5CSXFC6C6U23C8N - Cyclone V SX SoC FPGA, 110K LE, ARM Cortex-A9 | Intel
N.º da peça: 5CSXFC6C6U23C8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $612.5 | $612,50 |
| 10 | $580 | $5.800,00 |
| 100 | $535 | $53.500,00 |
| 500 | $488 | $244.000,00 |
| 1.000 | $445 | $445.000,00 |
5CSXFC6C6U23C8N Visão geral
An SoC FPGA is a class of programmable logic device that combines a hard processor core with an FPGA fabric on a single die, reducing board area, power, and bill-of-materials relative to a two-chip CPU-plus-FPGA solution. Within the broader taxonomy, SoC FPGAs sit between discrete microcontroller + FPGA pairs and fully integrated ASSPs, offering software programmability for control-plane tasks and hardware reconfigurability for data-plane acceleration. The Cyclone V SX series in particular is the higher-performance tier that adds integrated transceivers alongside the dual-core ARM subsystem.
Key features of the 5CSXFC6C6U23C8N include 110,000 logic elements, embedded M10K memory blocks, variable-precision DSP blocks, integrated 3.125 Gbps transceivers, and a hard memory controller supporting DDR2/DDR3/LPDDR2. The Cortex-A9 subsystem includes NEON media-processing engine, single/double-precision FPU, and 32 KB L1 instruction and data caches plus 512 KB shared L2 cache. Industrial-grade silicon ensures operation from -40C to +100C (junction).
The Cyclone V SX architecture uses TSMC's 28nm low-power process, providing an optimal balance of static and dynamic power. Hard IP blocks such as the PCIe Gen2 controller, Ethernet MACs, and the HPS peripheral set are pre-verified silicon, allowing designers to skip RTL development for common functions. Compared with the Cyclone V SE sub-family, the SX variant adds transceiver capability for protocols such as GigE, CPRI, and LVDS-based interfaces.
Typical applications include industrial motor control with deterministic FPGA co-processing, factory automation gateways, medical imaging pre-processing, video surveillance encoders, and software-defined radio baseband. The dual-core ARM subsystem runs Linux or RTOS while the FPGA fabric handles real-time DSP and high-speed I/O. Per Intel's Cyclone V device datasheet, the SoC also targets smart-grid and energy-management use cases where hardware determinism and processor flexibility must coexist on one die.
When designing with the 5CSXFC6C6U23C8N, engineers should follow Intel's HPS-to-FPGA bridge guidelines for AXI transactions and ensure proper decoupling on the multi-rail HPS/FPGA supply domains. The 672-ball UFBGA package requires PCB design rules compliant with JEDEC moisture sensitivity level 3, including dry-pack handling prior to reflow. Designers must also plan the boot configuration (QSPI, SD, NAND) and the HPS pin multiplexing early in the schematic phase.
This page synthesizes distributor pricing, drop-in same-package alternatives from the same Cyclone V SX family, and practical design notes that complement the official Cyclone V device datasheet. Cross-brand drop-in equivalents in the same 672-pin UFBGA footprint are not common for a mid-range SoC FPGA, so the alternatives list below is curated primarily from same-brand family members.
Alternativas drop-in para 5CSXFC6C6U23C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSXFC6C6U23C8N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Logic Elements, DSP Blocks.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSXFC6C6U23C7N
✅ Drop-In✓ Em estoque
$215.8 / unidade
Ver ficha técnica →5CSXFC6C6U23C6N
✅ Drop-In✓ Em estoque
$285 / unidade
Ver ficha técnica →5CSXFC6C6U23A7N
✅ Drop-In✓ Em estoque
$328.75 / unidade
Ver ficha técnica →5CSXFC5C6U23C8N
✅ Drop-In✓ Em estoque
$96.75 / unidade
Ver ficha técnica →5CSXFC5C6U23C7N
✅ Drop-In✓ Em estoque
$348 / unidade
Ver ficha técnica →5CSXFC4C6U23C8N
✅ Drop-In✓ Em estoque
$90 / unidade
Ver ficha técnica →5CSXFC6C6U23C8N Classificações máximas e características elétricas
| Family | Cyclone V SX (SoC FPGA) |
| Series | Cyclone V SX |
| Architecture | MCU + FPGA (Hard Processor System + FPGA fabric) |
| Logic Elements | 110,000 |
| Process Technology | 28 nm low-power (TSMC) |
| Core Voltage | 1.1 V |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 600 MHz |
| HPS L1 Cache | 32 KB instruction + 32 KB data per core |
| HPS L2 Cache | 512 KB shared |
| DSP Blocks | Variable-precision DSP (number not specified in retrieved data) |
| Transceivers | Up to 3.125 Gbps integrated transceivers |
| Memory Controller | Hard controller supporting DDR2, DDR3, LPDDR2 |
| Encapsulamento | 672-pin UFBGA (UBGA), 23x23 mm |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | -40C to +100C (industrial grade, code C) |
| Nível MSL | 3 (per JEDEC J-STD-020, typical for large BGA) |
| Status RoHS | Compliant |
| Speed Grade | C8 (commercial speed grade 8) |
| Lifecycle | Active (Cyclone V family in production) |
Guia de Configuração de Pinos do 5CSXFC6C6U23C8N 672-pin ufbga (ubga), 23x23 mm
Configuração de pinos para 5CSXFC6C6U23C8N (pacote 672-pin ufbga (ubga), 23x23 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSXFC6C6U23C8N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSXFC6C6U23C8N é adequado para 6 aplicaçãos: Industrial Motor Control, Factory Automation Gateways, Medical Imaging Pre-Processing, Video Surveillance Encoders, Software-Defined Radio Baseband, Smart Energy / Grid Management.
Industrial Motor Control
The 5CSXFC6C6U23C8N is well suited for industrial motor drives because the SX family integrates transceivers up to 3.125 Gbps for high-speed encoder feedback and fieldbus connectivity such as EtherCAT or Profinet. The dual-core ARM Cortex-A9 hard processor system runs real-time control loops or a Linux + RTOS split, while the 110K logic-element FPGA fabric handles deterministic field-oriented control (FOC) and current-loop PWM at sub-microsecond latency. The hard DDR3 controller with ECC enables fast current-sampling buffer storage and lookup tables for sinusoidal commutation. Per the Cyclone V device datasheet, industrial-grade silicon supports operation from -40C to +100C junction, suitable for cabinet-mounted drives. The part's combination of FPGA flexibility and HPS compute delivers a single-chip solution that would otherwise require a discrete MCU plus FPGA pair.
Recomendado
Factory Automation Gateways
For factory automation gateways, the 5CSXFC6C6U23C8N's dual-core ARM Cortex-A9 runs OPC-UA, MQTT, or Modbus-TCP stacks while the FPGA fabric accelerates protocol conversion between legacy fieldbus (RS-485, CAN, Profibus) and Ethernet. The integrated transceivers enable direct connection to industrial Ethernet PHYs without an external PHY, reducing BOM and board area. With 110K logic elements, the FPGA can implement multiple protocol bridges in parallel with deterministic latency. Per the Cyclone V device datasheet, the HPS peripherals include dual Gigabit Ethernet MACs, USB 2.0 OTG, and SD/MMC, providing comprehensive gateway connectivity in a single chip. Industrial temperature grade ensures reliability in cabinet environments with extended thermal stress.
Recomendado
Medical Imaging Pre-Processing
In medical imaging systems such as ultrasound or endoscopy pre-processing, the 5CSXFC6C6U23C8N's 110K LE FPGA fabric and variable-precision DSP blocks handle real-time pixel pipelines, beamforming, and noise filtering. The dual-core ARM Cortex-A9 manages user-interface rendering and network connectivity (DICOM over Ethernet) while offloading heavy DSP to the FPGA. The hard DDR3 controller provides high-bandwidth memory access for image frame buffers, and the integrated transceivers support high-speed sensor interfaces such as MIPI-CSI or LVDS-based camera links. Per the Cyclone V device datasheet, medical designs benefit from the deterministic latency of FPGA-accelerated DSP and the flexible HPS that runs Linux for DICOM stack and touch UI.
Recomendado
Video Surveillance Encoders
The 5CSXFC6C6U23C8N serves as a single-chip video encoder for IP surveillance cameras, with the FPGA fabric implementing H.264/H.265 encode at 1080p60 and the Cortex-A9 cores managing network streaming, motion detection analytics, and SD-card recording. The hard DDR3 controller holds reference frames for the encoder, and the integrated transceivers connect directly to Gigabit Ethernet PHYs without an external MAC chip. With 110K logic elements, the FPGA can run multiple encode streams simultaneously for multi-channel NVR systems. Per the Cyclone V device datasheet, the HPS peripherals include SATA and USB for local storage, making the part suitable for edge-recording NVRs. The industrial temperature grade supports outdoor enclosure operation.
Recomendado
Software-Defined Radio Baseband
For software-defined radio baseband processing, the 5CSXFC6C6U23C8N's integrated transceivers interface directly with RF front-end ADCs/DACs at sample rates up to several hundred MSPS, while the FPGA fabric implements channelizers, modulators, and forward-error-correction in real time. The dual-core ARM Cortex-A9 handles higher-layer protocol stacks and TCP/IP offload, with the 110K LE providing enough logic for narrowband waveforms or multi-channel receiver banks. Per the Cyclone V device datasheet, the SX sub-family supports CPRI and OBSAI protocols commonly used in small-cell base stations. The DDR3 controller provides high-bandwidth sample buffering, and the industrial temperature grade supports outdoor small-cell deployment.
Recomendado
Smart Energy / Grid Management
In smart-grid applications such as substation controllers and energy-management gateways, the 5CSXFC6C6U23C8N provides the combination of HPS compute for protocol stacks (IEC 61850, DNP3, Modbus) and FPGA fabric for fast tripping logic in protection relays. The integrated transceivers support high-speed Ethernet for process bus communication, and the hard DDR3 controller holds event logs and fault records. With 110K logic elements, the FPGA can implement multiple IEC 61850-9-2 sampled-value streams and parallel IED interfaces. Per the Cyclone V device datasheet, the industrial temperature grade ensures reliability in unconditioned substation environments. The single-chip integration reduces MTBF-critical component count relative to discrete MCU plus FPGA solutions, an important factor in grid reliability.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSXFC6C6U23C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSXFC6C6U23C7N | 5CSXFC6C6U23C6N | 5CSXFC6C6U23A7N | 5CSXFC5C6U23C8N | 5CSXFC4C6U23C8N |
|---|---|---|---|---|---|---|
| Package | 672-pin UFBGA (U23), 23x23 mm | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 | 60,000 |
| Speed Grade | C8 | C7 (faster) | C6 (fastest) | A7 (industrial) | C8 (same) | C8 (same) |
| Hard Processor System | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz |
| Integrated Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Memory Controller | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC |
| Operating Temperature | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code A) | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code C) |
Principais diferenciais
- Highest-density drop-in option with same speed grade (vs 5CSXFC5C6U23C8N)
- Speed grade C8 is the most economical option in the same-density tier (vs 5CSXFC6C6U23C7N)
- Cyclone V SX adds integrated transceivers unavailable on SE (vs 5CSEBA6U23C8N)
Notas de projeto
The 672-pin UFBGA package requires JEDEC J-STD-020 compliant PCB land patterns with 0.8 mm ball pitch and microvia-in-pad recommended for breakout. A 1-2-1 or 2-4-2 stack-up with buried capacitance in the core is recommended for the simultaneous-switching outputs (SSO) of the HPS peripheral buses. Per Intel's Cyclone V PCB design guidelines, all transceiver lanes should route on a top-layer microstrip with continuous reference ground, and the HPS-to-FPGA bridges (AXI) should route on inner stripline layers with controlled impedance.
The 5CSXFC6C6U23C8N requires multiple supply rails: VCC (1.1 V core), VCCIO for each I/O bank (1.2/1.5/1.8/2.5/3.3 V), VCCPD, VCCPGM, VCCA_PLL, VCCD_PLL, and separate VCC_HPS, VCC_HPS_IO, VCC_HPS_PLL. Per Intel's Cyclone V pin connection guidelines, each rail should be decoupled with 0.1 uF X7R ceramics adjacent to every supply pin, plus bulk 10-47 uF tantalum or polymer capacitors. Power sequencing requires VCC before VCCIO and VCCPD; failure to sequence correctly can cause latch-up. Use a dedicated power-management IC such as an LTC3612 or similar multi-rail PMIC.
Estimated: at 110K LE utilization (~70%) and HPS at full load, the 5CSXFC6C6U23C8N dissipates approximately 4-6 W of total power. The 672-pin UFBGA thermal resistance (theta_JB) is approximately 4 C/W per Intel's package thermal model; junction-to-ambient with 4-layer 23x23 mm PCB and minimum 25 mm^2 thermal via array is approximately 12-15 C/W. Maximum junction temperature is 100C for industrial grade. Designers must place thermal vias under the central BGA array and connect them to internal copper planes for heat spreading; a heatsink is rarely needed for typical industrial designs but may be required if HPS compute load is sustained above 80% utilization.
A common pitfall is failing to assign the HPS boot configuration pins correctly: the BSEL pins select QSPI, SD/MMC, NAND, or FPGA-bypass boot mode and must be pulled high or low per the design's chosen boot source. Another pitfall is overlooking the HPS-to-FPGA bridge clock-domain crossing, which can cause intermittent AXI transaction failures if the bridge clock is not derived from a common PLL. Per Intel's Cyclone V HPS chapter, the FPGA fabric should not drive the HPS warm-reset_n or cold-reset_n pins without proper handshaking through the reset manager. Finally, ignore the JTAG chain at your peril: the HPS and FPGA fabric share TCK/TMS/TDI/TDO but each has its own TAP controller that must be enumerated correctly in the Quartus BSD file.
Informações de conformidade
RoHS compliant and lead-free per Intel Altera product page and distributor listings. Halogen-free status not explicitly stated in retrieved data ([DATA_NEEDED]). AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part; refer to Cyclone V automotive variants for AEC-Q100 options.
