5CSEBA2U23I7SN - Cyclone V SE SoC FPGA, 25K LE, Dual ARM Cortex-A9 | Intel
N.º da peça: 5CSEBA2U23I7SN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $130 | $130,00 |
| 10 | $118 | $1.180,00 |
| 100 | $105 | $10.500,00 |
| 500 | $92 | $46.000,00 |
| 1.000 | $82 | $82.000,00 |
5CSEBA2U23I7SN Visão geral
A System on Chip (SoC) FPGA is an integrated circuit that combines a programmable logic fabric (FPGA) with one or more hard processor cores (such as ARM Cortex-A series) and shared interconnect, allowing designers to partition workloads between software running on the application processor and hardware accelerators implemented in the FPGA fabric. In the broader system hierarchy, an SoC FPGA belongs to programmable logic devices, which sit between general-purpose microcontrollers (software-defined) and ASICs (hardware-fixed but lower unit cost at high volume). The Cyclone V family targets cost- and power-sensitive applications where the flexibility of programmable logic and the deterministic performance of an ARM core are both required.
Key features of the 5CSEBA2U23I7SN include approximately 25K logic elements, embedded M10K memory blocks, variable-precision DSP blocks, phase-locked loops (PLLs), and hard memory controllers. The dual ARM Cortex-A9 cores operate up to 800 MHz with NEON media-processing engine, single- and double-precision floating-point units, and a CoreSight debug and trace subsystem. Integrated peripherals include USB 2.0 OTG, Gigabit Ethernet MAC, DDR3 memory controller, and various serial interfaces. The 672-UBGA package supports industrial temperature range (I7 grade).
The Cyclone V SE architecture separates the HPS (Hard Processor System) and FPGA fabric with high-bandwidth AXI bridges, allowing low-latency communication between the processor subsystem and custom logic. Variable-precision DSP blocks accelerate fixed- and floating-point arithmetic while consuming less power than soft implementations. Hard memory controllers and PHYs simplify board design by eliminating external interface logic.
Typical applications include industrial motor control and machine vision, factory automation controllers, automotive driver assistance (with proper qualification), video surveillance and image processing, software-defined radio front-ends, and embedded computing platforms requiring both deterministic real-time control and rich OS environments such as Linux. The combination of ARM Cortex-A9 cores and FPGA fabric enables high-throughput data pipelines with custom hardware accelerators alongside user-facing applications.
When designing with this device, ensure proper power sequencing of the HPS and FPGA rails, as the HPS must boot before or in coordination with FPGA configuration. Thermal management is important because the 672-UBGA package concentrates significant logic in a small area; adequate PCB copper pour or heatsinking is recommended at high toggle rates. Quartus Prime software is required for design entry, synthesis, place-and-route, and HPS firmware development.
This page synthesizes distributor pricing, drop-in alternatives within the Cyclone V SE family, and practical design considerations that are not found in a single manufacturer datasheet, helping engineers select and source the right SoC FPGA variant for their project.
Alternativas drop-in para 5CSEBA2U23I7SN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA2U23I7SN (mesmo formato e footprint) — diferindo em Logic Elements, Package, Process Technology, HPS Maximum Frequency, HPS Peripherals.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA2U23I7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$124 / unidade
Ver ficha técnica →5CSEBA2U23I7LN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$80.64 / unidade
Ver ficha técnica →5CSEBA2U23C8SN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$69.8 / unidade
Ver ficha técnica →5CSEBA2U23C7SN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13.73 / unidade
Ver ficha técnica →5CSEBA2U23C6N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$88.4 / unidade
Ver ficha técnica →5CSEBA2U23A7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$99.5 / unidade
Ver ficha técnica →5CSEBA2U23I7SN Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25K (approximately) |
| Hard Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 800 MHz |
| Encapsulamento | 672-UBGA (23x23 mm) |
| Pin/Ball Count | 672 |
| I/O Count | 188 (per manufacturer listing) |
| Process Technology | 28 nm low-power (TSMC) |
| Operating Temperature Grade | Industrial (-40C to +100C, I7 suffix) |
| Supply Voltage Maximum | 1.13 V (per partstack listing) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| DSP Blocks | Variable-precision DSP blocks |
| Memory Blocks | M10K embedded memory blocks |
| PLLs | On-chip phase-locked loops |
| HPS Peripherals | USB 2.0 OTG, Gigabit Ethernet, DDR3 controller, SPI, I2C, UART |
Guia de Configuração de Pinos do 5CSEBA2U23I7SN 672-ubga (23x23 mm)
Configuração de pinos para 5CSEBA2U23I7SN (pacote 672-ubga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA2U23I7SN.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA2U23I7SN é adequado para 6 aplicaçãos: Industrial Motor Control, Machine Vision and Image Processing, Factory Automation Controllers, Video Surveillance Systems, Software-Defined Radio Front-End, Embedded Computing Platforms with Linux.
Industrial Motor Control
The 5CSEBA2U23I7SN's combination of dual ARM Cortex-A9 cores at 800 MHz and 25K logic elements is well suited to industrial motor control applications. The HPS runs real-time Linux or RTOS for supervisory control loops, while the FPGA fabric implements high-speed PWM generation, encoder interfaces, and field-oriented control (FOC) algorithms at deterministic rates. Variable-precision DSP blocks accelerate Park/Clarke transforms and PID controllers without consuming HPS CPU cycles. The I7 industrial temperature grade (-40C to +100C) supports factory-floor deployments.
Recomendado
Machine Vision and Image Processing
The 5CSEBA2U23I7SN integrates FPGA fabric optimized for pixel-level processing with an ARM subsystem for higher-level vision algorithms. Image sensors connect via the FPGA fabric through high-speed LVDS or parallel interfaces; preprocessing (filtering, thresholding, edge detection) runs in FPGA logic at line rate while object recognition and decision logic run on the Cortex-A9 cores. The DDR3 controller in the HPS provides bandwidth for frame buffer storage, and the variable-precision DSP blocks accelerate convolution kernels.
Recomendado
Factory Automation Controllers
The 5CSEBA2U23I7SN fits factory automation controllers that require deterministic real-time I/O and a Linux-friendly processor in a single chip. The FPGA fabric implements industrial protocols such as EtherCAT, PROFINET, or Modbus in custom logic, while the ARM cores handle HMI rendering, network management, and PLC-style logic via CODESYS or similar runtimes. Industrial peripherals (USB, Gigabit Ethernet, UART, SPI) integrated in the HPS eliminate external interface ICs and reduce board area.
Recomendado
Video Surveillance Systems
The 5CSEBA2U23I7SN is appropriate for network video recorder (NVR) and IP-camera applications. The FPGA fabric can implement H.264/H.265 encode or decode pipelines offloading the ARM cores, while the Cortex-A9 subsystem runs the camera application stack, web interface, and analytics. The integrated Gigabit Ethernet MAC and USB 2.0 OTG simplify connectivity, and DDR3 controller support enables high-bandwidth frame buffering. Industrial temperature rating supports outdoor enclosure deployments.
Recomendado
Software-Defined Radio Front-End
The 5CSEBA2U23I7SN's FPGA fabric implements digital down/up-conversion, filtering, and modulation/demodulation for SDR front-ends, while the ARM Cortex-A9 cores execute the protocol stack and application layer. Variable-precision DSP blocks handle FFTs and pulse-shaping filters efficiently. Although the Cyclone V SE family lacks high-speed transceivers, baseband processing for narrowband or intermediate-frequency SDR is well within the 25K logic element capability.
Recomendado
Embedded Computing Platforms with Linux
The 5CSEBA2U23I7SN's dual ARM Cortex-A9 cores at up to 800 MHz support embedded Linux distributions such as Yocto, Buildroot, or commercial embedded Linux products. The HPS boots from QSPI flash or SD card and provides standard peripheral interfaces, while the FPGA fabric can be reconfigured at runtime via the FPGA Manager for field-upgradable hardware accelerators. This combination delivers a flexible embedded platform for edge gateways, IoT concentrators, and industrial PCs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA2U23I7SN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA2U23I7N | 5CSEBA2U23I7LN | 5CSEBA2U23C8SN | 5CSEBA2U23C7SN |
|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 25K | 25K | 25K | 25K | 25K |
| Hard Processor System | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I7 (fastest industrial) | I7 | I7 | C8 | C7 |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Principais diferenciais
- Integrated ARM Cortex-A9 HPS eliminates external processor and memory interface ICs (vs 5CEFA9F23I7N (Cyclone V E without HPS))
- Industrial temperature grade without speed-grade compromise (vs 5CSEBA2U23C8SN (commercial grade))
- Long-life-cycle support for embedded industrial programs (vs Consumer-grade FPGAs from competing vendors)
Notas de projeto
The Cyclone V SE SoC FPGA requires multiple power rails for the HPS, FPGA fabric, transceivers, and I/O banks. A typical power tree includes 0.9V core, 1.1V for HPS periphery, 1.5V/1.8V/2.5V/3.3V for I/O, and DDR3 voltage. Intel recommends the Cyclone V PowerPlay early power estimator to size regulators, and sequencing must be controlled by a power management IC such as the LTC3612 or Intel's recommended sequencer. Estimated: at 25K LE utilization with 800 MHz Cortex-A9 active, total power consumption is approximately 3-5 W depending on toggle rate.
The 672-UBGA package concentrates significant silicon area; the part has a thermal resistance (theta_JA) of approximately 12-15 C/W on a 4-layer JEDEC test board per Intel's thermal model. At 3-5 W dissipation, junction temperature rise above ambient is approximately 36-75 C, requiring thermal vias under the BGA and at least 4-layer PCB with internal copper pours. In enclosed industrial cabinets, ambient temperatures can approach 60C, so thermal design margin should be budgeted early.
The 672-UBGA package has 1.0 mm ball pitch and requires via-in-pad (VIPPO) technology for fanout. Microvias or laser-drilled stacked vias are typically needed for inner-row breakout. Per Intel's Cyclone V PCB design guidelines, maintain 50 ohm controlled impedance for high-speed LVDS and DDR3 routes, keep differential pairs matched within 5 mils, and provide sufficient decoupling (0.1 uF + 10 uF per power pin) within 100 mils of each ball.
Common pitfalls with Cyclone V SE SoC FPGAs include: (1) failing to boot the HPS before configuring the FPGA fabric, causing AXI bridge errors; (2) ignoring MSL (Moisture Sensitivity Level) handling for the BGA package, which can lead to package cracking during reflow; (3) mixing up HPS pin multiplexed functions (EMAC, USB, NAND) without consulting the pinout file; (4) using the wrong Quartus Prime device family library which fails to recognize the SE SoC variant. Always generate a fresh pinout file from Quartus before PCB layout.
Informações de conformidade
RoHS compliant per Altera/Intel product page. The I7 industrial temperature grade is not AEC-Q100 automotive qualified; the A7 automotive variant (5CSEBA2U23A7N) is required for AEC-Q100 applications. Lead-free and halogen-free per Intel Cyclone V material declaration.