10M08SCU169A7G - MAX 10 FPGA, 8K LE, 169-LFBGA, AEC-Q100 | Intel
N.º da peça: 10M08SCU169A7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $37.08 | $37,08 |
| 10 | $33.5 | $335,00 |
| 100 | $28.4 | $2.840,00 |
| 500 | $24.1 | $12.050,00 |
| 1.000 | $19.85 | $19.850,00 |
10M08SCU169A7G Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, DSP blocks, and embedded memory) interconnected by a programmable routing fabric. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically between fixed-function ASICs (application-specific integrated circuits) and general-purpose microcontrollers. MAX 10 FPGAs integrate a dual-configuration flash, analog-to-digital converters (ADCs), and instant-on support, which makes them useful as glue logic, I/O expansion bridges, and small control planes in industrial and automotive systems.
Key features include 8,000 logic elements, 387,072 bits (M9K) of embedded RAM, integrated 12-bit ADCs, on-chip flash for instant-on configuration, and support for LVDS, LVCMOS, SSTL, and other I/O standards. The 169-pin LFBGA package provides 130 user I/O pins with 1.2V core and 3.3V/2.5V/1.8V/1.5V I/O bank operation. The device is built on a 55nm TSMC process and supports commercial, industrial, and automotive temperature grades.
The MAX 10 architecture integrates hard IP blocks such as PLLs, embedded memory blocks (M9K), 18x18 multipliers, and an analog front end with ADC support, allowing single-chip implementation of mixed-signal control functions. The device's flash-based configuration provides instant-on capability without external boot memory, simplifying board design and reducing BOM cost compared with SRAM-based FPGAs.
Typical applications include industrial motor control, automotive body electronics and infotainment bridges, sensor aggregation in IoT edge nodes, factory automation I/O expansion, and portable medical device signal conditioning. The AEC-Q100 qualification makes the 10M08SCU169A7G specifically suited for under-hood and cabin automotive electronics.
When designing with this device, allocate I/O bank voltages carefully to avoid mixing incompatible logic levels, and respect the LFBGA thermal dissipation envelope by providing adequate PCB copper area. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para 10M08SCU169A7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M08SCU169A7G (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Process Technology, Logic Elements (LE), Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M08SCU169C8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M08SCU169I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.85 / unidade
Ver ficha técnica →10M08SAU169A7G
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →10M08SCU169A7P
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M08SCU169I7P
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M08SCU169A7G Classificações máximas e características elétricas
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K) | 387,072 bits (48 blocks) |
| User I/O Count | 130 |
| Encapsulamento | 169-LFBGA (U169, 11x11 mm, 0.5 mm pitch) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| I/O Bank Voltage | 3.3 V / 2.5 V / 1.8 V / 1.5 V |
| On-chip Flash | Dual-configuration flash (instant-on) |
| Integrated ADC | 12-bit, 1 Msps SAR ADC |
| Temperature Grade | Automotive AEC-Q100 Grade 2 (-40C to +105C) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Configuration Memory | Internal flash, no external boot required |
Guia de Configuração de Pinos do 10M08SCU169A7G 169-lfbga (u169, 11x11 mm, 0.5 mm pitch)
Configuração de pinos para 10M08SCU169A7G (pacote 169-lfbga (u169, 11x11 mm, 0.5 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10M08SCU169A7G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10M08SCU169A7G é adequado para 6 aplicaçãos: Automotive Body Electronics, Industrial Motor Control, Sensor Aggregation IoT Gateway, Medical Device Signal Conditioning, I/O Expansion Bridge, Display Controller for Industrial HMI.
Automotive Body Electronics
The 10M08SCU169A7G suits automotive body control modules where AEC-Q100 Grade 2 qualification is required and logic density around 8K LE is sufficient. Its 130 user I/O pins handle multiple LIN/CAN-controlled loads, while the integrated 12-bit ADC samples analog sensor inputs such as temperature and battery voltage. The instant-on dual-configuration flash enables fast wake-up for body domain controllers, and the -40C to +105C operating range covers under-hood and cabin environments. Place decoupling capacitors within 5 mm of each power pin and follow Intel's PCB layout guidelines for BGA fan-out.
Recomendado
Industrial Motor Control
The 10M08SCU169A7G fits industrial motor drive controllers where 8K LE provides enough logic for PWM generation, commutation tables, and protection state machines. Its PLLs derive precise switching frequencies from an external crystal, and the 18x18 multipliers support field-oriented control (FOC) math. The integrated ADC samples DC-bus current and voltage feedback with adequate throughput for closed-loop torque control. Use the -40C to +105C temperature envelope for cabinet-mounted drives and provide thermal vias under the LFBGA thermal pad.
Recomendado
Sensor Aggregation IoT Gateway
The 10M08SCU169A7G aggregates multiple SPI/I2C/UART sensor streams in IoT edge gateways, where the 387,072-bit embedded memory holds packet buffers and protocol state. Its 130 I/O pins connect to numerous sensor peripherals without external bus expanders, and the integrated ADC reads analog environmental sensors. The instant-on flash configuration lets the gateway wake from sleep and be functional within milliseconds, suiting battery-powered sensor nodes. Quartus Prime Lite provides the full toolchain free of charge for development.
Recomendado
Medical Device Signal Conditioning
The 10M08SCU169A7G conditions analog signals in portable medical devices, where the 12-bit on-chip ADC samples bioelectric signals (ECG, EMG, or pulse oximetry) directly. The 8K LE fabric implements digital filters (FIR/IIR) and feature-extraction algorithms without external DSP, lowering BOM cost. The 169-LFBGA package is small enough for handheld enclosures, while the AEC-Q100 automotive grade adds headroom for reliability-sensitive medical designs. Validate IEC 60601 EMI margins when integrating the FPGA near analog front ends.
Recomendado
I/O Expansion Bridge
The 10M08SCU169A7G functions as a versatile I/O expansion bridge that translates between SPI, I2C, parallel, and LVDS interfaces when a processor lacks sufficient native I/O. Its 130 user I/O pins accommodate dozens of peripheral connections, while the embedded memory stores protocol translation tables. The instant-on flash configuration eliminates external boot memory, simplifying PCB layout in space-constrained designs. Use Quartus Prime's IP catalog to drop in UART, SPI, and I2C cores within minutes.
Recomendado
Display Controller for Industrial HMI
The 10M08SCU169A7G drives small-to-medium TFT LCD panels in industrial human-machine interfaces (HMIs), where its LVDS/LVCMOS I/O banks deliver pixel-clock rates up to the MAX 10 specification. The 8K LE fabric fits character generators, touch-panel decoding, and on-screen graphics pipelines. The AEC-Q100 grade suits factory-floor environments with wide temperature swings. Route the LVDS pairs as length-matched differential traces and keep the BGA thermal pad well-grounded for EMI control.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M08SCU169A7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M08SCU169C8G | 10M08SCU169I7G | 10M08SAU169A7G | 10M08SCU169A7P | 10M08SCU169I7P |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-LFBGA (U169) | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 (higher-density die variant) | 8,000 | 8,000 |
| Temperature Grade | Automotive A7 (-40C to +105C) | Commercial C8 (0C to +85C) | Industrial I7 (-40C to +100C) | Automotive A7 (-40C to +105C) | Automotive A7 (-40C to +105C) | Industrial I7 (-40C to +100C) |
| User I/O Count | 130 | 130 | 130 | 130 | 130 | 130 |
| Embedded Memory | 387,072 bits | 387,072 bits | 387,072 bits | 387,072 bits | 387,072 bits | 387,072 bits |
| Integrated ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
| AEC-Q100 Qualified | Yes (Grade 2) | No (commercial) | No (industrial) | Yes (Grade 2) | Yes (Grade 2) | No (industrial) |
Principais diferenciais
- AEC-Q100 automotive qualification with -40C to +105C operating range (vs 10M08SCU169C8G (commercial 0C-85C) and 10M08SCU169I7G (industrial -40C-100C))
- Same U169 footprint across the 10M08SCU169 family (vs Lattice MachXO2 or Xilinx Spartan-6 in 169-ball packages)
- Integrated dual-configuration flash enables instant-on (vs 10M08SAU169A7G (different die variant))
Notas de projeto
The 169-LFBGA package dissipates FPGA dynamic power through the BGA thermal pad. Provide a continuous copper pour on the top layer connected to the thermal balls, plus a 4x4 via array (0.2 mm drill, 0.5 mm pitch) to inner ground planes. Without this, junction temperature can rise 20-30C above ambient at typical 8K LE utilization. For continuous high-utilization workloads above 70% LE, derate the clock frequency or add forced airflow to keep Tj below 125C.
Route LVDS pairs as 100 ohm differential with length matching to within 150 mils and skew to within 50 ps. Place decoupling capacitors (0.1 uF and 10 uF) within 3 mm of each VCCIO and VCCINT ball, using via-in-pad where PCB density demands it. Keep the JTAG and configuration signal traces short and away from switching power converter edges. The BGA requires escape routing on inner layers; plan stackup to include at least 4 layers with two dedicated ground planes.
Do not confuse the 10M08SCU169A7G (8K LE 'S' die, 169-ball) with the 10M08SAU169A7G (higher-density 'A' die, same 169-ball package); both fit the U169 footprint but their bitstreams are not interchangeable. Always verify the OPN suffix matches your procurement spec. Also note that the 'C8' and 'I7' variants are not AEC-Q100 qualified; substituting them into automotive designs will fail qualification audits.
Assign I/O bank voltages carefully: each of the MAX 10 banks supports 1.5V/1.8V/2.5V/3.3V independently, but mixing LVDS and LVCMOS on the same bank is not allowed. Use Quartus Prime's pin planner to visualize bank boundaries before PCB layout finalization. Place clock inputs on dedicated CLK pins to minimize jitter, and route the global reset (nCONFIG, nSTATUS) with a 4.7 kohm pull-up to VCCIO of the configuration bank.
Informações de conformidade
AEC-Q100 Grade 2 automotive qualified per Arrow product listing. RoHS compliant and lead-free per Intel product page. Halogen-free status not explicitly stated in verified data.
