Microchip Technology

M1AFS1500-2FG676 - 1.5M Gate Fusion FPGA | Microchip

N.º da peça: M1AFS1500-2FG676 ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.5 V Vdss 676-FBGA (PBGA-676) Package 350 MHz Speed
A partir de $39.8 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-08-31
Preços por volume
Qtd. Preço unitário Total
1 $68.58 $68,58
10 $61.72 $617,20
100 $55.39 $5.539,00
500 $50.87 $25.435,00
1.000 $45.16 $45.160,00
3.000 $39.8 $119.400,00
ℹ️ Todos os preços estão em USD

M1AFS1500-2FG676 Visão geral

The Microchip Technology M1AFS1500-2FG676 is a Fusion mixed-signal field-programmable gate array (FPGA) with 1,500,000 system gates, 38,400 logic cells and 252 user I/O, housed in a 676-ball FBGA package. It operates from a 1.5 V core supply, is built on 130 nm CMOS technology, supports a maximum clock frequency of 350 MHz, and is supplied in a tray.

An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit whose logic fabric and routing can be programmed after manufacturing to implement arbitrary digital systems. The M1AFS1500-2FG676 belongs to Microchip's Fusion family, which extends the conventional FPGA architecture by integrating configurable analog blocks, large flash memory, and clock generation/management circuitry on the same die. In the system hierarchy, the device sits above standard MCUs for high-speed parallel processing and below ASICs for unit-volume economics, making it a cost-effective alternative for mixed-signal designs.

Key features include 1.5M gates, 38,400 logic cells, 252 I/O pins, and a 350 MHz maximum clock frequency. The 676-ball FBGA package with 1.00 mm ball pitch provides substantial connectivity for memory buses and peripheral interfaces. The Fusion architecture's embedded flash allows non-volatile configuration, secure boot, and single-chip operation without external boot memory.

The device is fabricated in 130 nm CMOS at a 1.5 V core voltage, balancing power and performance. Its configurable analog subsystem can implement analog front-end functions such as voltage/current monitoring, enabling mixed-signal integration in one package. The 331-page Fusion documentation describes the user reference manual including clock generation and management circuitry, making the device suitable for designs that need both programmable logic and analog measurement.

Typical applications include motor control, industrial automation, avionics, smart-grid power monitoring, medical imaging, and embedded vision. The combination of 252 I/O and mixed-signal analog makes it particularly strong in systems requiring many sensor inputs and real-time logic.

Designers should pay attention to power supply decoupling because the FPGA's core, I/O banks, and analog blocks require clean rails; a 1.5 V core rail plus I/O supplies and analog supplies must be sequenced correctly. Adequate PCB thermal management is necessary for the 676-FBGA package, especially at high utilization.

This page synthesizes distributor sourcing, drop-in alternatives from the Fusion family, and practical design notes that go beyond the manufacturer datasheet, helping engineers quickly assess whether M1AFS1500-2FG676 fits their mixed-signal FPGA application.

Alternativas drop-in para M1AFS1500-2FG676 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com M1AFS1500-2FG676 (mesmo formato e footprint) — diferindo em Package / Case, Family, RoHS Status, Speed Grade, Maximum Operating Temperature.

Microchip Technology
Package / Case: FBGA-676
Family: Fusion
Speed Grade: -1
Comparar com M1AFS1500-2FG676 →
Microchip Technology
Package / Case: 676-Pin FBGA
RoHS Status: RoHS Non-Compliant
Speed Grade: -1
Comparar com M1AFS1500-2FG676 →
Microchip Technology
Family: Fusion (Mixed-Signal Flash FPGA)
RoHS Status: RoHS Non-Compliant (contains lead)
Speed Grade: 2
Comparar com M1AFS1500-2FG676 →
Microchip Technology
Package / Case: 676-ball FBGA
Family: Fusion Mixed-Signal FPGA
RoHS Status: Compliant
Comparar com M1AFS1500-2FG676 →
Microchip Technology
Family: Fusion
RoHS Status: Compliant
Comparar com M1AFS1500-2FG676 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

M1AFS1500-1FG676

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 676-FBGA
Fusion · 1,500,000 · 38,400 · 252 · 1.5 V · FBGA-676 · SMD/SMT · +70 C

✓ Em estoque

$90 / unidade

Ver ficha técnica →

M1AFS1500-2FG676I

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 676-FBGA
Fusion (Mixed-Signal Flash FPGA) · 1.5 M · 130 nm CMOS · 1.5 V · 2 · 676-ball FBGA (FG676) · Surface Mount · On-chip flash (non-volatile, instant-on)

✓ Em estoque

$405 / unidade

Ver ficha técnica →

M1AFS1500-2FGG676

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 676-FBGA
Fusion Mixed-Signal FPGA · 1,500,000 · 38,400 · 350 MHz · 252 I/O · 1.5 V · 676-ball FBGA · 1.00 mm

✓ Em estoque

$297.26 / unidade

Ver ficha técnica →

M1AFS1500-2FGG676I

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 676-FBGA
Fusion · 1.5M · 38400 · 350 MHz · 130nm · 1.5V (1.425V to 1.575V) · 276480 · 252

✓ Em estoque

$59.6 / unidade

Ver ficha técnica →

M1AFS1500-1FG676I

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 676-FBGA
M1AFS1500-1FG676I · Microchip Technology (Microsemi) · Fusion Mixed-Signal FPGA · 1.5 M · 252 · 1.5 V · 130 nm CMOS · -1

✓ Em estoque

$340.59 / unidade

Ver ficha técnica →

M1AFS1500-2FG676 Classificações máximas e características elétricas

FPGA Family Fusion
Total Gates 1,500,000
Number of Logic Cells 38,400
Number of User I/O 252
Frequência máxima de clock 350 MHz
Core Supply Voltage 1.5 V
Process Technology 130 nm
Encapsulamento / Caixa 676-FBGA (PBGA-676)
Tipo de montagem Surface Mount
Faixa de temperatura de operação 0°C to 85°C (TJ)
Packaging Tray
Base Product Number M1AFS1500
Datasheet User Reference Manual 331 pages
Speed Grade -2

Guia de Configuração de Pinos do M1AFS1500-2FG676 676-fbga (pbga-676)

Configuração de pinos para M1AFS1500-2FG676 (pacote 676-fbga (pbga-676)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 676-fbga (pbga-676) para M1AFS1500-2FG676

Nenhum dado detalhado de pinagem disponível para M1AFS1500-2FG676.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

M1AFS1500-2FG676 é adequado para 6 aplicaçãos: Motor Control, Industrial Automation, Avionics and Aerospace, Smart Grid and Power Monitoring, Medical Imaging, Embedded Vision and Surveillance.

🏭

Motor Control

The M1AFS1500-2FG676 works well in multi-axis motor control systems because its 252 user I/O can capture high-resolution encoder inputs while its programmable logic executes real-time commutation algorithms. In a typical servo drive, it interfaces with current-sense amplifiers and gate drivers, closing the loop with low latency compared to MCU firmware. The Fusion analog blocks can monitor voltage/current rails directly, reducing external ADC count. With a 350 MHz maximum clock frequency, it can perform complex PWM generation and fault handling with tighter timing than many MCUs. Designers should isolate the 1.5V core rail from motor supply noise and use dedicated I/O banks for encoder and driver signals to maintain noise immunity.

🏭

Industrial Automation

In industrial automation, the M1AFS1500-2FG676 can consolidate PLC-like logic, analog sensor conditioning, and high-speed communication in one FPGA. It provides 252 I/O for connecting limit switches, photo-eyes, and encoder interfaces while the configurable analog blocks support direct connection of 4-20mA and 0-10V sensors. The 130nm flash-based fabric allows non-volatile configuration, so the automation node boots immediately without external configuration memory. Engineers can use its 1.5V core for low power consumption and rely on separate I/O banks to bridge 3.3V or 5V industrial signals. The 350MHz clock enables fast PID loops and deterministic digital filtering.

✈️

Avionics and Aerospace

The M1AFS1500-2FG676 is suited for avionics data concentrators, flight instrumentation, and unmanned vehicle controllers because Fusion FPGAs integrate flash-based configuration and support secure boot. Its 1.5M gates and 38,400 logic cells can host multiple protocol controllers, while 252 I/O connect to sensors, discretes, and avionics data buses. The non-volatile fabric retains the design without external PROM, simplifying line-replaceable unit designs. For critical applications, the commercial temperature range is a limitation; designers should select the I-suffix industrial variant or provide environmental control. The analog blocks can also monitor power supplies and health status.

⚡

Smart Grid and Power Monitoring

The M1AFS1500-2FG676 is a strong fit for smart grid protection relays and power quality monitors because its mixed-signal analog front-end can digitize voltage/current waveforms while FPGA logic performs synchronized phasor measurement. With 252 I/O, it can interface to multiple ADC channels and precision timing sources. The 1.5V core with 130nm technology keeps power consumption manageable in substation electronics. Fusion's flash memory can store calibration data and event logs without external EEPROM. For protection applications, designers must implement deterministic sampling and use the FPGA's parallelism to process multiple channels simultaneously, meeting tight IEC 61850 timing budgets.

💊

Medical Imaging

The M1AFS1500-2FG676 can be used in ultrasound front-end processing, CT data acquisition, and patient monitoring systems where high I/O count and parallel processing are essential. Its 252 I/O can capture arrays of ADC data, while the programmable fabric performs beamforming or digital filtering algorithms with deterministic latency. Fusion's configurable analog can supervise power rails and temperature for patient safety. The 350MHz clock allows high-rate data processing on multiple channels concurrently. For medical equipment, designers should verify isolation requirements and use the industrial/green variants if extended temperature or RoHS compliance is required.

🎥

Embedded Vision and Surveillance

The M1AFS1500-2FG676 suits embedded vision systems that require parallel pre-processing of image data from multiple sensors. With 252 I/O, it can connect to parallel CMOS imagers, LVDS receivers, or a frame-buffer bus, while FPGA logic performs filtering, downsampling, or feature extraction before sending results to a host processor. The Fusion mixed-signal blocks can manage sensor power and exposure control. For real-time surveillance analytics, the FPGA offloads repetitive pixel operations, reducing CPU load. Designers should match I/O bank voltages to the sensor interface and use internal RAM blocks efficiently for line buffers; available RAM is not specified in the verified data and must be checked in the datasheet.

Where can I buy M1AFS1500-2FG676 online?
You can buy M1AFS1500-2FG676 from franchised distributors such as DigiKey, Octopart-listed distributors, and XAIPART. According to the Microchip product page, the device is a Fusion mixed-signal FPGA. As of 2026-08-31, pricing is order-driven, so request a quote for current stock and lead time.
What is the price of M1AFS1500-2FG676?
The M1AFS1500-2FG676 price depends on quantity and sourcing channel. Indicative pricing as of 2026-08-31 is $68.58 for one unit, decreasing to about $45.16 per unit at 1,000 pieces. Exact pricing should be confirmed with an authorized distributor such as DigiKey or Octopart, as FPGA prices vary with market conditions.
What is the lead time for M1AFS1500-2FG676?
Lead time for M1AFS1500-2FG676 varies by distributor and order size. The ics-embedded listing showed in stock, suggesting immediate availability in some channels. As of 2026-08-31, no official lead time was published in the verified sourcing data, so contact your preferred distributor for exact lead time.
M1AFS1500-2FG676 vs M1AFS1500-1FG676 - which is better for high-speed designs?
For high-speed designs, the M1AFS1500-2FG676 is better because its -2 speed grade supports a 350 MHz maximum clock frequency, while the M1AFS1500-1FG676 has a slower -1 speed grade. Both share the same 676-FBGA package and 252 I/O, so timing margin is the deciding factor.
What is the difference between M1AFS1500-2FG676 and M1AFS1500-2FG676I?
The M1AFS1500-2FG676I is the industrial-temperature version of M1AFS1500-2FG676, with the same 676-FBGA package and -2 speed grade but a wider operating temperature range. The standard M1AFS1500-2FG676 is rated 0°C to 85°C, while the I suffix indicates suitability for industrial environments.
When should I choose M1AFS1500-2FG676 over M1AFS1500-1FG676?
Choose M1AFS1500-2FG676 when the design requires the strongest timing performance and the 350 MHz maximum clock frequency is needed for fast logic or interface rates. If timing margins are comfortable and cost/thermal budget is tighter, the slower M1AFS1500-1FG676 can reduce cost while remaining pin-compatible.
Is M1AFS1500-2FG676 suitable for industrial temperature environments?
The standard M1AFS1500-2FG676 is rated 0°C to 85°C, so it is not qualified for -40°C industrial environments. For those applications, select M1AFS1500-2FG676I or M1AFS1500-2FGG676I, which use the same 676-FBGA package but provide an industrial temperature range.
What is the best drop-in replacement for M1AFS1500-2FG676?
The best same-package drop-in replacements are Microchip Fusion variants sharing the 676-FBGA footprint: M1AFS1500-1FG676, M1AFS1500-2FG676I, M1AFS1500-2FGG676, M1AFS1500-2FGG676I and M1AFS1500-1FG676I. These are pin-compatible and differ by speed grade, temperature range, or green/lead-free package options.
Where can I download the M1AFS1500-2FG676 datasheet PDF?
The M1AFS1500-2FG676 datasheet PDF is available from Microchip's product page at microchip.com/en-us/product/M1AFS1500. According to AiPCBA, the user reference manual documentation is 331 pages. Distributor sites such as DigiKey and Octopart also link to the datasheet and additional Fusion FPGA resources.
Is M1AFS1500-2FG676 the same as M1AFS1500-2FGG676?
No, M1AFS1500-2FG676 and M1AFS1500-2FGG676 are not the same: the 2FGG676 variant uses a lead-free/green package, while both maintain the same 676-FBGA footprint and -2 speed grade. The G in FGG indicates a green RoHS-compliant package option, making it preferable for environmental compliance requirements.
What are the key specifications of M1AFS1500-2FG676 that engineers should know?
The M1AFS1500-2FG676 is a Fusion mixed-signal FPGA with 1,500,000 gates, 38,400 logic cells, 252 user I/O, 350 MHz maximum clock frequency, 1.5V core supply, and 130nm CMOS technology in a 676-ball FBGA package. It is supplied in a tray and rated for 0°C to 85°C operation.
What is the best non-Microchip equivalent for M1AFS1500-2FG676?
No verified cross-brand drop-in equivalent was found in web data. Pin-compatible substitutes for M1AFS1500-2FG676 are currently limited to Microchip Fusion family parts sharing the 676-FBGA footprint. A redesign may be required for FPGAs from other vendors due to different ball maps and I/O standards.
What is the core voltage of M1AFS1500-2FG676?
The core supply voltage of M1AFS1500-2FG676 is 1.5V per the Fusion FPGA specifications. This low core voltage helps reduce dynamic power in 130nm CMOS while supporting up to 350 MHz operation. The I/O banks require separate supply voltages depending on the interface standard used.
Does M1AFS1500-2FG676 support mixed-signal functions?
Yes, the M1AFS1500-2FG676 is a Fusion mixed-signal FPGA, integrating configurable analog, flash memory blocks, clock generation and programmable logic in a monolithic device. This makes it suitable for applications where analog monitoring and digital control must be combined on a single chip.

Dados de referência de engenharia para M1AFS1500-2FG676 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the M1AFS1500-2FG676 when you need a Fusion mixed-signal FPGA with 1.5M gates, 38,400 logic cells, 252 I/O, and -2 speed grade in a 676-FBGA package. It is ideal for commercial temperature (0°C to 85°C) applications that require reconfigurable digital logic plus analog monitoring. If the design needs lower cost and can tolerate lower timing performance, consider the M1AFS1500-1FG676. If the end product must operate below 0°C, choose M1AFS1500-2FG676I or M1AFS1500-2FGG676I. If RoHS/lead-free compliance is mandatory, select M1AFS1500-2FGG676 or M1AFS1500-2FGG676I. All listed alternatives are drop-in compatible on the same 676-FBGA footprint, making it straightforward to switch based on temperature and environmental requirements.

Comparação com alternativas

Parâmetro Este produto M1AFS1500-1FG676 M1AFS1500-2FG676I M1AFS1500-2FGG676 M1AFS1500-2FGG676I
Package 676-FBGA 676-FBGA (same) 676-FBGA (same) 676-FBGA (same) 676-FBGA (same)
Brand Microchip Technology Microchip Technology (same) Microchip Technology (same) Microchip Technology (same) Microchip Technology (same)
Speed Grade -2 -1 -2 -2 -2
Operating Temperature Range 0°C to 85°C (TJ) 0°C to 85°C (TJ) Industrial (per suffix) 0°C to 85°C (TJ) Industrial (per suffix)
Total Gates 1,500,000 1,500,000 1,500,000 1,500,000 1,500,000
Number of Logic Cells 38,400 38,400 38,400 38,400 38,400
Number of User I/O 252 252 252 252 252

Principais diferenciais

  • Higher speed grade compared to M1AFS1500-1FG676 (vs M1AFS1500-1FG676)
  • Commercial temperature range reduces cost vs industrial variant (vs M1AFS1500-2FG676I)
  • Non-green base variant for projects without mandatory RoHS finish (vs M1AFS1500-2FGG676I)

Notas de projeto

The M1AFS1500-2FG676 requires a clean 1.5V core rail plus separate I/O bank and analog supply voltages. Estimated: for a 1A core current with 30mV allowed ripple, the power distribution impedance target is about 30mΩ up to 10MHz. Place 100nF X7R decoupling capacitors near each power ball and add bulk capacitance on the main supply rail. Follow Microchip's Fusion power-up sequencing guidance to avoid latch-up or unreliable configuration.

The 676-FBGA package power dissipation depends on logic utilization, I/O loading, and clock frequency. At high utilization the device can dissipate several watts; the datasheet's thermal resistance values should be used to compute junction temperature, but they are not included in the verified snippets. Estimated: for 2W dissipation with a 10°C/W θJA and 40°C ambient, junction temperature would be about 60°C, leaving margin for the 85°C limit. Use thermal vias and a solid ground plane under the BGA.

In Fusion FPGA designs, do not assume all 676 balls are user I/O: only 252 I/O are available and many balls are power, ground, and configuration pins. Review the package pinout before layout, and verify I/O bank voltages against external interfaces. Because the verified data does not include RAM bit or analog-block counts, confirm those resources in the full 331-page Fusion manual before finalizing high-density logic.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

The verified web data does not explicitly state RoHS, REACH, lead-free, or conflict-mineral status for M1AFS1500-2FG676. The FGG-suffix variants indicate green/lead-free packages but this should be confirmed with the supplier.

Dados verificados em: 2026-08-31 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

Microchip Technology M1AFS1500-2FG676 M1AFS1500-1FG676 M1AFS1500-2FG676I M1AFS1500-2FGG676 M1AFS1500-2FGG676I FPGA Field Programmable Gate Array Fusion Mixed-signal FPGA 1,500,000 system gates 38,400 logic cells 252 user I/O 676-FBGA FBGA 130nm CMOS 1.5V core 350MHz Tray RoHS
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