A3PE3000-2FGG896I - 3M Gate ProASIC3E FPGA | Microchip
N.º da peça: A3PE3000-2FGG896I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1819.44 | $1.819,44 |
| 10 | $1728.47 | $17.284,70 |
| 100 | $1642.05 | $164.205,00 |
| 500 | $1560.95 | $780.475,00 |
| 1.000 | $1482.9 | $1.482.900,00 |
A3PE3000-2FGG896I Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs and microprocessors in the digital design hierarchy. The ProASIC3E family uses flash-based configuration, meaning the device retains its programming without external boot memory, offering instant-on capability and enhanced security compared to SRAM-based FPGAs.
Key features include 3 million system gates, 75,264 logic modules (VersaTiles), 620 user I/Os, and 516,096 bits of embedded RAM. The device supports system performance up to 310 MHz and is manufactured on a 130nm flash process. It offers low power consumption with a typical static power of 0.24W, making it suitable for power-sensitive applications. The flash-based architecture provides inherent security against reverse engineering and supports in-system programming (ISP) for field updates.
The ProASIC3E architecture uses a proprietary VersaTile that can be configured as either a three-input lookup table (LUT) or a D-flip-flop/latch with enable, allowing efficient use of the FPGA fabric. This flexibility enables designers to implement both combinational and sequential logic efficiently. The device also includes dedicated phase-locked loops (PLLs) for clock management and supports various I/O standards including LVCMOS, LVTTL, PCI, and LVDS.
Typical applications include industrial control systems, communications infrastructure, avionics, and consumer electronics. The flash-based nature makes it ideal for applications requiring secure boot, instant-on operation, and high reliability in harsh environments. The 896-ball FBGA package provides ample I/O for complex designs while maintaining a compact footprint.
When designing with this device, consider the 1.5V core supply requirement and ensure adequate decoupling on all power pins. The device supports JTAG-based programming and can be configured via SPI or I2C interfaces. For high-speed designs, pay attention to the PLL configuration and I/O standard selection to meet timing requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-2FGG896I.
Alternativas drop-in para A3PE3000-2FGG896I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000-2FGG896I (mesmo formato e footprint) — diferindo em Process Technology, Configuration Memory, Operating Temperature, Package, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000-2FG896I
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →M1A3PE3000L-1FGG896I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE3000-1FGG896I
✅ Drop-In✓ Em estoque
$219 / unidade
Ver ficha técnica →A3PE3000-2FGG484I
✅ Drop-In✓ Em estoque
$89.4 / unidade
Ver ficha técnica →A3PE3000L-1FGG896I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE3000-2FGG896I Classificações máximas e características elétricas
| Family | ProASIC3E |
| Total Gates | 3,000,000 |
| Logic Modules (VersaTiles) | 75,264 |
| User I/Os | 620 |
| RAM Bits | 516,096 |
| Core Supply Voltage | 1.5V (1.425V to 1.575V) |
| Temperatura de operação | -40°C to 100°C (TJ) |
| Encapsulamento | 896-FBGA (31x31 mm) |
| Tipo de montagem | Surface Mount |
| Speed Grade | -2 |
| System Performance | 310 MHz |
| Process Technology | 130nm Flash |
| Configuration | Flash-based, non-volatile |
| Status RoHS | Compliant |
| Nível MSL | 3 |
Guia de Configuração de Pinos do A3PE3000-2FGG896I 896-fbga (31x31 mm)
Configuração de pinos para A3PE3000-2FGG896I (pacote 896-fbga (31x31 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000-2FGG896I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000-2FGG896I é adequado para 6 aplicaçãos: Industrial Control Systems, Communications Infrastructure, Avionics and Defense, Consumer Electronics, Medical Electronics, Automotive Electronics.
Industrial Control Systems
The A3PE3000-2FGG896I is ideal for industrial control systems due to its flash-based architecture, which provides instant-on operation and high reliability in harsh environments. With 3 million gates and 620 I/Os, it can handle complex motor control algorithms, PLC interfaces, and safety-critical logic. The industrial temperature range (-40°C to 100°C) ensures operation in factory floors and outdoor installations. Its non-volatile configuration eliminates the need for external boot memory, reducing system cost and improving security against unauthorized copying. The device's 310 MHz performance supports real-time processing requirements, while the 516,096 bits of RAM enable efficient data buffering. For applications requiring deterministic behavior, the flash-based FPGA offers predictable timing without the configuration delay of SRAM-based FPGAs.
Recomendado
Communications Infrastructure
In communications infrastructure, the A3PE3000-2FGG896I excels in packet processing, protocol bridging, and line card control. Its 620 user I/Os support multiple high-speed interfaces such as LVDS, PCI, and LVCMOS, enabling connection to PHYs, switches, and backplanes. The 3M gates provide ample logic for implementing MAC layers, error correction, and traffic management. The flash-based configuration ensures secure boot and prevents bitstream interception, critical for network equipment. With 516,096 bits of RAM, it can buffer packets and manage queues efficiently. The device's 310 MHz performance meets the timing requirements of Gigabit Ethernet and other high-throughput protocols. Its low power consumption reduces heat dissipation in dense chassis designs, and the industrial temperature range supports outdoor and uncontrolled environments.
Recomendado
Avionics and Defense
The A3PE3000-2FGG896I is well-suited for avionics and defense applications due to its flash-based security features, which protect against reverse engineering and tampering. The device's instant-on capability is critical for mission-critical systems that must start immediately without configuration delay. With 3M gates and 620 I/Os, it can implement complex signal processing, sensor fusion, and flight control logic. The industrial temperature range and high reliability make it suitable for harsh aerospace environments. The 516,096 bits of RAM support data logging and buffering. The device's low power consumption is advantageous for power-constrained platforms. Additionally, the non-volatile configuration eliminates the need for external configuration memory, reducing system complexity and improving reliability in vibration-prone environments.
Recomendado
Consumer Electronics
In consumer electronics, the A3PE3000-2FGG896I enables rapid prototyping and low-cost production for devices like smart home hubs, video processing, and gaming peripherals. Its flash-based architecture allows field updates via JTAG or SPI, enabling feature enhancements and bug fixes after deployment. The 3M gates provide sufficient logic for implementing user interfaces, protocol stacks, and image processing. The 620 I/Os support various display and sensor interfaces. The device's low power consumption extends battery life in portable devices. The 516,096 bits of RAM can buffer audio/video data. The industrial temperature range ensures reliable operation in consumer environments. The device's security features protect intellectual property, which is crucial for consumer products.
Recomendado
Medical Electronics
The A3PE3000-2FGG896I is suitable for medical electronics such as patient monitors, imaging systems, and diagnostic equipment. Its high reliability and long-term availability make it ideal for medical devices with extended lifecycles. The flash-based configuration ensures secure and reliable operation, critical for patient safety. With 3M gates and 620 I/Os, it can handle complex signal processing, data acquisition, and control logic. The industrial temperature range supports various clinical environments. The 516,096 bits of RAM enable data buffering for real-time monitoring. The device's low power consumption reduces heat in compact enclosures. Its instant-on capability ensures immediate readiness, which is essential in emergency medical equipment.
Recomendado
Automotive Electronics
The A3PE3000-2FGG896I is used in automotive electronics for infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its flash-based architecture provides instant-on operation, essential for automotive systems that must start immediately. The device's security features protect against unauthorized modifications, important for safety-critical functions. With 3M gates and 620 I/Os, it can implement complex algorithms for sensor fusion, image processing, and control. The industrial temperature range (-40°C to 100°C) covers automotive operating conditions. The 516,096 bits of RAM support data buffering for real-time processing. The device's low power consumption is beneficial for battery-powered vehicles. Its high reliability ensures long-term operation in harsh automotive environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000-2FGG896I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000-2FG896I | M1A3PE3000L-1FGG896I | A3PE3000-1FGG896I | A3PE3000-2FGG484I | A3PE3000L-1FGG896I |
|---|---|---|---|---|---|---|
| Package | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) | 484-FBGA (23x23 mm) | 896-FBGA (31x31 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 620 | 620 | 620 | 620 | 341 | 620 |
| RAM Bits | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| Speed Grade | -2 | -2 | -1 | -1 | -2 | -1 |
| Core Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Operating Temperature | -40°C to 100°C | -40°C to 100°C | -40°C to 100°C | -40°C to 100°C | -40°C to 100°C | -40°C to 100°C |
Principais diferenciais
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Higher speed grade (-2) than M1A3PE3000L-1FGG896I (vs M1A3PE3000L-1FGG896I)
- Industrial temperature range (vs A3PE3000-2FG896I (commercial))
Notas de projeto
The A3PE3000-2FGG896I requires a 1.5V core supply with tight regulation (1.425V to 1.575V). Use a low-dropout regulator or a switching regulator with low ripple to supply the core. Decouple each VCC pin with a 0.1uF ceramic capacitor and add bulk capacitance (10uF) near the power entry point. Estimated: For a design with 50% logic utilization and 100 MHz clock, core current may be around 0.5A, so ensure the regulator can supply at least 1A with margin.
For the 896-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm for single-ended, 100 ohm differential for LVDS). Place decoupling capacitors as close to the FPGA power pins as possible, ideally on the opposite side of the board. Follow the layout guidelines in the ProASIC3E datasheet for PLL analog power filtering.
The A3PE3000-2FGG896I has a maximum junction temperature of 100°C. Estimated: With a typical power dissipation of 0.24W static plus dynamic power, the thermal resistance of the FBGA package (theta_JA) is approximately 15°C/W. For a 1W total power, the junction temperature rise would be 15°C above ambient. Ensure adequate airflow or a heatsink if operating in high ambient temperatures. Use thermal vias under the package to improve heat transfer to the PCB.
Informações de conformidade
The 'G' in the part number indicates lead-free (RoHS compliant) finish. Other compliance details not specified in the provided data.