EP1AGX50DF780I6N - Arria GX FPGA 50K LE 780-FBGA | Intel
N.º da peça: EP1AGX50DF780I6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $355 | $3.550,00 |
| 100 | $318 | $31.800,00 |
| 500 | $285 | $142.500,00 |
| 1.000 | $255 | $255.000,00 |
EP1AGX50DF780I6N Visão geral
An FPGA is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed after manufacture, allowing a single silicon platform to implement arbitrary digital functions ranging from glue logic and bus bridges to full processor systems. Within the broader component taxonomy, an FPGA sits between fixed-function ASICs and software-defined microcontrollers: more flexible than an ASIC, more deterministic and parallel than a CPU. The Arria GX family specifically targets designs that require embedded transceivers, abundant parallel I/O, and moderate logic density.
Key features of the EP1AGX50DF780I6N include 50,160 logic elements organized into 2,508 LABs, embedded multiplier blocks for DSP operations, dedicated high-speed serial transceivers suitable for protocols such as PCI Express and Serial RapidIO, and embedded memory blocks totaling several megabits. The 780-FBGA package exposes 350 user I/O pins and provides a low-inductance power/ground distribution essential for high-speed switching. Configuration is loaded via serial or parallel flash, JTAG, or passive/active serial modes supported by the Altera/Intel Quartus tool chain.
Typical applications include telecom line-card interface logic, broadcast video processing, military/aerospace signal conditioning, industrial imaging pipelines, and prototyping of custom accelerators. The industrial grade extends the use envelope to outdoor enclosures, transportation, and factory-floor equipment.
Designers should consult the Arria GX Device Handbook for transceiver reference designs, power-rail sequencing requirements, and pinout guidelines. Always verify signal-integrity simulations on the actual PCB stack-up before committing to high-speed serial links.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria GX family, and practical design notes not aggregated in the manufacturer datasheet.
Alternativas drop-in para EP1AGX50DF780I6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1AGX50DF780I6N (mesmo formato e footprint) — diferindo em Speed Grade, Operating Temperature, RoHS Status, Logic Elements, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1AGX50DF780I6
✅ Drop-In✓ Em estoque
$295 / unidade
Ver ficha técnica →EP1AGX50DF780C6N
✅ Drop-In✓ Em estoque
$327.76 / unidade
Ver ficha técnica →EP1AGX50DF780C7
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1AGX50DF780C6
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →EP1AGX60DF780I6N
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1AGX35DF780I6N
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1AGX50DF780I6N Classificações máximas e características elétricas
| Family | Arria GX |
| Logic Elements (LEs) | 50,160 |
| Logic Array Blocks (LABs) | 2,508 |
| User I/O Pins | 350 |
| Process Technology | CMOS, 1.2V core |
| Encapsulamento | 780-pin FBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount |
| Operating Temperature Grade | Industrial (I6, -40C to +100C junction) |
| Configuration Mode | Serial / Parallel / JTAG |
| Embedded Transceivers | Yes (multi-channel, protocol-specific) |
| Embedded Multipliers | Yes (DSP blocks, 18x18) |
| Status RoHS | Compliant |
| Lead-Free / Halogen-Free | Lead-free per Intel datasheet |
| Tensão de alimentação | 1.2V core (with auxiliary rails per datasheet) |
Guia de Configuração de Pinos do EP1AGX50DF780I6N 780-pin fbga (fineline bga)
Configuração de pinos para EP1AGX50DF780I6N (pacote 780-pin fbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1AGX50DF780I6N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1AGX50DF780I6N é adequado para 6 aplicaçãos: Telecom Line-Card Interface, Broadcast Video Processing, Industrial Imaging Pipeline, Military/Aerospace Signal Conditioning, Embedded Protocol Bridge, ASIC Prototyping Platform.
Telecom Line-Card Interface
The EP1AGX50DF780I6N fits telecom line-card designs where mid-density logic is needed to bridge backplane SERDES framer interfaces to parallel processing ASICs. With 50,160 logic elements and dedicated high-speed transceivers supporting protocols such as Serial RapidIO and PCI Express, the device can implement custom channel aggregation, framing, and protocol-conversion glue logic without offloading the main NPU. The 780-FBGA package exposes 350 user I/O pins, ample for parallel data-path interfaces, while the industrial -40C to +100C junction temperature grade supports outdoor and unconditioned cabinet deployments. Quartus Prime reference designs accelerate integration.
Recomendado
Broadcast Video Processing
The EP1AGX50DF780I6N serves broadcast video processing applications such as HD-SDI routing, frame synchronizers, and on-screen-display overlay engines. Its 50,160 logic elements combined with embedded 18x18 multiplier blocks support real-time pixel-pipeline operations including color-space conversion and scaling. The 350 user I/O pins accommodate multiple parallel video buses plus control interfaces, and the 1.2V core with auxiliary rails allows integration alongside DDR2 memory for line/frame buffering. Industrial temperature screening suits OB-van and outdoor event-broadcast deployments.
Recomendado
Industrial Imaging Pipeline
For machine-vision and inspection systems, the EP1AGX50DF780I6N provides the logic density and DSP resources to implement Bayer demosaicing, lens-distortion correction, and real-time feature-extraction algorithms. Its 50,160 logic elements handle multi-tap pixel processing at Camera Link or CoaXPress interface rates, while embedded multipliers accelerate convolution kernels. The industrial temperature grade and rugged FBGA package suit factory-floor installations with vibration and thermal cycling. Quartus Prime DSP Builder accelerates MATLAB-to-FPGA workflows for vision engineers.
Recomendado
Military/Aerospace Signal Conditioning
The EP1AGX50DF780I6N is well suited to defense signal-conditioning subsystems where deterministic latency and reconfigurability outweigh raw throughput. With 50,160 logic elements, designers can implement custom FIR filters, adaptive beamforming weights, and protocol-specific encryption pre-processors. The industrial -40C to +100C temperature grade meets many MIL-STD-810 environmental profiles for ground-mobile and airborne platforms. The 780-FBGA package supports dense routing for high-speed ADC/DAC interfaces.
Recomendado
Embedded Protocol Bridge
The EP1AGX50DF780I6N excels as a multi-protocol bridge converting between standards such as Serial RapidIO, PCI Express, Gigabit Ethernet, and custom LVDS links. Its 50,160 logic elements and embedded transceivers allow simultaneous operation of multiple high-speed serial channels, while 350 user I/O pins support parallel sideband buses and memory interfaces. Industrial temperature operation suits outdoor telecom and railway applications.
Recomendado
ASIC Prototyping Platform
Engineers use the EP1AGX50DF780I6N as an ASIC prototyping vehicle to validate complex SoC designs in real hardware before tape-out. Its 50,160 logic elements can host representative logic partitions, and the 780-FBGA package exposes sufficient pins to map ASIC peripheral interfaces. Quartus Prime supports rapid design iteration and incremental compile, accelerating bring-up. Industrial temperature grade enables prototype validation in target environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1AGX50DF780I6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1AGX50DF780I6 | EP1AGX50DF780C6N | EP1AGX50DF780C7 | EP1AGX50DF780C6 | EP1AGX60DF780I6N | EP1AGX35DF780I6N |
|---|---|---|---|---|---|---|---|
| Package | 780-pin FBGA | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 50,160 | ~60,000 | ~33,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Industrial | Industrial |
| Speed Grade | 6 | 6 | 6 | 7 (slower) | 6 | 6 | 6 |
| User I/O Pins | 350 | 350 | 350 | 350 | 350 | 350 | 350 |
| Embedded Transceivers | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Industrial temperature grade in the 780-FBGA footprint (vs EP1AGX50DF780C6N)
- Higher logic density than the EP1AGX35 family variant (vs EP1AGX35DF780I6N)
- Lower density than the EP1AGX60 family upgrade path (vs EP1AGX60DF780I6N)
Notas de projeto
The 780-FBGA package dissipates significant heat at high toggle rates; thermal resistance theta_JA depends strongly on PCB stack-up. Estimated: with a 6-layer PCB and adequate via-array thermal pad, expect theta_JA of approximately 8-12 C/W. At 4W dissipation, junction-to-ambient rise is 32-48C. For enclosed industrial cabinets, add forced airflow or a heatsink bonded to the BGA lid.
BGA escape routing on 1.0mm pitch requires high-density interconnect (HDI) PCB processes with microvias and sequential lamination. Use a 6-layer stack-up with dedicated ground and power planes adjacent to the BGA. Decouple every power pin with 100nF X7R placed within 2mm of the via pad, plus bulk 10-47uF tantalum or polymer capacitors near the supply entry.
Differential pair routing for high-speed transceivers must maintain 100 ohm differential impedance with length matching under 150 mils. Reference the Arria GX handbook for per-channel skew budgets and pre-emphasis / equalization settings. Series DC-blocking capacitors must be 0402-size with C0G/NP0 dielectric; X7R introduces distortion at multi-Gbps rates.
Do not assume configuration mode by default - the MSEL pins must be strapped correctly for the chosen configuration source (AS, PS, JTAG). Incorrect MSEL settings cause silent configuration failure. Also, leave JTAG pins accessible in production for in-system programming and boundary-scan diagnostics. Reset and configuration DONE signals require pull-ups per the handbook.
Informações de conformidade
RoHS and lead-free confirmed via Intel product page; halogen-free status not explicitly stated. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC.
