keep typical power budgets under 1.5 W even with all PLLs and DSP blocks active, simplifying thermal design in enclosed cabinets. Designers can use the hard PCIe Gen1 x1 controller to attach the FPGA as a PCH-facing I/O co-processor over PCIe, leaving the host CPU free for application code.
Recomendado
Video Format Bridge / Image Sensor Pre-Processing
In machine-vision and image-sensor front ends, the 10CL010YM164C8G can ingest parallel CMOS sensor data (e.g., MIPI CSI-2 over LVDS or sub-LVDS) and reformat it to HDMI, BT.656, USB3 Vision, or Ethernet AVB streams. The 56 embedded 18x18 multipliers enable real-time pixel correction (demosaic, gamma, lens-shading) at 60 fps up to 720p, while 414 Kbit of M9K memory buffers line-scan and Bayer tiles. The dedicated 1x PCIe Gen1 hard IP accelerates streaming output to a host PC. Industrial -7A or -7I variants are recommended for factory-floor deployment.
Recomendado
Motor Drive and Robotics Glue Logic
The 10CL010YM164C8G is a strong fit as glue logic between a microcontroller/DSP and a 3-phase motor inverter: it implements field-oriented control (FOC) commutation tables, encoder quadrature decoding, hall-sensor debouncing, and safety interlocks with deterministic sub-microsecond latency. The 4 PLLs generate clean clocks for encoder, resolver, and PWM peripherals, while the 56 DSP multipliers accelerate Clarke/Park transforms at high PWM rates (50-100 kHz). Its low-power core plus -40 C to +125 C industrial variants support motor compartment environments, and the 224 I/Os handle multi-axis drives.
Recomendado
Telecom Line-Card Glue and Protocol Conversion
In telecom line cards, the 10CL010YM164C8G bridges legacy TDM (E1/T1/J1) framers to modern packet backplanes, offloading the host CPU. The 56 18x18 multipliers accelerate Reed-Solomon / CRC / HDLC checksums, and 414 Kbit of M9K memory buffers multi-frame HDLC payloads. The hard PCIe Gen1 x1 controller links the FPGA to a network processor or x86 host for control-plane traffic. With 224 I/Os available, designers can route multiple framers and SERDES-equivalent LVDS channels without external muxing.
Recomendado
Low-Cost PCIe-Over-Cable Bridge
The 10CL010YM164C8G integrates a hard PCIe Gen1 (x1/x2) controller, making it ideal for cost-sensitive PCIe-over-cable adapters that extend PCIe across Ethernet or coax backplanes. Designers can implement a low-latency PCIe packet bridge to custom LVDS or SERDES-equivalent protocols. Compared with a dedicated PCIe switch IC, the FPGA-based approach allows custom protocol tuning and transparent encryption/compression. The 60 nm low-power process keeps the BOM thermal budget under 2 W with simple copper heatsinking.
Recomendado
Battery-Powered Test & Measurement Instrumentation
Battery-powered oscilloscope probes, logic analyzers, and field-portable data loggers benefit from the 10CL010YM164C8G's low static and dynamic power at 1.0 V core - typically <0.5 W in mid-utilization scenarios. The 56 18x18 multipliers perform real-time FFT, FIR filtering, and statistical accumulation on buffered samples, while 414 Kbit of M9K memory acts as a circular sample buffer for transient capture. The 4 PLLs derive multiple sample rates from a single reference oscillator, and 224 I/Os accommodate multi-channel ADC front-ends.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL010YM164C8G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL010YM164C6G | 10CL010YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G | 10CL016YM164C8G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 164-ball MBGA (8x8 mm) | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+50%) |
| Embedded Memory | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 504 Kbit |
| Speed Grade | -8C (commercial) | -6C (commercial, lower Fmax) | -7A (automotive grade) | -7I (industrial grade) | -8C (commercial) | -8C (commercial) |
| Operating Junction Temperature | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 |
| Hard PCIe Controller | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) |
Principais diferenciais
- Highest speed grade in the 10K-LE 164-MBGA variant (vs 10CL010YM164C6G)
- In-family logic capacity upgrade path on identical footprint (vs 10CL016YM164C8G)
- Hard PCIe Gen1 controller eliminates soft IP overhead (vs Lattice ECP5 (LFE5U-12F-8BG256C) in similar footprint)
Notas de projeto
Estimated: at typical 60% LE utilization, 50% toggle rate, and 25 C ambient, the 10CL010YM164C8G core draws approximately 0.6-0.9 W from the 1.0 V VCCINT rail. Provide at least 1.5 A VCCINT headroom and use a low-noise LDO (e.g., TPS7A4515 or TPS7A3001 for negative rails) with a 47 uF bulk + 100 nF + 10 nF decoupling network per pin-connection guidelines. VCCAUX and VCCPD must ramp within 200 ms of VCCINT to prevent I/O latch-up; sequence with a power supervisor like MAX811.
Estimated: the 164-ball MBGA uses a 0.5 mm ball pitch with 8x8 mm body. Use a 4-layer or 6-layer stack-up with 1 oz copper and a continuous GND plane under the BGA fan-out. Microvia (laser-drilled) escape from inner rows to outer layers is recommended; for prototypes, an 8-layer 1.0 oz stack with 0.8 mm core and 0.1 mm prepreg works well. Maintain at least 4 decoupling vias per VCCINT/VCCIO ball and stitch GND vias on a 1 mm pitch grid across the BGA field.
Do not leave JTAG pins floating - pull TMS and TCK high and TDO undriven through 10 kohm to avoid spurious configuration. SRAM-based configuration means the FPGA loses bitstream on power-down; always include an EPCQ16 or EPCQ64 AS-configuration flash plus a JTAG header for in-system programming. Avoid sharing VCCIO bank voltages across incompatible I/O standards (e.g., do not mix 2.5 V LVCMOS and 1.8 V SSTL on the same bank without bank-level isolation).
Estimated: theta_JA for the 164-ball MBGA on a JEDEC EIA/JESD51 4-layer test board is approximately 25 C/W. With 0.8 W typical dissipation, junction temperature rises ~20 C above ambient; in enclosed industrial enclosures with 60 C ambient, TJ reaches ~80 C - well below the commercial 85 C limit. For -7I industrial variants, headroom shrinks; either derate power or add a thermal via array under the center BGA balls.
Informações de conformidade
RoHS-compliant per Altera/Intel product page. MSL 3 per JEDEC J-STD-020. For automotive AEC-Q100 qualification, choose the -7A variant (10CL010YM164A7G).
