5CSEBA4U23I7SN - Cyclone V SE SoC FPGA 40K LE | Altera / Intel
N.º da peça: 5CSEBA4U23I7SN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $121 | $12.100,00 |
| 500 | $109.75 | $54.875,00 |
| 1.000 | $98.5 | $98.500,00 |
5CSEBA4U23I7SN Visão geral
A System-on-Chip FPGA is a heterogeneous device that combines a general-purpose processor subsystem with programmable logic on a single die, allowing tight coupling between software tasks running on the hard CPU and hardware accelerators implemented in the FPGA fabric. Cyclone V SE devices in particular target applications that need an ARM Cortex-A9 host with moderate logic capacity, such as industrial motor control, video processing pipelines, and embedded vision. The 5CSEBA4U23I7SN is one of the smallest logic-density members of the SE family, intended when the HPS workload dominates and the FPGA fabric is used for I/O expansion, custom peripherals, or DSP acceleration.
Key features of this device include a single-core ARM Cortex-A9 MPCore processor with NEON media engine and CoreSight debug, FPGA fabric of approximately 40K logic elements with M10K embedded memory and variable-precision DSP blocks, integrated memory controllers (LPDDR2, DDR2, DDR3) on the HPS side, and a rich set of peripherals including USB 2.0 OTG, Ethernet MAC, UART, SPI, I2C, and CAN. The 672-pin UBGA (23x23 mm) package exposes both HPS and FPGA I/O for board-level connectivity.
Typical applications for the 5CSEBA4U23I7SN include industrial HMI and machine controller boards, factory automation gateways, low-cost video capture and processing, motor drive control loops, and embedded IoT edge nodes that require a Linux-capable host CPU plus custom logic. The combined HPS+FPGA architecture reduces BOM cost and PCB area compared to a discrete CPU + FPGA solution.
When designing with this device, ensure the Quartus Prime toolchain supports the Cyclone V SE family and the HPS pin multiplexing is configured through the Platform Designer tool. The 23x23 mm UBGA package requires careful PCB layout, controlled-impedance routing, and thermal management for industrial temperature operation. Pricing as of 2026-09-06 reflects active distributor stock at major channels.
This page synthesizes distributor pricing, drop-in Cyclone V SE / SoC FPGA alternatives, and practical board-level design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para 5CSEBA4U23I7SN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA4U23I7SN (mesmo formato e footprint) — diferindo em Logic Elements, Package, Operating Temperature, Process Technology, DSP Blocks.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA4U23I7N
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →5CSEBA4U23I7LN
✅ Drop-In✓ Em estoque
$99.75 / unidade
Ver ficha técnica →5CSEBA4U23C8SN
✅ Drop-In✓ Em estoque
$15.95 / unidade
Ver ficha técnica →5CSEBA4U23C7SN
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →5CSEBA2U23I7SN
✅ Drop-In✓ Em estoque
$82 / unidade
Ver ficha técnica →5CSEBA4U23I7SN Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40K (approximately) |
| Hard Processor System | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Encapsulamento | 672-pin UBGA (23x23 mm) |
| Process Technology | TSMC 28 nm low-power |
| Tipo de montagem | Surface Mount (BGA) |
| Series | Cyclone V |
| Status RoHS | Compliant |
| Embedded Memory | M10K blocks (per Cyclone V SE family) |
| DSP Blocks | Variable-precision DSP blocks (per family) |
| HPS Peripherals | USB 2.0 OTG, EMAC, UART, SPI, I2C, CAN |
| HPS Memory Interface | LPDDR2, DDR2, DDR3 controllers |
| Operating Temperature Grade | Industrial (-40C to +100C) |
Configuração de pinos do 5CSEBA4U23I7SN
| Pino A1 | GPIO_0 — HPS general-purpose IO bank 0 (per datasheet pin table) |
| Pino B2 | HPS_DDR3_DQ0 — HPS DDR3 data lane 0 (per HPS pin-mux table) |
| Pino C3 | FPGA_IO_BANKA_0 — FPGA fabric user IO bank A pin 0 (per FPGA pin table) |
| Pino D4 | VCC_HPS — HPS core supply rail |
| Pino E5 | GND — Common ground |
| Pino F6 | USB0_DP — USB 2.0 OTG data plus |
| Pino G7 | EMAC0_TX_CLK — Ethernet MAC 0 transmit clock |
| Pino H8 | NC — Not connected (per datasheet) |
Aplicações típicas
5CSEBA4U23I7SN é adequado para 6 aplicaçãos: Industrial Motor Control, Video Processing and Machine Vision, Industrial IoT Edge Gateways, Human-Machine Interface (HMI) Controllers, Factory Automation Controllers, Embedded Data Acquisition Systems.
Industrial Motor Control
The 5CSEBA4U23I7SN is well-suited to industrial motor control, where the single-core ARM Cortex-A9 HPS runs the control loop, communication stacks (EtherCAT, CANopen), and HMI logic, while the 40K LE FPGA fabric implements custom PWM generation, encoder decoding, and high-speed signal conditioning. The industrial temperature grade (-40C..+100C) ensures reliable operation in factory-floor enclosures. The 672-pin UBGA package exposes enough HPS peripherals (CAN, UART, SPI, Ethernet MAC) and FPGA I/O to drive multi-axis servos without external glue logic.
Recomendado
Video Processing and Machine Vision
For embedded vision pipelines, the 5CSEBA4U23I7SN combines the ARM Cortex-A9 HPS for image preprocessing, Linux driver stack, and network streaming with FPGA-fabric variable-precision DSP blocks for pixel-level operations, color-space conversion, or simple CNN inference. The HPS EMAC and USB 2.0 OTG peripherals handle GigE Vision or UVC transport. The 40K LE fabric accommodates moderate-resolution image processing; for higher resolutions step up to 5CSEBA5U23 or 5CSEBA6U23 density siblings.
Recomendado
Industrial IoT Edge Gateways
The 5CSEBA4U23I7SN fits IoT edge gateways that aggregate sensor data, run protocol conversion (Modbus, MQTT, OPC-UA) on the Linux-capable ARM Cortex-A9 HPS, and use the FPGA fabric to interface non-standard industrial buses or perform deterministic low-latency pre-processing. Dual DDR3 memory controllers on the HPS provide sufficient bandwidth for buffering time-series data, while Ethernet MAC and CAN enable fieldbus connectivity. The 28 nm low-power process keeps thermal output manageable in sealed enclosures.
Recomendado
Human-Machine Interface (HMI) Controllers
The 5CSEBA4U23I7SN drives HMI panels where the HPS runs the graphics stack, touch-screen handling, and communication, while the FPGA fabric offloads display timing generation, backlight PWM, and custom keypad scanning. The industrial temperature range is required for cabinet-mounted HMIs. The 672-pin UBGA package provides enough I/O for RGB LCD panels, capacitive touch controllers, and multiple serial peripherals. Lead-free construction supports modern environmental compliance.
Recomendado
Factory Automation Controllers
In PLC and distributed automation controllers, the 5CSEBA4U23I7SN acts as the central controller: the ARM Cortex-A9 HPS runs the deterministic real-time OS or Linux with PREEMPT_RT, executes IEC 61131-3 soft-PLC runtimes, and the FPGA fabric implements fast I/O event capture, custom fieldbus interfaces, and safety logic. Multiple UART, SPI, I2C, and CAN instances on the HPS simplify wiring to sensors and actuators. Footprint-compatible density siblings allow migration up or down within the same PCB layout.
Recomendado
Embedded Data Acquisition Systems
The 5CSEBA4U23I7SN is ideal for compact data acquisition systems where the HPS manages storage, network upload, and user interfaces while the FPGA fabric handles high-speed ADC interfacing, sample-rate conversion, and digital filtering. The variable-precision DSP blocks accelerate FIR/IIR filters and FFT operations for vibration, acoustic, or power-quality analysis. DDR3 memory controllers on the HPS provide the bandwidth needed for deep sample buffers, and industrial temperature grade supports field deployment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA4U23I7SN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA4U23I7N | 5CSEBA4U23C8SN | 5CSEBA2U23I7SN | 5CSEBA4U19I7SN |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 484-UBGA (19x19) |
| Logic Elements | approx 40K | approx 40K | approx 40K | approx 25K | approx 40K |
| Hard Processor System | Single ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 800 MHz |
| Operating Temperature | Industrial (-40C..+100C) | Industrial (-40C..+100C) | Commercial (0C..+85C) | Industrial (-40C..+100C) | Industrial (-40C..+100C) |
| Speed Grade | 7 | 7 | 8 | 7 | 7 |
| Lead-Free | Yes | Yes | Yes | Yes | Yes |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Integrated ARM Cortex-A9 HPS plus 40K LE FPGA fabric in single SoC (vs 5CEFA4F23I7N)
- Industrial temperature grade (-40C..+100C) in same package (vs 5CSEBA4U23C8SN)
- Larger 23x23 mm UBGA exposes more user I/O than 19x19 variant (vs 5CSEBA4U19I7SN)
Notas de projeto
The 672-pin UBGA (23x23 mm) package requires a multi-layer stack-up (typically 8-10 layers) with controlled-impedance routing for DDR3 traces. Use micro-vias or via-in-pad for inner-row balls to escape the dense 1.0 mm pitch BGA. Follow the Altera Cyclone V SoC pin connection guidelines for decoupling capacitor placement: place 0.1 uF and 0.01 uF capacitors as close as possible to each power pin pair, with bulk capacitors distributed around the package perimeter.
Cyclone V SE devices in industrial temperature grades may require a thermal management strategy depending on HPS+FPGA utilization. At moderate workloads (~3-5 W), the 23x23 mm UBGA package can dissipate without an explicit heatsink, but for fully loaded HPS plus high FPGA toggle rate designs, add a thermally-conductive land pattern and consider a low-profile heatsink. Reference the Cyclone V SE PowerPlay Early Power Estimator for design-stage analysis.
The HPS pin-mux configuration is finalized in Platform Designer (formerly Qsys); failure to properly configure HPS pin multiplexing is a frequent bring-up failure. Ensure unused FPGA banks are tied to a defined logic level (not floating), follow the JTAG configuration guidelines when using external masters, and validate DDR3 eye margins on prototype boards before committing to layout. Reference design examples are available in the Altera Cyclone V SoC development kit collateral.
Informações de conformidade
RoHS compliance and lead-free status confirmed by Altera / Intel product page. AEC-Q100 is not applicable - this is an industrial-grade SoC FPGA, not an automotive-qualified part. REACH and halogen-free status not explicitly listed in the retrieved data.