5CSXFC4C6U23I7N - Cyclone V SX SoC FPGA, 40K LE, 672-UBGA | Intel
N.º da peça: 5CSXFC4C6U23I7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $269 | $2.690,00 |
| 100 | $245 | $24.500,00 |
| 500 | $219 | $109.500,00 |
| 1.000 | $195 | $195.000,00 |
5CSXFC4C6U23I7N Visão geral
A SoC FPGA is a device that combines a general-purpose processor (typically ARM Cortex-A) with programmable FPGA fabric on a single die. This integration enables hardware acceleration of compute-intensive functions while running software on the application cores. In the broader taxonomy, the 5CSXFC4C6U23I7N sits within FPGA and CPLD > SoC FPGA > embedded processor + programmable logic. The Cyclone V SX family specifically targets cost- and power-sensitive applications that benefit from heterogeneous processing, such as industrial motor control, video processing, and software-defined radio.
Key differentiating specifications include 85,000 logic cells (per the FindIC datasheet PDF), 800 MHz maximum processor clock, dual ARM Cortex-A9 cores with NEON media engine and single/double precision floating-point unit, on-chip MPU subsystem with DDR3/DDR3L/LPDDR2 controller, 3.125 Gbps transceivers not present (the SX variant excludes transceivers to minimize power), and a hardened peripheral set including USB 2.0 OTG, EMAC, UART, SPI, I2C, and CAN. The 672-ball UBGA package supports high I/O density for industrial backplane designs.
The Cyclone V SX architecture pairs the FPGA fabric with the Hard Processor System (HPS) through three coherent bridges: FPGA-to-SDRAM, FPGA-to-HPS, and HPS-to-FPGA. This enables the FPGA fabric to access the same DDR memory used by the ARM cores with high bandwidth, critical for data-plane acceleration. The process technology is TSMC 28 nm low-power, and the device is supported by Quartus Prime design software.
Typical applications include industrial motor control drives (where the FPGA implements high-speed control loops while the ARM cores run field-oriented control software), machine vision and video surveillance (the FPGA handles image preprocessing while the ARM cores run analytics), software-defined radio baseband (FPGA for signal processing, ARM for protocol stack), portable medical imaging (low-power SoC FPGA enables battery-powered operation), and factory automation controllers.
When designing with this part, ensure proper decoupling on all HPS and FPGA power rails (typically 0.9 V, 1.1 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), and follow Intel's PCB layout guidelines for UBGA packages. The HPS can boot from QSPI flash, SD card, or NAND; selection is done via boot mode pins. The device is available in industrial temperature grade (-40C to +100C junction). This page synthesizes distributor pricing, drop-in alternatives within the Cyclone V SX family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para 5CSXFC4C6U23I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSXFC4C6U23I7N (mesmo formato e footprint) — diferindo em Package, Transceivers, DSP Blocks, Logic Elements, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSXFC4C6U23I7LN
✅ Drop-In✓ Em estoque
$312.4 / unidade
Ver ficha técnica →5CSXFC4C6U23C8N
✅ Drop-In✓ Em estoque
$90 / unidade
Ver ficha técnica →5CSXFC4C6U23C7N
✅ Drop-In✓ Em estoque
$64.95 / unidade
Ver ficha técnica →5CSXFC2C6U23I7N
✅ Drop-In✓ Em estoque
$285 / unidade
Ver ficha técnica →5CSXFC6C6U23A7N
✅ Drop-In✓ Em estoque
$328.75 / unidade
Ver ficha técnica →5CSEBA6U23I7N
✅ Drop-In✓ Em estoque
$51.8 / unidade
Ver ficha técnica →5CSXFC4C6U23I7N Classificações máximas e características elétricas
| Family | Cyclone V SX |
| Architecture | SoC FPGA (ARM Cortex-A9 + FPGA fabric) |
| Logic Elements | 40,000 |
| Logic Cells | 85,000 |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Max Frequency | 800 MHz |
| Process Technology | 28 nm low-power (TSMC) |
| Core Supply Voltage | 1.1 V |
| User I/O Count | 224 |
| Encapsulamento | 672-UBGA (23x23 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (Industrial) |
| Status RoHS | Compliant |
| Hard Processor System (HPS) | Integrated dual-core ARM Cortex-A9 |
| Transceivers | Not present (SX variant) |
Guia de Configuração de Pinos do 5CSXFC4C6U23I7N 672-ubga (23x23 mm)
Configuração de pinos para 5CSXFC4C6U23I7N (pacote 672-ubga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSXFC4C6U23I7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSXFC4C6U23I7N é adequado para 7 aplicaçãos: Industrial Motor Control Drives, Machine Vision and Video Surveillance, Software-Defined Radio Baseband, Portable Medical Imaging, Factory Automation Controllers, Avionics and Aerospace Embedded Computing, Broadcast and Pro-AV Equipment.
Industrial Motor Control Drives
The 5CSXFC4C6U23I7N excels in industrial motor control drives where its FPGA fabric implements high-speed current and torque control loops - PWM generation, encoder decoding, and oversampled ADC interfacing - while the dual ARM Cortex-A9 cores at 800 MHz run field-oriented control (FOC) software. The 28 nm low-power process keeps thermal dissipation manageable in sealed IP65 enclosures, and the industrial -40C to +100C operating range handles factory floor ambient swings. With 224 user I/O, the device drives multi-axis servo systems from a single chip, replacing the legacy architecture of separate DSP + MCU + FPGA. Quartus Prime and SoC EDS toolchains support the HPS-FPGA split for deterministic real-time motor control.
Recomendado
Machine Vision and Video Surveillance
The 5CSXFC4C6U23I7N is well suited for machine vision and IP video surveillance applications where the FPGA fabric handles pixel-rate preprocessing (noise reduction, lens distortion correction, edge detection) while the dual ARM Cortex-A9 cores run analytics algorithms (motion detection, person recognition, video encoding). The HPS DDR3 controller with bandwidth shared via coherent bridges allows the FPGA fabric to write processed frames directly to system memory without DMA overhead. The 672-ball UBGA provides high I/O count for parallel image sensor interfaces and HDMI/MIPI bridge connections. Power efficiency from the 28 nm process enables fanless embedded camera designs.
Recomendado
Software-Defined Radio Baseband
The 5CSXFC4C6U23I7N enables software-defined radio baseband designs where the FPGA fabric executes signal processing kernels (FFT, channelization, demodulation) at sample rates up to hundreds of MHz, while the dual ARM Cortex-A9 cores run the MAC layer and protocol stack. The hard memory controller and DDR3 interface provide the memory bandwidth required for sample buffering. Note that the SX variant excludes transceivers - external ADC/DAC with parallel LVDS connects to FPGA I/O. The industrial temperature range and low-power 28 nm process suit outdoor base station deployments.
Recomendado
Portable Medical Imaging
The 5CSXFC4C6U23I7N fits portable medical imaging systems (point-of-care ultrasound, handheld endoscopy) where low power consumption and dual-core processing are essential. The FPGA fabric implements beamforming and digital signal conditioning for ultrasound transducers at low latency, while the ARM Cortex-A9 cores drive the user interface and DICOM network stack. The 1.1 V core supply voltage draws minimal current from battery packs, and the SoC integration eliminates a separate processor chip to meet size and BOM constraints for handheld medical devices.
Recomendado
Factory Automation Controllers
The 5CSXFC4C6U23I7N serves as the central controller in factory automation systems where it interfaces with industrial Ethernet protocols (PROFINET, EtherCAT, EtherNet/IP) through the FPGA fabric while running real-time control logic on the ARM Cortex-A9 cores. The 224 user I/O accommodate digital and analog field device connections, and the hardened peripheral set (USB 2.0 OTG, EMAC, UART, SPI, I2C, CAN) simplifies integration with motor drives, sensors, and HMIs. Industrial -40C to +100C operation tolerates cabinet temperatures.
Recomendado
Avionics and Aerospace Embedded Computing
The 5CSXFC4C6U23I7N supports avionics and aerospace embedded computing roles requiring ARINC 429, MIL-STD-1553, or custom avionics bus interfaces implemented in the FPGA fabric alongside ARM Cortex-A9 software processing. The industrial temperature grade and radiation-tolerant packaging options suit unmanned aerial vehicle (UAV) flight controllers, where size, weight, and power (SWaP) constraints favor SoC integration over separate FPGA + processor boards. The hardened HPS runs flight control software deterministically while the FPGA handles sensor fusion at high sample rates.
Recomendado
Broadcast and Pro-AV Equipment
The 5CSXFC4C6U23I7N enables broadcast video routers, professional audio mixers, and pro-AV signal processors where the FPGA fabric handles multi-format video scaling, color space conversion, and audio embedding at line rates, while the ARM Cortex-A9 cores manage IP-based control protocols (Dante, AVB, NMOS). The dual-core HPS supports Linux for network management and a real-time OS for deterministic audio/video processing. The 672-UBGA package supports the high I/O count required for multi-channel broadcast equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSXFC4C6U23I7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSXFC4C6U23I7LN | 5CSXFC4C6U23C8N | 5CSXFC4C6U23C7N | 5CSXFC2C6U23I7N | 5CSXFC6C6U23A7N | 5CSEBA6U23I7N |
|---|---|---|---|---|---|---|---|
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SE |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 | 110,000 | 110,000 |
| Processor | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz (C8 speed) | Dual ARM Cortex-A9 @ 800 MHz (C7 speed) | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 925 MHz |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial, lead-free) | 0C to 85C (Commercial, C8 speed) | 0C to 85C (Commercial, C7 speed) | -40C to +100C (Industrial) | -40C to +125C (Automotive) | -40C to +100C (Industrial) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| User I/O | 224 | 224 | 224 | 224 | 224 | 224 | 224 |
Principais diferenciais
- Same 672-UBGA U23 footprint as higher-density C6 variant (vs 5CSXFC6C6U23A7N)
- Industrial temperature grade at C7/C8 speed (vs 5CSXFC4C6U23C7N)
- Dual-core ARM Cortex-A9 vs Cyclone V SE single-core (vs 5CSEBA6U23I7N)
Notas de projeto
The 5CSXFC4C6U23I7N requires multiple supply rails: 0.9 V for HPS cores, 1.1 V for FPGA core, 1.5 V/1.8 V/2.5 V/3.3 V for I/O banks, plus a 2.5 V analog supply for PLLs. Per Intel's Cyclone V SX power management user guide, use a dedicated sequencer such as the LTC2974 or equivalent to enforce safe power-up/power-down ordering - failure to do so can cause latch-up. Decoupling requires at least 100 nF X7R per power pin plus bulk 22 uF tantalums per rail.
At typical utilization (60% logic + dual-core HPS active), power dissipation is approximately 3-5 W depending on toggle rate. The 672-UBGA package has theta_JA around 12 C/W on a 4-layer 1 oz PCB with adequate thermal vias. For sealed enclosures without forced airflow, attach a small heatsink (e.g., 15x15 mm) directly to the package top. Confirm the junction temperature stays below 100C using Quartus Prime's PowerPlay thermal analysis.
Use Intel's U23 package ball map and follow the recommended footprint in the Cyclone V device datasheet. The UBGA balls are 1.0 mm pitch - route with 8 mil traces and breakout vias at the ball periphery. Route DDR3 signals with matched lengths (CLK to DQS within 50 ps) and use 100 ohm differential impedance for the HPS RGMII interface. Place 0.1 uF decoupling capacitors on the BOTTOM side directly under their respective power balls to minimize loop inductance.
Do not confuse the SX variant (no transceivers) with the ST variant (3.125 Gbps transceivers) - the pinout is different. The SX package is U23; ST parts use a different package. Always verify the device family code in the OPN: SX = SoC without transceivers, ST = SoC with transceivers. Boot mode selection via MSEL pins must match the desired boot source (QSPI, SD, NAND, JTAG); wrong MSEL settings result in no-boot symptoms. Use the SoC EDS tool to validate HPS-FPGA bridge configurations before generating the preloader.
For high-speed LVDS interfaces (e.g., external ADC connections on FPGA I/O banks), maintain 100 ohm differential impedance and use length matching within 10 ps. Place LVDS pairs on the same column of UBGA balls to minimize skew. The HPS RGMII to external Ethernet PHY must also use length-matched routing; the HPS provides dedicated RGMII pins but does NOT have internal skew compensation, so external trace tuning is mandatory.
Informações de conformidade
RoHS compliant per Intel product page. The standard 5CSXFC4C6U23I7N is industrial grade; the Q1-suffixed automotive variant is not listed for this exact OPN, but the related 5CSXFC6C6U23A7N is AEC-Q100 qualified.