5CSXFC6C6U23C8NES - Cyclone V SX SoC FPGA 110K LE | Intel
N.º da peça: 5CSXFC6C6U23C8NES ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265.5 | $2.655,00 |
| 100 | $240 | $24.000,00 |
| 500 | $215.75 | $107.875,00 |
| 1.000 | $195 | $195.000,00 |
5CSXFC6C6U23C8NES Visão geral
What is an SoC FPGA? An SoC FPGA combines a general-purpose microprocessor subsystem (here, dual ARM Cortex-A9 cores with CoreSight debug, NEON media engine and single/double-precision floating point) with a programmable FPGA fabric on a single die. This heterogeneous architecture sits inside the broader hierarchy of programmable logic devices (CPLD -> FPGA -> SoC FPGA), enabling hardware acceleration of performance-critical tasks while running a Linux or RTOS software stack on the hard cores - a pattern used to balance deterministic latency with software flexibility.
Key features of the 5CSXFC6C6U23C8NES include 110K logic elements, 3.75 Kbits of M10K block memory plus 555 Kbits of MLAB, 112 18x19 multipliers, support for DDR2/DDR3/LPDDR2 external memory interfaces, and dual PCIe Gen2 hard IP blocks. The hard processor subsystem includes NEON SIMD media engine, Vector Floating Point v3 unit, 32KB L1 instruction/data caches per core, and 512KB shared L2 cache. Peripherals include two Ethernet MACs, two USB 2.0 OTG controllers, two CAN, two SPI, four UART, and two I2C controllers, making it a true system-on-chip.
The Cyclone V SX architecture targets low-power, cost-sensitive applications where integration reduces BOM count and PCB complexity. The 28nm process combined with power-aware compiler features allows the device to operate in designs that require fanless thermal envelopes while still providing tens of GMACs of DSP throughput via the variable-precision DSP blocks.
Typical applications include industrial machine vision systems, motor control and drives, automotive driver assistance units, video surveillance, broadcast equipment, and embedded server appliances. The combination of ARM Cortex-A9 cores plus FPGA fabric makes it ideal for protocol bridging, deterministic real-time control, and software-defined signal processing.
Design consideration: provide separate power rails for the HPS (typically 1.1V core) and FPGA fabric, and follow Altera's pin connection guidelines to leave unused HPS pins at defined states. Boot configuration (NAND, SD/MMC, QSPI) and HPS-FPGA bridge clocking must be validated against the board bring-up checklist.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes that complement the manufacturer datasheet.
Alternativas drop-in para 5CSXFC6C6U23C8NES — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSXFC6C6U23C8NES (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Logic Elements, Process Technology, DSP Blocks.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSXFC6C6U23C8N
✅ Drop-In✓ Em estoque
$445 / unidade
Ver ficha técnica →5CSXFC6C6U23C7N
✅ Drop-In✓ Em estoque
$215.8 / unidade
Ver ficha técnica →5CSXFC6C6U23C6N
✅ Drop-In✓ Em estoque
$285 / unidade
Ver ficha técnica →5CSXFC6C6U23A7N
✅ Drop-In✓ Em estoque
$328.75 / unidade
Ver ficha técnica →5CSEBA6U23C8N
✅ Drop-In✓ Em estoque
$132 / unidade
Ver ficha técnica →5CSXFC5C6U23C8N
✅ Drop-In✓ Em estoque
$96.75 / unidade
Ver ficha técnica →5CSXFC4C6U23C8N
✅ Drop-In✓ Em estoque
$90 / unidade
Ver ficha técnica →5CSXFC6C6U23C8NES Classificações máximas e características elétricas
| Family | Cyclone V SX |
| Device Type | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Logic Elements | 110,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency (max) | 600 MHz |
| Process Node | 28 nm TSMC low-power |
| Embedded Memory (M10K + MLAB) | 5,140 Kbits (approx) |
| DSP Blocks (18x19 multipliers) | 112 |
| User I/O Pins | 224 |
| Encapsulamento | 672-pin UBGА (23x23 mm) |
| Speed Grade | 8 (commercial) |
| Temperatura de junção de operação | 0C to +85C (commercial) |
| External Memory Interfaces | DDR2, DDR3, LPDDR2 |
| Hard PCIe Gen2 Controllers | 2 |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 5CSXFC6C6U23C8NES 672-pin ubgА (23x23 mm)
Configuração de pinos para 5CSXFC6C6U23C8NES (pacote 672-pin ubgА (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSXFC6C6U23C8NES.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSXFC6C6U23C8NES é adequado para 6 aplicaçãos: Industrial Motor Control, Machine Vision and Video Processing, Automotive Driver Assistance Systems, Industrial IoT Gateways, Software-Defined Radio and Signal Processing, Embedded Server and Appliance Platforms.
Industrial Motor Control
The 5CSXFC6C6U23C8NES is well-suited to industrial motor control because it pairs a dual-core ARM Cortex-A9 HPS at 600 MHz (capable of running a real-time Linux/RTOS control stack) with 112 DSP blocks that accelerate field-oriented control (FOC), space-vector PWM, and current-loop math. With approximately 5,140 Kbits of embedded memory and DDR3 external memory interface support, the part handles encoder feedback buffers and trajectory tables without external SRAM. The 672-UBGA package supports 224 user I/O for multi-axis PWM, encoder inputs, and isolated communication peripherals. For closed-loop stepper or servo drives, the deterministic FPGA fabric implements sub-microsecond current loops while the HPS runs higher-level motion profiling.
Recomendado
Machine Vision and Video Processing
The 5CSXFC6C6U23C8NES is ideal for machine vision pipelines where MIPI CSI-2 or parallel image sensor data must be processed at line rate. The 110K logic elements implement ISP pipelines (debayer, gamma, color correction) while the 112 DSP blocks accelerate convolutional kernels for defect detection. The HPS runs a Linux stack with OpenCV or vendor SDK, exposing vision results over Ethernet. DDR3 interface bandwidth supports 1080p60 pixel streams without external compression, and the 224 user I/O pins accommodate multiple sensor lanes plus GPIO for lighting and trigger synchronization.
Recomendado
Automotive Driver Assistance Systems
The automotive-grade sibling 5CSXFC6C6U23A7N (AEC-Q100 qualified) shares the same 672-UBGA footprint as the 5CSXFC6C6U23C8NES, allowing a single PCB layout to support both commercial and AEC-Q100 variants. This suits forward-facing camera, surround-view, and sensor-fusion ECUs where the dual Cortex-A9 cores run perception algorithms while the FPGA fabric handles deterministic low-latency sensor preprocessing. DDR3 bandwidth and PCIe Gen2 hard IP enable integration with automotive Ethernet and radar front-ends. The extended temperature operation and AEC-Q100 qualification of the A7 variant ensure compliance with automotive reliability requirements.
Recomendado
Industrial IoT Gateways
The 5CSXFC6C6U23C8NES suits ruggedized IIoT gateways because the HPS runs a Linux stack with protocols like OPC-UA, MQTT, and Modbus-TCP while the FPGA fabric implements deterministic industrial bus masters (EtherCAT, PROFINET, EtherNet/IP). The dual Ethernet MACs in the HPS, plus the FPGA I/O flexibility for RS-485, CAN, and isolated digital I/O, allow the part to consolidate multiple legacy interfaces into a single SoC. DDR3 interface and 5,140 Kbits of embedded memory provide the buffers needed for protocol stack and message queuing. The 672-UBGA industrial-grade operation supports factory-floor deployment.
Recomendado
Software-Defined Radio and Signal Processing
The 5CSXFC6C6U23C8NES is well-suited to mid-bandwidth software-defined radio (SDR) platforms where the FPGA fabric implements digital downconversion, channelization, and modulation/demodulation, while the Cortex-A9 cores run the MAC and upper-layer stack. The 112 DSP blocks deliver the GMACs of throughput needed for LTE baseband, public-safety radio, or proprietary RF protocols. External DDR3 memory bandwidth is sufficient for sample buffering at 50-100 MSPS rates. The PCIe Gen2 hard IP enables integration with host processors for higher-layer baseband offload.
Recomendado
Embedded Server and Appliance Platforms
The 5CSXFC6C6U23C8NES can host lightweight embedded server workloads where a low-power SoC with hardware acceleration is preferred over a discrete CPU. The dual Cortex-A9 cores run a minimal Linux distribution for web services, REST APIs, and protocol conversion, while the FPGA fabric accelerates encryption, compression, or packet processing. The two hard Ethernet MACs, two USB 2.0 OTG controllers, and PCIe Gen2 hard IP provide connectivity to storage, peripherals, and external networks. The 28nm low-power process keeps the part attractive for fanless appliances deployed in cabinets or remote sites.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSXFC6C6U23C8NES — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSXFC6C6U23C8N | 5CSXFC6C6U23C7N | 5CSXFC6C6U23C6N | 5CSXFC6C6U23A7N | 5CSEBA6U23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 |
| HPS | Dual Cortex-A9 600 MHz | Dual Cortex-A9 600 MHz | Dual Cortex-A9 600 MHz | Dual Cortex-A9 600 MHz | Dual Cortex-A9 600 MHz | Dual Cortex-A9 600 MHz |
| Speed Grade | C8 | C8 | C7 | C6 | A7 (automotive) | C8 |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SE |
Principais diferenciais
- Highest speed grade available in the SX FC6 family (vs 5CSXFC6C6U23C7N)
- Engineering sample availability for early prototyping (vs 5CSXFC6C6U23C8N)
- Higher logic density than the SE family equivalent (vs 5CSEBA6U23C8N)
Notas de projeto
Estimated: the 5CSXFC6C6U23C8NES requires multiple independent power rails - HPS core (1.1V), FPGA core (1.1V), HPS I/O (1.5V/1.8V/2.5V/3.3V selectable per bank), FPGA I/O banks, and PLL analog supplies. Decoupling requires 0.1uF X7R ceramic caps within 2mm of every power pin plus bulk 10-47uF polymer caps per rail. Power sequencing per Altera AN-580 must be respected or the HPS boot ROM may lock up. Estimate total board power at 5-10W for typical workloads.
The 672-UBGA 23x23 mm package has 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia-in-pad or HDI stackup. Differential pairs (DDR3, PCIe, Ethernet) must be routed with 100 ohm differential impedance and length-matched to within 25 mil. HPS DDR3 traces require matched-length (within 50 ps) and dedicated ground reference planes. Follow the Cyclone V device handbook pin connection guidelines to leave unused HPS balls at defined states to avoid boot failure.
The commercial speed grade 8 device operates 0C to +85C junction temperature. With ~5-10W typical dissipation, a thermal pad connected to the central ground balls and an exposed copper inner layer or bottom heatsink is recommended for closed-enclosure designs. Junction temperature should be verified using the Quartus Prime PowerPlay thermal model during board bring-up. Industrial and automotive grades (A7) extend operation to higher temperatures.
Common pitfalls when bringing up a 5CSXFC6C6U23C8NES include: (1) incorrect MSEL[2:0] boot configuration for the chosen boot device (NAND/SD/QSPI), (2) forgetting to enable HPS-to-FPGA bridges in the preloader before Linux boot, (3) overlooking pin multiplexing - the HPS peripherals share pins and must be assigned via the pin planner, and (4) not terminating unused clock inputs. Always validate with Altera's Cyclone V SoC development kit reference design before committing to layout.
Informações de conformidade
ES suffix is engineering sample - not for production. RoHS compliant per Intel/Altera product page. For automotive, use the A7 suffix variant 5CSXFC6C6U23A7N (AEC-Q100 qualified).
