5CSEBA2U23C7SN - Cyclone V SE SoC FPGA 25K LE, ARM Cortex-A9 | Intel
N.º da peça: 5CSEBA2U23C7SN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $21.45 | $21,45 |
| 10 | $19.31 | $193,10 |
| 100 | $17.16 | $1.716,00 |
| 500 | $15.44 | $7.720,00 |
| 1.000 | $13.73 | $13.730,00 |
5CSEBA2U23C7SN Visão geral
A Cyclone V SoC FPGA is a heterogeneous compute device that merges a microprocessor subsystem (HPS) with an FPGA fabric on a single die. In the broader taxonomy, SoC FPGAs sit between application processors and standalone FPGAs, combining deterministic hardware acceleration with software programmability. This integration eliminates the need for a separate processor chip, reducing board area, BOM cost, and latency between the HPS and FPGA fabric over high-bandwidth AXI/ACP bridges.
Key features of the 5CSEBA2U23C7SN include 25K logic elements, 1.4 Mbits of embedded memory, hard memory controllers, and integrated transceivers. The ARM Cortex-A9 core supports symmetric multiprocessing, NEON media processing, and single/double-precision floating point. The HPS includes Ethernet MAC, USB, NAND flash controller, and DDR3 memory controller, providing a complete embedded processing platform alongside the FPGA fabric for custom acceleration logic.
From an architecture perspective, the Cyclone V SE family is fabricated on TSMC's 28 nm low-power process, with the HPS and FPGA fabric connected via a high-bandwidth coherent interconnect. This allows the ARM core to offload compute-intensive kernels to FPGA logic while maintaining shared-memory coherency. The -7 speed grade indicates timing-closed performance at industrial operating conditions, and the 'N' suffix (absent here, present on others) is not present because this is the standard variant.
Typical applications include industrial motor control, factory automation gateways, video processing pipelines, software-defined radio, and portable medical instrumentation. The combination of ARM processing for OS-driven tasks and FPGA fabric for deterministic I/O or DSP makes it ideal for cyber-physical systems.
When designing with this device, ensure the DDR3 interface is properly terminated and that the HPS boot source is selected correctly (NAND, QSPI, SD/MMC). Power sequencing must follow the Intel Cyclone V Hardware Reference Manual to avoid latch-up during hot-plug events.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Cyclone V SoC family, and practical design considerations not found on individual distributor listings.
Alternativas drop-in para 5CSEBA2U23C7SN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA2U23C7SN (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Logic Elements, HPS Maximum Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA2U23C7N
✅ Drop-In✓ Em estoque
$76.9 / unidade
Ver ficha técnica →5CSEBA2U23C6N
✅ Drop-In✓ Em estoque
$88.4 / unidade
Ver ficha técnica →5CSEBA2U23A7N
✅ Drop-In✓ Em estoque
$99.5 / unidade
Ver ficha técnica →5CSEBA2U19C7SN
✅ Drop-In✓ Em estoque
$40.33 / unidade
Ver ficha técnica →5CSEBA2U19C7N
✅ Drop-In✓ Em estoque
$16.9 / unidade
Ver ficha técnica →5CGXBC7C6F23C7N
✅ Drop-In✓ Em estoque
$154.9 / unidade
Ver ficha técnica →5CSEBA2U23C7SN Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25K |
| Processor Core | Single ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 800 MHz |
| Encapsulamento | 672-UBGA (23x23 mm) |
| Contagem de pinos | 672 |
| Embedded Memory | 1.4 Mbits |
| Speed Grade | -7 |
| Temperature Grade | Industrial |
| Process Technology | 28 nm low-power |
| Tipo de montagem | Surface Mount (BGA) |
| Transceivers | Integrated high-speed transceivers |
| Hard Memory Controller | DDR3 (via HPS) |
| Nível MSL | 3 |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 5CSEBA2U23C7SN 672-ubga (23x23 mm)
Configuração de pinos para 5CSEBA2U23C7SN (pacote 672-ubga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA2U23C7SN.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA2U23C7SN é adequado para 6 aplicaçãos: Industrial Motor Control, Factory Automation Gateway, Video Processing Pipeline, Software Defined Radio (SDR), Portable Medical Instrumentation, IoT Edge Gateway.
Industrial Motor Control
The 5CSEBA2U23C7SN fits industrial motor control because its 800 MHz ARM Cortex-A9 handles the FOC (field-oriented control) software loop while the 25K LE FPGA fabric implements high-resolution PWM, encoder quadrature decoding, and safety shutoff hardware. The single-core HPS runs Linux with PREEMPT_RT for the slow control loop, while FPGA logic deterministically samples current sensors at 100 kHz without jitter. Hardened DDR3 controller simplifies memory subsystem design, and the industrial temperature grade ensures operation on the factory floor. Companion parts include ACS71020 current sensor and AMT103 encoder.
Recomendado
Factory Automation Gateway
For factory automation gateways, the 5CSEBA2U23C7SN integrates industrial Ethernet protocols (EtherCAT, PROFINET) on the HPS side while the FPGA fabric handles time-critical I/O such as digital input sampling and pulse-stretching. The 800 MHz Cortex-A9 runs a containerized protocol stack (e.g., Docker on Yocto Linux), and the FPGA fabric implements a deterministic I/O hub bridging legacy fieldbus to OPC UA. Single-chip integration reduces bill-of-materials cost versus a discrete processor+FPGA design. The 672-UBGA package suits ruggedized industrial housings.
Recomendado
Video Processing Pipeline
The 5CSEBA2U23C7SN handles video processing where the FPGA fabric performs pixel-rate operations (color space conversion, scaling, gamma correction) while the ARM core runs the application stack and network protocols. The 1.4 Mbit embedded memory buffers multiple lines of 720p video, and HPS-FPGA shared memory enables zero-copy pipeline handoff. The integrated transceivers support Camera Link or MIPI CSI-2 input via FPGA GPIO bridges. This architecture suits industrial inspection cameras and video conferencing endpoints.
Recomendado
Software Defined Radio (SDR)
For SDR applications, the 5CSEBA2U23C7SN provides FPGA fabric for the digital down-conversion and modulation/demodulation paths, while the ARM Cortex-A9 runs the MAC layer and network stack. The integrated high-speed transceivers accept ADC samples at 100+ MSPS, and the FPGA fabric implements FIR filters and FFT engines in parallel. The HPS hosts a lightweight Linux (Buildroot) running GNU Radio companion blocks. This partition suits portable SDR prototypes and small-cell wireless infrastructure.
Recomendado
Portable Medical Instrumentation
In portable medical devices such as patient monitors or ultrasound front-ends, the 5CSEBA2U23C7SN pairs ARM Cortex-A9 processing with FPGA-accelerated signal conditioning. The FPGA fabric implements FIR decimation and envelope detection for biosignals, while the HPS runs the user interface and communications (BLE/Wi-Fi). Industrial temperature grade supports clinical environments, and the 28 nm low-power process enables battery operation. The 672-UBGA package fits compact handheld enclosures with 6-layer PCB stack-ups.
Recomendado
IoT Edge Gateway
For IoT edge gateways, the 5CSEBA2U23C7SN aggregates sensor data on the ARM Cortex-A9 HPS running lightweight container orchestration (e.g., K3s), while the FPGA fabric implements time-sensitive industrial protocols and pre-processing. Hardened DDR3 controller and Ethernet MAC reduce external component count, while integrated transceivers provide isolated fieldbus connectivity. Power consumption fits fanless enclosures, and the 23x23 mm 672-UBGA package fits DIN-rail housings. Suitable for smart-factory and building-automation gateways.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA2U23C7SN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA2U23C7N | 5CSEBA2U23C6N | 5CSEBA2U23A7N | 5CSEBA2U19C7SN | 5CSEBA2U19C7N | 5CGXBC7C6F23C7N |
|---|---|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA family - same | 672-UBGA family - same | 672-FBGA equivalent - same BGA class |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V GX SoC |
| Processor Core | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 |
| Speed Grade | -7 | -7 | -6 | A7 | -7 | -7 | -6 |
| Maximum HPS Clock | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
Principais diferenciais
- Single-core ARM Cortex-A9 HPS paired with 25K LE in 672-UBGA (vs 5CSEBA2U19C7SN)
- -7 speed grade timing margin over -6/A7 alternatives (vs 5CSEBA2U23C6N)
- Cyclone V SE SoC integrates ARM HPS for reduced BOM (vs 5CGXBC7C6F23C7N)
Notas de projeto
The 672-UBGA package requires at least a 6-layer PCB with 1.0 mm ball pitch. Use Intel's Cyclone V pin connection guidelines to fan out the BGA: outer balls route on the top layer, inner balls break out through microvias to inner layers. Decoupling capacitors must be placed within 100 mil of each power ball cluster; use 0402-size 0.1 µF X7R ceramics with 10 µF bulk on each rail.
Estimated: With VCC_HPS at 1.0 V drawing 1.5 A under load and VCC_FPGA_CORE at 1.1 V drawing 0.8 A, the total core power is approximately 2.4 W. Combined with I/O power (DDR3 PHY, transceivers) the total board consumption typically reaches 5-8 W. Use a multi-rail PMIC such as the Intel EN6347QI or LTM4677 to sequence the 1.0 V HPS, 1.1 V FPGA core, and 2.5 V/3.3 V I/O rails in the correct order per the datasheet.
The 5CSEBA2U23C7SN requires correct boot mode selection via MSEL pins at power-up; incorrect MSEL strapping causes HPS boot failure with no JTAG-visible error. The FPGA configuration source (typically HPS) must be loaded with a valid SOF/PERIPH bitstream. Ensure the JTAG chain order is preserved if other devices share the TCK/TMS lines. DDR3 traces require 50 Ω impedance control and length matching within 25 mil.
Informações de conformidade
RoHS compliant per Intel product declaration. Industrial temperature grade; not AEC-Q100 qualified (not automotive).