5CSEBA2U19C8N - Cyclone V SE SoC FPGA, 25K LE, Dual ARM Cortex-A9 | Altera
MPN: 5CSEBA2U19C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $67.46 | $67.46 |
| 10 | $60.71 | $607.10 |
| 100 | $54.07 | $5,407.00 |
| 500 | $47.22 | $23,610.00 |
| 1,000 | $40.48 | $40,480.00 |
Drop-in alternatives for 5CSEBA2U19C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA2U19C7SN
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View Datasheet →5CSEBA2U19C7N
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View Datasheet →5CSEBA2U19C6N
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View Datasheet →5CSEBA2U19A7N
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View Datasheet →5CSEBA2U19C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA2 (U19) |
| Logic Elements | 25,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 600 MHz |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm low-power |
| Package | 484-pin UBGА / UBGA (19x19 mm) |
| FPGA I/O Count | 240 user I/O |
| DSP Blocks | Variable-precision DSP |
| Embedded Memory | M10K blocks (Cyclone V SE family) |
| Transceivers | Integrated high-speed transceivers (Cyclone V family) |
| Operating Temperature | Commercial (0C to 85C) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
5CSEBA2U19C8N 484-pin ubgА / ubga (19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA2U19C8N (484-pin ubgА / ubga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U19C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U19C8N is suitable for 6 applications: Industrial Motor Control and PLC, Machine Vision and Video Surveillance, Factory Automation HMI and Panel PCs, Automotive Driver-Assistance Systems, Embedded Medical Imaging Devices, Smart Retail and Digital Signage.
Industrial Motor Control and PLC
The 5CSEBA2U19C8N is well suited to industrial motor control and PLC platforms because its dual-core ARM Cortex-A9 HPS at 600 MHz can run a real-time Linux or VxWorks PLC runtime, while the 25K-logic-element FPGA fabric implements deterministic PWM generation, encoder decoding, and fieldbus protocol logic in hardware. The HPS-to-FPGA bridges deliver sub-microsecond latency, enabling tight current-loop control on servo drives. Compared with a discrete MCU + CPLD solution, the SoC FPGA eliminates inter-chip latency and supports firmware updates without disturbing the FPGA logic.
Recommended
Machine Vision and Video Surveillance
The 5CSEBA2U19C8N supports machine vision and video surveillance designs by combining the ARM Cortex-A9 HPS for image processing pipelines (OpenCV, GStreamer) with FPGA fabric for pixel-level preprocessing such as Bayer demosaicing, lens distortion correction, and motion detection at line rate. The integrated high-speed transceivers drive MIPI CSI-2 or LVDS image sensors, while the HPS Ethernet ports stream compressed H.264 video to network recorders. The 28nm low-power process keeps thermals manageable inside sealed IP66 camera housings.
Recommended
Factory Automation HMI and Panel PCs
The 5CSEBA2U19C8N powers factory automation HMIs and panel PCs by running a Linux-based Qt or Web-based HMI on the dual-core ARM Cortex-A9 HPS while the FPGA fabric drives LVDS or RGB touchscreens, scans capacitive touch controllers, and accelerates industrial protocol stacks (PROFINET, EtherCAT, EtherNet/IP). The SoC FPGA architecture supports secure boot and remote firmware updates required for Industry 4.0 deployments. Static power under 250 mW allows fanless panel-PC designs with sealed IP65 front bezels.
Recommended
Automotive Driver-Assistance Systems
The 5CSEBA2U19C8N suits automotive driver-assistance subsystems (ADAS) such as rear-view cameras, surround-view processors, and driver-monitoring units by leveraging the dual-core ARM Cortex-A9 HPS for computer-vision algorithms and the FPGA fabric for sensor fusion and image signal processing. AEC-Q100 grade parts in the same family (XC7Z020-1CLG484I automotive variants in cross-brand) provide the automotive temperature range. The 28nm low-power process enables compact ECU housings with passive cooling.
Recommended
Embedded Medical Imaging Devices
The 5CSEBA2U19C8N enables embedded medical imaging applications such as portable ultrasound, endoscopic camera processors, and point-of-care diagnostics by combining the ARM Cortex-A9 HPS for image reconstruction and user-interface software with FPGA fabric for beamforming, FIR filtering, and high-speed ADC interfacing. The deterministic FPGA hardware acceleration is critical for real-time ultrasound beamforming where software-only latency is unacceptable. Medical IEC 60601 compliance is achievable with appropriate isolation and power architecture.
Recommended
Smart Retail and Digital Signage
The 5CSEBA2U19C8N drives smart retail applications including interactive digital signage, electronic shelf labels, and people-counting sensors by running the HPS with Android or embedded Linux while the FPGA fabric handles multi-display driving, gesture sensor fusion, and machine-vision analytics. The integrated USB, EMAC, and PCIe interfaces in the HPS simplify connectivity to peripherals and back-office networks. Low static power and commercial temperature range suit always-on retail environments with limited cooling.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19C7SN | 5CSEBA2U19C7N | 5CSEBA2U19C6N | 5CSEBA2U19A7N |
|---|---|---|---|---|---|
| Package | UBGА-484 (19x19) | UBGА-484 (19x19) - same | UBGА-484 (19x19) - same | UBGА-484 (19x19) - same | UBGА-484 (19x19) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | C8 | C7 | C7 | C6 | A7 (industrial) |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Industrial (-40C to 85C) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| FPGA I/O Count | 240 | 240 | 240 | 240 | 240 |
Key Differentiators
- Fastest speed grade in the 25K-LE UBGА-484 family (vs 5CSEBA2U19C7SN)
- Industrial temperature option available in same package (vs 5CSEBA2U19A7N)
- Same silicon die across the speed-grade family (vs 5CSEBA2U19C6N)
Design Notes
The 5CSEBA2U19C8N requires separate power rails for the HPS, FPGA core, FPGA I/O banks, PLL analog supplies, and transceiver blocks. Use a multi-rail PMIC such as the Intel/Altera Enpirion EN6347QI family or discrete LDO + DC-DC regulators with proper sequencing - HPS rails typically come up first to allow boot ROM access. Estimated: at 600 MHz HPS utilization with 60% FPGA fabric activity, total power is approximately 3-5 W; reference the Cyclone V SE PowerPlay Early Power Estimator (EPE) spreadsheet before final BOM selection.
The 484-ball UBGА has a JEDEC-standard theta-JA of approximately 15-20 C/W on a 4-layer JEDEC test board. Estimated: at 4 W total dissipation this yields a 60-80 C junction rise, requiring either a heatsink or significant PCB copper pour. For fanless sealed enclosures, derate to 2-3 W maximum and validate thermally with a thermocouple in the final housing.
The 484-ball UBGА uses 0.8 mm ball pitch - PCB design requires 4-6 layer stack-up with microvia-in-pad or HDI techniques for inner-row fanout. All decoupling capacitors (100nF, 10uF) must be placed within 100 mils of their respective supply pins per the Cyclone V SE pin connection guidelines. Length-matching is required for DDR3 signals routed to the HPS memory controller - use the Quartus Prime DDR3 pin-assignment tool to validate routing topology before fabrication.
Separate the HPS and FPGA I/O banks physically on the PCB to simplify noise isolation. Place the HPS reference clock crystal or oscillator within 200 mils of the HPS_CLK pins with a guard ring on the differential pair. Keep high-speed transceiver lanes on inner stripline layers with a continuous reference ground plane and stitch vias every lambda/20 to suppress resonances.
Common pitfalls include: (1) forgetting to hold the HPS in reset until all rails are stable, causing boot ROM checksum failures; (2) omitting the proper MSEL configuration pull resistors, which can lock the device in the wrong configuration mode; (4) using the wrong Quartus Prime device family library for HPS peripheral definitions, producing non-functional pin assignments. Always validate the preloader image with the SoC EDS command-line toolchain before attempting Linux boot.
Compliance Information
RoHS compliant per distributor listings (DigiKey, Mouser). Lead-free BGA balls. Halogen-free status not explicitly stated in distributor data - confirm with Altera/Intel datasheet or PCN. Not AEC-Q100 qualified; choose automotive Cyclone V variants for vehicle applications.
