5CSEBA4U19C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
N.º da peça: 5CSEBA4U19C8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $86.39 | $86,39 |
| 10 | $78.5 | $785,00 |
| 100 | $68.2 | $6.820,00 |
| 500 | $60.1 | $30.050,00 |
| 1.000 | $54.75 | $54.750,00 |
5CSEBA4U19C8N Visão geral
A System-on-Chip (SoC) FPGA is an integrated circuit that combines a programmable FPGA fabric and a hard processor system (typically one or more ARM Cortex cores) on the same silicon die, allowing hardware-accelerated custom logic to communicate with the processor via a high-bandwidth on-chip interconnect. In the broader IC taxonomy, SoC FPGAs sit between microcontrollers (fixed peripherals, lower performance) and discrete FPGA + external processor pairings (more design flexibility but higher latency and BOM cost). The Cyclone V SE family belongs to Intel's low-power 28nm FPGA portfolio, positioned below Cyclone 10 and high-performance Stratix 10 parts but offering the lowest static power of the Cyclone V families.
Key differentiating features of the 5CSEBA4U19C8N include 40K logic elements, integrated DDR3 controller in the HPS, support for ARM TrustZone security extensions, on-chip CoreSight debug and trace, and a wide variety of HPS peripherals (USB 2.0, Gigabit Ethernet, CAN, UART, SPI, I2C). The device also provides programmable FPGA I/O supporting LVDS, LVCMOS, SSTL, and other standards via dedicated transceivers. Compared to other Cyclone V variants, the SE series omits the dedicated transceiver channels found in Cyclone V GT devices, trading high-speed serial capability for lower power and lower cost.
Typical applications include industrial motor control, factory automation HMIs, video surveillance and machine vision, automotive infotainment prototypes, and embedded vision pipelines where the FPGA fabric accelerates image processing while the ARM cores handle OS-level tasks such as networking and user interface. The integrated HPS also makes the part attractive for IoT edge gateways running Linux.
When designing with this device, engineers should plan the PCB layout around the 484-pin BGA power distribution network and ensure decoupling is sized for both FPGA core and HPS power rails. Programming flows use Intel Quartus Prime with the SoC EDS toolchain for the ARM subsystem.
Alternativas drop-in para 5CSEBA4U19C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA4U19C8N (mesmo formato e footprint) — diferindo em Package, Logic Elements, DSP Blocks, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA4U19C7N
✅ Drop-In✓ Em estoque
$36.92 / unidade
Ver ficha técnica →5CSEBA4U19C6N
✅ Drop-In✓ Em estoque
$74.5 / unidade
Ver ficha técnica →5CSEBA2U19C8N
✅ Drop-In✓ Em estoque
$52.4 / unidade
Ver ficha técnica →5CSEBA4U19A7N
✅ Drop-In✓ Em estoque
$99.9 / unidade
Ver ficha técnica →5CSEBA4U19C7SN
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$218 / unidade
Ver ficha técnica →5CSEBA4U19C8N Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| FPGA Fabric Speed Grade | -8 |
| Encapsulamento | 484-UBGA (19x19 mm) |
| Temperatura de operação | 0C to +85C (commercial) |
| Process Technology | TSMC 28nm low-power |
| User I/O Count | 161 |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Nível MSL | 3 (168 hours) |
| Transceivers | None (SE variant - no high-speed transceivers) |
| Configuration Method | Serial (EPCS) and Parallel |
Guia de Configuração de Pinos do 5CSEBA4U19C8N 484-ubga (19x19 mm)
Configuração de pinos para 5CSEBA4U19C8N (pacote 484-ubga (19x19 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA4U19C8N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA4U19C8N é adequado para 6 aplicaçãos: Industrial Motor Control, Machine Vision and Embedded Vision, Automotive Infotainment Prototyping, IoT Edge Gateway and Industrial Networking, Medical Diagnostic Equipment Prototyping, Software-Defined Radio and Signal Processing.
Industrial Motor Control
The 5CSEBA4U19C8N fits industrial motor control applications because its dual ARM Cortex-A9 HPS runs real-time Linux or RTOS for motion control loops, while the 40K logic elements implement custom PWM generation, encoder decoding, and field-oriented control (FOC) accelerators. The Cyclone V SE FPGA fabric delivers deterministic sub-microsecond latency for current-loop control at switching frequencies up to 100 kHz, surpassing pure software implementations. With 161 user I/O and built-in CAN, Ethernet, and UART peripherals, the device connects directly to motor driver boards without external bridge chips, reducing BOM cost.
Recomendado
Machine Vision and Embedded Vision
For machine vision pipelines, the 5CSEBA4U19C8N's FPGA fabric accelerates image preprocessing (filtering, edge detection, color space conversion) at line rates that ARM cores cannot match, while the HPS runs OpenCV-based classification and decision logic. The 40K LE budget supports parallel processing of 720p video streams at 60 fps using variable-precision DSP blocks, and the integrated DDR3 controller in the HPS provides high-bandwidth frame buffer access. The lack of high-speed transceivers (SE variant) means MIPI or parallel LVDS sensor interfaces must be implemented through FPGA I/O, which is feasible up to ~1 Gbps aggregate.
Recomendado
Automotive Infotainment Prototyping
The 5CSEBA4U19C8N supports automotive infotainment prototyping with its dual-core ARM Cortex-A9 capable of running Android or Linux for HMI rendering, while the FPGA fabric handles accelerated audio DSP, video scaling, and display timing generation. The commercial 0C to +85C temperature range is suitable for cabin-mounted prototypes but production automotive deployments should migrate to the industrial-grade 5CSEBA4U19A7N variant (-40C to +100C). The SoC architecture eliminates the latency of an external host processor communicating with a standalone FPGA over PCIe or USB, enabling tightly synchronized audio/video pipelines.
Recomendado
IoT Edge Gateway and Industrial Networking
The 5CSEBA4U19C8N operates as an IoT edge gateway by running a Linux distribution on the ARM HPS for protocol translation (MQTT, Modbus, OPC-UA) while offloading packet processing, encryption, and traffic shaping to the FPGA fabric. With Gigabit Ethernet MAC, USB 2.0, CAN, and UART integrated into the HPS, the device aggregates fieldbus data without external bridge chips. The Cyclone V SE family's low static power makes the part suitable for fanless edge installations, and the shared DDR3 controller supports up to 4 GB of system memory for local analytics.
Recomendado
Medical Diagnostic Equipment Prototyping
For medical diagnostic prototypes, the 5CSEBA4U19C8N's FPGA fabric implements deterministic signal acquisition pipelines for ultrasound beamforming, ECG processing, or patient monitoring sensor fusion, while the ARM HPS hosts the user interface, database connectivity, and HL7/DICOM protocol stack. The commercial temperature grade suits laboratory and clinical environments; for field-deployed devices the industrial-grade 5CSEBA4U19A7N is recommended. Hardware isolation between FPGA logic and HPS subsystems supports IEC 62304 software lifecycle requirements common in medical device development.
Recomendado
Software-Defined Radio and Signal Processing
The 5CSEBA4U19C8N enables software-defined radio prototypes by placing digital up/down-conversion, filtering, and modulation/demodulation in the FPGA fabric, while the HPS executes higher-level MAC-layer protocols and network interfaces. Although the SE variant lacks dedicated transceivers, the FPGA I/O supports LVDS interfaces to external ADC/DAC chips operating in the sub-1 GHz IF range. The 40K LE budget supports one or two simultaneous narrowband channels; broadband multi-channel designs should step up to the higher-density 5CEFA9F23I7N Cyclone V E family members.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA4U19C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA4U19C7N | 5CSEBA4U19C6N | 5CSEBA2U19C8N | 5CSEBA4U19A7N | 5CSEBA4U19C7SN |
|---|---|---|---|---|---|---|
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40K | 40K | 40K | 25K | 40K | 40K |
| Speed Grade | -8 | -7 | -6 | -8 | -7 | -7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| HPS | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | ||
| User I/O Count | 161 | 161 | 161 | 161 |
Principais diferenciais
- Higher Fmax timing margin versus slower speed grade variants (vs 5CSEBA4U19C7N)
- 40K logic elements versus 25K in lower-density same-package variant (vs 5CSEBA2U19C8N)
- Lower cost versus industrial temperature grade variant (vs 5CSEBA4U19A7N)
Notas de projeto
The 5CSEBA4U19C8N requires multiple power rails including VCC (core), VCCPD (I/O pre-driver), VCCIO (I/O banks), and separate HPS rails (VCC_HPS, VCC_HPS_IO). Decoupling requires bulk capacitors near each BGA power pin pair plus high-frequency 0.1uF MLCCs within 2mm of every fourth pin. Estimate (input values: 40K LE utilization at 100 MHz toggle, dual-core HPS at 600 MHz): static power approximately 0.5W, dynamic power 1.5-2.5W typical. Designers should budget for a 4-layer PCB minimum to provide adequate power planes.
The 484-UBGA package with 19x19mm body has a 0.8mm ball pitch. PCB design requires HDI stackup with microvias-in-pad or sub-100um via capture pads; standard 4-layer FR-4 with 4-mil trace/space is the practical minimum. Escape routing must use dog-bone fanout from inner rows; full via-in-pad requires ENIG plating and adds cost. Reference Intel Cyclone V device handbook pin connection guidelines for unused pin tie-off requirements.
Do not assume SE and SX Cyclone V variants share the same pinout - SE lacks transceivers so transceiver ball positions may be repurposed for additional GPIO or GND. Also, configuring this part requires Quartus Prime 16.0 or later; older Quartus II versions do not recognize the 5CSEBA4U19C8N ordering code. The HPS boot source (EPCS flash, SD card, or JTAG) must be selected via MSEL pins before power-up; incorrect MSEL state causes silent boot failure.
Estimated thermal analysis at typical operating conditions (input values: total power 2.5W, ambient 25C, no heatsink): the 484-UBGA package has theta_JA approximately 15-20 C/W on a 4-layer JEDEC test board, resulting in a 40-50C junction temperature rise above ambient. Commercial grade parts (0C to +85C junction) have approximately 30-35C thermal margin, so passive cooling is acceptable for most embedded applications without active airflow. For enclosed industrial cabinets above 50C ambient, a small clip-on heatsink is recommended.
Informações de conformidade
RoHS and REACH compliance per Intel product declaration. Not AEC-Q100 qualified; for automotive applications use AEC-Q100 qualified variants or contact Intel for automotive-grade Cyclone V SE ordering codes. Conflict minerals reporting per Intel CMRT filings.
