5CSXFC6C6U23C8N - Cyclone V SX SoC FPGA, 110K LE, ARM Cortex-A9 | Intel
MPN: 5CSXFC6C6U23C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $612.5 | $612.50 |
| 10 | $580 | $5,800.00 |
| 100 | $535 | $53,500.00 |
| 500 | $488 | $244,000.00 |
| 1,000 | $445 | $445,000.00 |
Drop-in alternatives for 5CSXFC6C6U23C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSXFC6C6U23C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX (SoC FPGA) |
| Series | Cyclone V SX |
| Architecture | MCU + FPGA (Hard Processor System + FPGA fabric) |
| Logic Elements | 110,000 |
| Process Technology | 28 nm low-power (TSMC) |
| Core Voltage | 1.1 V |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 600 MHz |
| HPS L1 Cache | 32 KB instruction + 32 KB data per core |
| HPS L2 Cache | 512 KB shared |
| DSP Blocks | Variable-precision DSP (number not specified in retrieved data) |
| Transceivers | Up to 3.125 Gbps integrated transceivers |
| Memory Controller | Hard controller supporting DDR2, DDR3, LPDDR2 |
| Package | 672-pin UFBGA (UBGA), 23x23 mm |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +100C (industrial grade, code C) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for large BGA) |
| RoHS Status | Compliant |
| Speed Grade | C8 (commercial speed grade 8) |
| Lifecycle | Active (Cyclone V family in production) |
5CSXFC6C6U23C8N 672-pin ufbga (ubga), 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSXFC6C6U23C8N (672-pin ufbga (ubga), 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6C6U23C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC6C6U23C8N is suitable for 6 applications: Industrial Motor Control, Factory Automation Gateways, Medical Imaging Pre-Processing, Video Surveillance Encoders, Software-Defined Radio Baseband, Smart Energy / Grid Management.
Industrial Motor Control
The 5CSXFC6C6U23C8N is well suited for industrial motor drives because the SX family integrates transceivers up to 3.125 Gbps for high-speed encoder feedback and fieldbus connectivity such as EtherCAT or Profinet. The dual-core ARM Cortex-A9 hard processor system runs real-time control loops or a Linux + RTOS split, while the 110K logic-element FPGA fabric handles deterministic field-oriented control (FOC) and current-loop PWM at sub-microsecond latency. The hard DDR3 controller with ECC enables fast current-sampling buffer storage and lookup tables for sinusoidal commutation. Per the Cyclone V device datasheet, industrial-grade silicon supports operation from -40C to +100C junction, suitable for cabinet-mounted drives. The part's combination of FPGA flexibility and HPS compute delivers a single-chip solution that would otherwise require a discrete MCU plus FPGA pair.
Recommended
Factory Automation Gateways
For factory automation gateways, the 5CSXFC6C6U23C8N's dual-core ARM Cortex-A9 runs OPC-UA, MQTT, or Modbus-TCP stacks while the FPGA fabric accelerates protocol conversion between legacy fieldbus (RS-485, CAN, Profibus) and Ethernet. The integrated transceivers enable direct connection to industrial Ethernet PHYs without an external PHY, reducing BOM and board area. With 110K logic elements, the FPGA can implement multiple protocol bridges in parallel with deterministic latency. Per the Cyclone V device datasheet, the HPS peripherals include dual Gigabit Ethernet MACs, USB 2.0 OTG, and SD/MMC, providing comprehensive gateway connectivity in a single chip. Industrial temperature grade ensures reliability in cabinet environments with extended thermal stress.
Recommended
Medical Imaging Pre-Processing
In medical imaging systems such as ultrasound or endoscopy pre-processing, the 5CSXFC6C6U23C8N's 110K LE FPGA fabric and variable-precision DSP blocks handle real-time pixel pipelines, beamforming, and noise filtering. The dual-core ARM Cortex-A9 manages user-interface rendering and network connectivity (DICOM over Ethernet) while offloading heavy DSP to the FPGA. The hard DDR3 controller provides high-bandwidth memory access for image frame buffers, and the integrated transceivers support high-speed sensor interfaces such as MIPI-CSI or LVDS-based camera links. Per the Cyclone V device datasheet, medical designs benefit from the deterministic latency of FPGA-accelerated DSP and the flexible HPS that runs Linux for DICOM stack and touch UI.
Recommended
Video Surveillance Encoders
The 5CSXFC6C6U23C8N serves as a single-chip video encoder for IP surveillance cameras, with the FPGA fabric implementing H.264/H.265 encode at 1080p60 and the Cortex-A9 cores managing network streaming, motion detection analytics, and SD-card recording. The hard DDR3 controller holds reference frames for the encoder, and the integrated transceivers connect directly to Gigabit Ethernet PHYs without an external MAC chip. With 110K logic elements, the FPGA can run multiple encode streams simultaneously for multi-channel NVR systems. Per the Cyclone V device datasheet, the HPS peripherals include SATA and USB for local storage, making the part suitable for edge-recording NVRs. The industrial temperature grade supports outdoor enclosure operation.
Recommended
Software-Defined Radio Baseband
For software-defined radio baseband processing, the 5CSXFC6C6U23C8N's integrated transceivers interface directly with RF front-end ADCs/DACs at sample rates up to several hundred MSPS, while the FPGA fabric implements channelizers, modulators, and forward-error-correction in real time. The dual-core ARM Cortex-A9 handles higher-layer protocol stacks and TCP/IP offload, with the 110K LE providing enough logic for narrowband waveforms or multi-channel receiver banks. Per the Cyclone V device datasheet, the SX sub-family supports CPRI and OBSAI protocols commonly used in small-cell base stations. The DDR3 controller provides high-bandwidth sample buffering, and the industrial temperature grade supports outdoor small-cell deployment.
Recommended
Smart Energy / Grid Management
In smart-grid applications such as substation controllers and energy-management gateways, the 5CSXFC6C6U23C8N provides the combination of HPS compute for protocol stacks (IEC 61850, DNP3, Modbus) and FPGA fabric for fast tripping logic in protection relays. The integrated transceivers support high-speed Ethernet for process bus communication, and the hard DDR3 controller holds event logs and fault records. With 110K logic elements, the FPGA can implement multiple IEC 61850-9-2 sampled-value streams and parallel IED interfaces. Per the Cyclone V device datasheet, the industrial temperature grade ensures reliability in unconditioned substation environments. The single-chip integration reduces MTBF-critical component count relative to discrete MCU plus FPGA solutions, an important factor in grid reliability.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6C6U23C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6C6U23C7N | 5CSXFC6C6U23C6N | 5CSXFC6C6U23A7N | 5CSXFC5C6U23C8N | 5CSXFC4C6U23C8N |
|---|---|---|---|---|---|---|
| Package | 672-pin UFBGA (U23), 23x23 mm | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same | 672-pin UFBGA (U23) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 | 60,000 |
| Speed Grade | C8 | C7 (faster) | C6 (fastest) | A7 (industrial) | C8 (same) | C8 (same) |
| Hard Processor System | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz | Dual-core ARM Cortex-A9, 600 MHz |
| Integrated Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Memory Controller | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC | DDR2/DDR3/LPDDR2 with ECC |
| Operating Temperature | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code A) | -40C to +100C (industrial grade, code C) | -40C to +100C (industrial grade, code C) |
| Approx. Unit Price @ qty 1 (USD) | 612.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density drop-in option with same speed grade (vs 5CSXFC5C6U23C8N)
- Speed grade C8 is the most economical option in the same-density tier (vs 5CSXFC6C6U23C7N)
- Cyclone V SX adds integrated transceivers unavailable on SE (vs 5CSEBA6U23C8N)
Design Notes
The 672-pin UFBGA package requires JEDEC J-STD-020 compliant PCB land patterns with 0.8 mm ball pitch and microvia-in-pad recommended for breakout. A 1-2-1 or 2-4-2 stack-up with buried capacitance in the core is recommended for the simultaneous-switching outputs (SSO) of the HPS peripheral buses. Per Intel's Cyclone V PCB design guidelines, all transceiver lanes should route on a top-layer microstrip with continuous reference ground, and the HPS-to-FPGA bridges (AXI) should route on inner stripline layers with controlled impedance.
The 5CSXFC6C6U23C8N requires multiple supply rails: VCC (1.1 V core), VCCIO for each I/O bank (1.2/1.5/1.8/2.5/3.3 V), VCCPD, VCCPGM, VCCA_PLL, VCCD_PLL, and separate VCC_HPS, VCC_HPS_IO, VCC_HPS_PLL. Per Intel's Cyclone V pin connection guidelines, each rail should be decoupled with 0.1 uF X7R ceramics adjacent to every supply pin, plus bulk 10-47 uF tantalum or polymer capacitors. Power sequencing requires VCC before VCCIO and VCCPD; failure to sequence correctly can cause latch-up. Use a dedicated power-management IC such as an LTC3612 or similar multi-rail PMIC.
Estimated: at 110K LE utilization (~70%) and HPS at full load, the 5CSXFC6C6U23C8N dissipates approximately 4-6 W of total power. The 672-pin UFBGA thermal resistance (theta_JB) is approximately 4 C/W per Intel's package thermal model; junction-to-ambient with 4-layer 23x23 mm PCB and minimum 25 mm^2 thermal via array is approximately 12-15 C/W. Maximum junction temperature is 100C for industrial grade. Designers must place thermal vias under the central BGA array and connect them to internal copper planes for heat spreading; a heatsink is rarely needed for typical industrial designs but may be required if HPS compute load is sustained above 80% utilization.
A common pitfall is failing to assign the HPS boot configuration pins correctly: the BSEL pins select QSPI, SD/MMC, NAND, or FPGA-bypass boot mode and must be pulled high or low per the design's chosen boot source. Another pitfall is overlooking the HPS-to-FPGA bridge clock-domain crossing, which can cause intermittent AXI transaction failures if the bridge clock is not derived from a common PLL. Per Intel's Cyclone V HPS chapter, the FPGA fabric should not drive the HPS warm-reset_n or cold-reset_n pins without proper handshaking through the reset manager. Finally, ignore the JTAG chain at your peril: the HPS and FPGA fabric share TCK/TMS/TDI/TDO but each has its own TAP controller that must be enumerated correctly in the Quartus BSD file.
Compliance Information
RoHS compliant and lead-free per Intel Altera product page and distributor listings. Halogen-free status not explicitly stated in retrieved data ([DATA_NEEDED]). AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part; refer to Cyclone V automotive variants for AEC-Q100 options.
