5CSXFC5C6U23C8N - Cyclone V SX SoC FPGA 85K LE 600MHz | Intel
N.º da peça: 5CSXFC5C6U23C8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.25 | $1.282,50 |
| 100 | $115.8 | $11.580,00 |
| 500 | $104.2 | $52.100,00 |
| 1.000 | $96.75 | $96.750,00 |
5CSXFC5C6U23C8N Visão geral
An SoC FPGA is a single silicon device that tightly couples a general-purpose application processor subsystem with a programmable logic fabric, allowing deterministic hardware acceleration alongside software running on a standard OS such as Linux or RTOS. In the broader taxonomy, the 5CSXFC5C6U23C8N belongs to FPGA family -> programmable logic -> logic IC -> integrated circuit. The 'Cyclone V' positioning places it as a low-power, cost-optimized family within Intel's (formerly Altera's) FPGA portfolio, sitting below Cyclone 10 and above legacy Cyclone IV in capability, and pairing against Xilinx Zynq-7000 family in SoC FPGA market.
Key differentiating features of this part include: 85,000 logic elements, 3,207 LABs (Logic Array Blocks), 145 maximum user I/O pins, 3.125 Gbps integrated transceivers, hardware DDR3 controller in the HPS, and configurable analog PLLs. The 'C8' speed grade targets a balance between Fmax and power; 'U23' denotes the 672-pin UBGAFBGA package; 'N' indicates a lead-free / RoHS-compliant terminal finish.
The architecture splits resources between HPS (dual ARM Cortex-A9 up to 600 MHz, NEON, FPU, L1/L2 caches, peripherals including EMAC, USB, NAND, SD/MMC) and FPGA fabric (85K LE, M10K memory blocks, MLAB, variable-precision DSP blocks, hard memory controllers for DDR3). The HPS-to-FPGA bridges (AXI bridges) deliver high-bandwidth, low-latency coupling measured in gigabytes per second.
Typical applications include industrial motor control and machine vision, factory automation PLCs, automotive driver-assistance proof-of-concept, video surveillance with hardware-accelerated codecs, and medical imaging pre-processing. The integrated transceivers support PCIe Gen2 x4 and gigabit Ethernet connectivity, while the DDR3 controller enables high-throughput image buffer memory.
Design consideration: the 23x23 mm BGA package requires careful PCB stack-up planning (typically 1.0-1.5 mm pitch microvia stack-ups on 8-12 layer boards), matched-length routing for DDR3 and transceiver channels, and thermal management because peak junction-to-ambient thermal resistance can be challenging at full HPS+FPGA utilization.
This page synthesizes current distributor inventory, same-family drop-in alternatives drawn from the Intel/Altera Cyclone V SX ordering-code matrix, and practical design notes not consolidated in the manufacturer datasheet - offering faster sourcing decisions than bare datasheet lookup.
Alternativas drop-in para 5CSXFC5C6U23C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSXFC5C6U23C8N (mesmo formato e footprint) — diferindo em Package, DSP Blocks, Logic Elements, Transceivers, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSXFC5C6U23C7N
✅ Drop-In✓ Em estoque
$348 / unidade
Ver ficha técnica →5CSXFC5C6U23C6N
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →5CSXFC5C6U23I7N
✅ Drop-In✓ Em estoque
$210 / unidade
Ver ficha técnica →5CSXFC5C6U23A7N
✅ Drop-In✓ Em estoque
$64.4 / unidade
Ver ficha técnica →5CSXFC4C6U23C8N
✅ Drop-In✓ Em estoque
$90 / unidade
Ver ficha técnica →5CSXFC5C6U23C8N
✅ Drop-In✓ Em estoque
$96.75 / unidade
Ver ficha técnica →5CSXFC5C6U23C8N Classificações máximas e características elétricas
| Family | Cyclone V SX |
| Device Variant | 5CSXFC5 (5CSXC5 logic density) |
| Logic Elements | 85,000 |
| Logic Array Blocks (LABs) | 3,207 |
| Maximum User I/O Pins | 145 |
| HPS Processor Cores | Dual ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| Temperatura de operação | 0 C to +85 C (commercial) |
| Encapsulamento | 672-pin UBGAFBGA (23x23 mm) |
| Integrated Transceivers | 3.125 Gbps |
| Hard Memory Controller | DDR3 (HPS side) |
| Speed Grade | C8 |
| Lead-Free / RoHS | Yes |
Guia de Configuração de Pinos do 5CSXFC5C6U23C8N 672-pin ubgafbga (23x23 mm)
Configuração de pinos para 5CSXFC5C6U23C8N (pacote 672-pin ubgafbga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSXFC5C6U23C8N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSXFC5C6U23C8N é adequado para 6 aplicaçãos: Industrial Machine Vision Systems, Motor Control and Industrial Automation, Video Surveillance and Image Processing, Automotive ADAS Prototyping, Medical Imaging Pre-Processing, Software-Defined Radio and Communication Baseband.
Industrial Machine Vision Systems
The 5CSXFC5C6U23C8N's 85K logic elements and dual ARM Cortex-A9 HPS at 600 MHz make it well-suited for industrial machine vision where high-throughput image processing meets deterministic low-latency control. The integrated HPS runs Linux/Qt for camera configuration, HMI rendering, and Ethernet protocols, while the FPGA fabric accelerates Bayer-to-RGB demosaicing, edge detection, and object classification at line-rate. The 3.125 Gbps transceivers accept GigE Vision or CoaXPress data directly, and the DDR3 controller inside the HPS provides a high-bandwidth frame buffer. Designers should leverage the hard ARM cores to offload command handling from the FPGA fabric, reserving logic resources for pixel pipeline parallelism.
Recomendado
Motor Control and Industrial Automation
In motor control applications the 5CSXFC5C6U23C8N combines ARM Cortex-A9 software for higher-level PLC logic and fieldbus protocols (EtherCAT, PROFINET) with FPGA fabric implementing deterministic PWM generation, encoder decoding, and field-oriented control (FOC) loops at sub-microsecond latency. The 145 user I/O pins accommodate multiple encoder interfaces, current-sense ADCs, and gate-driver signals. Industrial temperature variants (5CSXFC5C6U23I7N) extend operation to -40 C to +100 C for factory-floor deployment. Compared with discrete MCU+ASIC designs, the SoC FPGA collapses the BOM and allows firmware updates without spinning new hardware.
Recomendado
Video Surveillance and Image Processing
The 5CSXFC5C6U23C8N supports multi-channel HD video pipelines by combining FPGA-side variable-precision DSP blocks for H.264 compression, motion detection, and deinterlacing with the HPS running network stacks and analytics software. Its 3.125 Gbps transceivers interface to MIPI-CSI, HDMI receivers, or Ethernet PHYs; the DDR3 hard controller provides a frame buffer up to 4 Gbit external. At 600 MHz the Cortex-A9 cores handle metadata, ONVIF streaming, and storage management. The UBGAFBGA-672 footprint supports the higher I/O count needed for parallel video buses and SDI serializers.
Recomendado
Automotive ADAS Prototyping
The Cyclone V SX family including 5CSXFC5C6U23C8N is widely used in pre-production automotive driver-assistance system (ADAS) prototyping where the dual ARM Cortex-A9 runs sensor-fusion software and the FPGA fabric implements camera/LiDAR pre-processing, sensor timestamping, and low-latency CAN-FD bridging. The integrated 3.125 Gbps transceivers handle automotive Ethernet (100BASE-T1 / 1000BASE-T1) and serializer-deserializer links to remote radar modules. Note: for production AEC-Q100 qualified designs, designers must migrate to the A7 speed grade (5CSXFC5C6U23A7N); the C8 commercial grade is for development and proof-of-concept only.
Recomendado
Medical Imaging Pre-Processing
In ultrasound, endoscopy, and patient-monitoring equipment, the 5CSXFC5C6U23C8N delivers deterministic hardware acceleration for beamforming, FFT-based spectral analysis, and noise filtering while the ARM cores handle DICOM packaging, touchscreen UI, and USB/Ethernet connectivity. The FPGA fabric's variable-precision DSP blocks enable single-cycle multiply-accumulate for FIR/IIR filter chains, and the HPS DDR3 controller buffers raw RF data streams at gigabytes per second. Compared with DSP-only or MCU-only designs, the SoC FPGA reduces latency between beamformer and display, which is critical in real-time ultrasound. Commercial-grade (C8) suits bedside cart equipment; the I7 variant is needed for unattended or sterilizable enclosures.
Recomendado
Software-Defined Radio and Communication Baseband
The 5CSXFC5C6U23C8N is widely deployed in small-cell, femtocell, and private-LTE baseband prototyping because its 3.125 Gbps transceivers digitize RF I/Q streams from front-end converters, while the FPGA fabric implements channel coding (Turbo, LDPC), FFT/IFFT for OFDM, and crest-factor-reduction filters at line rate. The dual ARM Cortex-A9 host the L2/L3 stack, MAC scheduler, and OAM agent, connected to the FPGA via AXI bridges with multi-gigabyte-per-second throughput. Compared with discrete ASIC + NPU designs, the SoC FPGA allows late-binding standard updates (e.g., 5G NR features) without silicon respin, critical for private-network rollouts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSXFC5C6U23C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSXFC5C6U23C7N | 5CSXFC5C6U23C6N | 5CSXFC5C6U23I7N | 5CSXFC4C6U23C8N | 5CSXFC5C6U23A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGAFBGA (U23, 23x23 mm) | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | ~65,000 (-24%) | 85,000 |
| HPS Processor Cores | Dual ARM Cortex-A9 600 MHz | Dual ARM Cortex-A9 ~925 MHz device perf | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | C8 (commercial) | C7 (faster) | C6 (slower, lower cost) | I7 (industrial -40C to +100C) | C8 (commercial) | A7 (automotive AEC-Q100) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +125 C (automotive) |
| Process Technology | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power |
| Transceivers (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Industrial temperature option in same package (vs 5CSXFC5C6U23C8N (commercial) vs 5CSXFC5C6U23I7N (industrial))
- Drop-in C7 speed grade upgrade path (vs 5CSXFC5C6U23C8N vs 5CSXFC5C6U23C7N)
- Automotive-grade variant available (vs 5CSXFC5C6U23C8N (commercial) vs 5CSXFC5C6U23A7N (AEC-Q100))
Notas de projeto
The 672-ball UBGAFBGA at 23x23 mm requires a high-density PCB stack-up. Use at least 8 layers with 1.0-1.5 mm pitch microvia stack-ups (laser-drilled vias with sequential lamination). Assign a solid ground plane directly beneath the BGA and stitch ground vias around the perimeter to provide a low-impedance return path for transceivers and DDR3 signals. Matched-length routing within +/-25 mils is required for DDR3 byte lanes; use the Quartus Prime pin planner early to constrain I/O bank placement.
Estimated: at full HPS + 70% FPGA utilization, the 5CSXFC5C6U23C8N dissipates approximately 3-5 W total. With theta_JA around 15-20 C/W for the UBGAFBGA-672 package (depends on PCB copper area), junction temperature rise above ambient is roughly 50-90 C. For commercial (C8) at 85 C ambient this leaves little margin; for industrial (I7) at 100 C ambient, add a small heatsink or thermal via array under the package thermal pad. Use the Quartus Prime PowerPlay early estimator for accurate budgeting.
Do not confuse the '5CSXFC5' device variant with the '5CSEBA5' (Cyclone V SE SoC) - both have HPS but the SX family has integrated transceivers while the SE family has more logic and DSP. Verify your design needs SX transceivers before selecting. Also, the C8 speed grade is commercial only - for production hardware with industrial temperature requirements, switch to I7 or I8 before PCB fab; C8 parts will fail screening at temperature extremes.
Informações de conformidade
The C8 speed grade is commercial grade and not AEC-Q100 qualified; migrate to the A7 variant (5CSXFC5C6U23A7N) for automotive production. RoHS/REACH/halogen-free status per Intel material declaration. CMRT available from Intel Product Compliance portal.
