5CSEBA2U23I7SN - Cyclone V SE SoC FPGA, 25K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA2U23I7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $130 | $130.00 |
| 10 | $118 | $1,180.00 |
| 100 | $105 | $10,500.00 |
| 500 | $92 | $46,000.00 |
| 1,000 | $82 | $82,000.00 |
Drop-in alternatives for 5CSEBA2U23I7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA2U23I7N
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View Datasheet →5CSEBA2U23I7SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25K (approximately) |
| Hard Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 800 MHz |
| Package | 672-UBGA (23x23 mm) |
| Pin/Ball Count | 672 |
| I/O Count | 188 (per manufacturer listing) |
| Process Technology | 28 nm low-power (TSMC) |
| Operating Temperature Grade | Industrial (-40C to +100C, I7 suffix) |
| Supply Voltage Maximum | 1.13 V (per partstack listing) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| DSP Blocks | Variable-precision DSP blocks |
| Memory Blocks | M10K embedded memory blocks |
| PLLs | On-chip phase-locked loops |
| HPS Peripherals | USB 2.0 OTG, Gigabit Ethernet, DDR3 controller, SPI, I2C, UART |
5CSEBA2U23I7SN 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA2U23I7SN (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U23I7SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U23I7SN is suitable for 6 applications: Industrial Motor Control, Machine Vision and Image Processing, Factory Automation Controllers, Video Surveillance Systems, Software-Defined Radio Front-End, Embedded Computing Platforms with Linux.
Industrial Motor Control
The 5CSEBA2U23I7SN's combination of dual ARM Cortex-A9 cores at 800 MHz and 25K logic elements is well suited to industrial motor control applications. The HPS runs real-time Linux or RTOS for supervisory control loops, while the FPGA fabric implements high-speed PWM generation, encoder interfaces, and field-oriented control (FOC) algorithms at deterministic rates. Variable-precision DSP blocks accelerate Park/Clarke transforms and PID controllers without consuming HPS CPU cycles. The I7 industrial temperature grade (-40C to +100C) supports factory-floor deployments.
Recommended
Machine Vision and Image Processing
The 5CSEBA2U23I7SN integrates FPGA fabric optimized for pixel-level processing with an ARM subsystem for higher-level vision algorithms. Image sensors connect via the FPGA fabric through high-speed LVDS or parallel interfaces; preprocessing (filtering, thresholding, edge detection) runs in FPGA logic at line rate while object recognition and decision logic run on the Cortex-A9 cores. The DDR3 controller in the HPS provides bandwidth for frame buffer storage, and the variable-precision DSP blocks accelerate convolution kernels.
Recommended
Factory Automation Controllers
The 5CSEBA2U23I7SN fits factory automation controllers that require deterministic real-time I/O and a Linux-friendly processor in a single chip. The FPGA fabric implements industrial protocols such as EtherCAT, PROFINET, or Modbus in custom logic, while the ARM cores handle HMI rendering, network management, and PLC-style logic via CODESYS or similar runtimes. Industrial peripherals (USB, Gigabit Ethernet, UART, SPI) integrated in the HPS eliminate external interface ICs and reduce board area.
Recommended
Video Surveillance Systems
The 5CSEBA2U23I7SN is appropriate for network video recorder (NVR) and IP-camera applications. The FPGA fabric can implement H.264/H.265 encode or decode pipelines offloading the ARM cores, while the Cortex-A9 subsystem runs the camera application stack, web interface, and analytics. The integrated Gigabit Ethernet MAC and USB 2.0 OTG simplify connectivity, and DDR3 controller support enables high-bandwidth frame buffering. Industrial temperature rating supports outdoor enclosure deployments.
Recommended
Software-Defined Radio Front-End
The 5CSEBA2U23I7SN's FPGA fabric implements digital down/up-conversion, filtering, and modulation/demodulation for SDR front-ends, while the ARM Cortex-A9 cores execute the protocol stack and application layer. Variable-precision DSP blocks handle FFTs and pulse-shaping filters efficiently. Although the Cyclone V SE family lacks high-speed transceivers, baseband processing for narrowband or intermediate-frequency SDR is well within the 25K logic element capability.
Recommended
Embedded Computing Platforms with Linux
The 5CSEBA2U23I7SN's dual ARM Cortex-A9 cores at up to 800 MHz support embedded Linux distributions such as Yocto, Buildroot, or commercial embedded Linux products. The HPS boots from QSPI flash or SD card and provides standard peripheral interfaces, while the FPGA fabric can be reconfigured at runtime via the FPGA Manager for field-upgradable hardware accelerators. This combination delivers a flexible embedded platform for edge gateways, IoT concentrators, and industrial PCs.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U23I7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U23I7N | 5CSEBA2U23I7LN | 5CSEBA2U23C8SN | 5CSEBA2U23C7SN |
|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 25K | 25K | 25K | 25K | 25K |
| Hard Processor System | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz | Dual ARM Cortex-A9 up to 800 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I7 (fastest industrial) | I7 | I7 | C8 | C7 |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
| Approx. Unit Price (1 pc) | USD 130 (avg) | USD 120-130 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Integrated ARM Cortex-A9 HPS eliminates external processor and memory interface ICs (vs 5CEFA9F23I7N (Cyclone V E without HPS))
- Industrial temperature grade without speed-grade compromise (vs 5CSEBA2U23C8SN (commercial grade))
- Long-life-cycle support for embedded industrial programs (vs Consumer-grade FPGAs from competing vendors)
Design Notes
The Cyclone V SE SoC FPGA requires multiple power rails for the HPS, FPGA fabric, transceivers, and I/O banks. A typical power tree includes 0.9V core, 1.1V for HPS periphery, 1.5V/1.8V/2.5V/3.3V for I/O, and DDR3 voltage. Intel recommends the Cyclone V PowerPlay early power estimator to size regulators, and sequencing must be controlled by a power management IC such as the LTC3612 or Intel's recommended sequencer. Estimated: at 25K LE utilization with 800 MHz Cortex-A9 active, total power consumption is approximately 3-5 W depending on toggle rate.
The 672-UBGA package concentrates significant silicon area; the part has a thermal resistance (theta_JA) of approximately 12-15 C/W on a 4-layer JEDEC test board per Intel's thermal model. At 3-5 W dissipation, junction temperature rise above ambient is approximately 36-75 C, requiring thermal vias under the BGA and at least 4-layer PCB with internal copper pours. In enclosed industrial cabinets, ambient temperatures can approach 60C, so thermal design margin should be budgeted early.
The 672-UBGA package has 1.0 mm ball pitch and requires via-in-pad (VIPPO) technology for fanout. Microvias or laser-drilled stacked vias are typically needed for inner-row breakout. Per Intel's Cyclone V PCB design guidelines, maintain 50 ohm controlled impedance for high-speed LVDS and DDR3 routes, keep differential pairs matched within 5 mils, and provide sufficient decoupling (0.1 uF + 10 uF per power pin) within 100 mils of each ball.
Common pitfalls with Cyclone V SE SoC FPGAs include: (1) failing to boot the HPS before configuring the FPGA fabric, causing AXI bridge errors; (2) ignoring MSL (Moisture Sensitivity Level) handling for the BGA package, which can lead to package cracking during reflow; (3) mixing up HPS pin multiplexed functions (EMAC, USB, NAND) without consulting the pinout file; (4) using the wrong Quartus Prime device family library which fails to recognize the SE SoC variant. Always generate a fresh pinout file from Quartus before PCB layout.
Compliance Information
RoHS compliant per Altera/Intel product page. The I7 industrial temperature grade is not AEC-Q100 automotive qualified; the A7 automotive variant (5CSEBA2U23A7N) is required for AEC-Q100 applications. Lead-free and halogen-free per Intel Cyclone V material declaration.
