EP1C6T144I7 - Cyclone FPGA, 5980 LE, 144-LQFP | Intel / Altera
N.º da peça: EP1C6T144I7 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $34.97 | $34,97 |
| 10 | $30.2 | $302,00 |
| 100 | $24.8 | $2.480,00 |
| 500 | $21.5 | $10.750,00 |
| 1.000 | $19.4 | $19.400,00 |
EP1C6T144I7 Visão geral
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the integrated circuit family that allows hardware designers to configure digital logic blocks, routing, and I/O after fabrication. Within the broader taxonomy, the EP1C6T144I7 sits as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs are commonly used to implement glue logic, custom state machines, bus bridges, DSP datapaths, and parallel I/O expansion where ASIC NRE costs are not justifiable.
Key features include 5,980 logic elements distributed across 598 LABs (logic array blocks), 92,160 bits of embedded SRAM organized as M4K blocks, two PLLs for clock management, and 98 user I/O pins supporting LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards. The 144-LQFP package is a plastic thin quad flat pack with 0.5mm pitch and a 22x22mm body, well-suited for low-cost PCB assembly and breadboard-friendly prototyping. Unlike BGA packages, the LQFP allows hand-soldering and standard rework, which keeps NPI costs down.
The Cyclone I architecture uses a 4-input look-up table (LUT) per logic element with dedicated carry chains for fast arithmetic and routing resources tuned for high logic density at low power. Its quiescent core voltage of 1.5V (VCCINT) keeps dynamic power modest versus later 90nm/65nm families, while I/O banks tolerate up to 3.3V for mixed-voltage interfacing. The device supports up to 250 MHz internal operation in speed grade -7.
Common applications include industrial motor control, factory automation bridges, legacy telecom interface cards, low-cost video processing pipelines, and educational FPGA development platforms. Engineers often select this Cyclone part when migrating off EOL (end-of-life) discrete logic or when budget constraints rule out Cyclone II/III/IV successors.
A primary design consideration is supply decoupling: place 0.1uF and 10uF capacitors close to every VCCINT and VCCIO pin, and ensure the JTAG chain includes proper TCK pull-down per IEEE 1149.1. Migration to newer families (Cyclone IV, Cyclone 10) requires footprint change because pin counts and ball maps differ; the EP1C6T144I7 is best retained where its footprint is already in volume production.
This page consolidates distributor pricing, verified same-package drop-in alternatives, and design notes not found in the standalone datasheet, giving engineers a single reference for sourcing and selection decisions.
Alternativas drop-in para EP1C6T144I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C6T144I7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Family, Configuration Modes.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C6T144I7N
✅ Drop-In✓ Em estoque
$42.5 / unidade
Ver ficha técnica →EP1C6T144I6N
✅ Drop-In✓ Em estoque
$17.6 / unidade
Ver ficha técnica →EP1C6T144C8N
✅ Drop-In✓ Em estoque
$12.95 / unidade
Ver ficha técnica →EP1C6T144C6N
✅ Drop-In✓ Em estoque
$18.85 / unidade
Ver ficha técnica →EP1C6T144C7N
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EP1C6T14417N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$16.8 / unidade
Ver ficha técnica →EP1C6T144I7 Classificações máximas e características elétricas
| Series | Cyclone I |
| Family | Cyclone |
| Number of Logic Elements (LE) | 5,980 |
| Number of Logic Array Blocks (LABs) | 598 |
| Total RAM Bits | 92,160 |
| Embedded Memory | 90 kbit |
| Number of User I/Os | 98 |
| Number of PLLs | 2 |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 130 nm |
| Temperatura de operação | -40C to +100C (Industrial) |
| Encapsulamento | 144-LQFP (T144) |
| Package Body Size | 22 x 22 mm |
| Lead Pitch | 0.5 mm |
| Tipo de montagem | Surface Mount |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| Speed Grade | 7 |
| Status RoHS | Non-Compliant (Pb-bearing) |
| Nível MSL | 3 |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL-2, SSTL-3 |
Configuração de pinos do EP1C6T144I7
| Pino 1 | I/O — User I/O (Bank 1) |
| Pino 2 | I/O — User I/O (Bank 1) |
| Pino 3 | I/O — User I/O (Bank 1) |
| Pino 4 | I/O — User I/O (Bank 1) |
| Pino 5 | I/O — User I/O (Bank 1) |
| Pino 6 | VCCIO1 — I/O Bank 1 supply |
| Pino 7 | I/O — User I/O (Bank 1) |
| Pino 8 | I/O — User I/O (Bank 1) |
| Pino 9 | GND — Ground |
| Pino 10 | I/O — User I/O (Bank 2) |
| Pino 11 | I/O — User I/O (Bank 2) |
| Pino 12 | I/O — User I/O (Bank 2) |
| Pino 13 | I/O — User I/O (Bank 2) |
| Pino 14 | TMS — JTAG Test Mode Select |
| Pino 15 | VCCIO2 — I/O Bank 2 supply |
| Pino 16 | TCK — JTAG Test Clock |
| Pino 17 | I/O — User I/O (Bank 2) |
| Pino 18 | I/O — User I/O (Bank 2) |
| Pino 19 | I/O — User I/O (Bank 2) |
| Pino 20 | TDI — JTAG Test Data In |
| Pino 21 | I/O — User I/O (Bank 2) |
| Pino 22 | GND — Ground |
| Pino 23 | I/O — User I/O (Bank 2) |
| Pino 24 | I/O — User I/O (Bank 2) |
| Pino 25 | nCE — Chip Enable (active low) |
| Pino 26 | I/O — User I/O (Bank 2) |
| Pino 27 | nCONFIG — Configuration Control (active low) |
| Pino 28 | I/O — User I/O (Bank 2) |
| Pino 29 | VCCINT — Core supply 1.5V |
| Pino 30 | I/O — User I/O (Bank 3) |
| Pino 31 | I/O — User I/O (Bank 3) |
| Pino 32 | I/O — User I/O (Bank 3) |
| Pino 33 | I/O — User I/O (Bank 3) |
| Pino 34 | I/O — User I/O (Bank 3) |
| Pino 35 | VCCIO3 — I/O Bank 3 supply |
| Pino 36 | I/O — User I/O (Bank 3) |
| Pino 37 | GND — Ground |
| Pino 38 | I/O — User I/O (Bank 3) |
| Pino 39 | I/O — User I/O (Bank 3) |
| Pino 40 | I/O — User I/O (Bank 3) |
| Pino 41 | I/O — User I/O (Bank 3) |
| Pino 42 | I/O — User I/O (Bank 3) |
| Pino 43 | I/O — User I/O (Bank 3) |
| Pino 44 | MSEL0 — Configuration Mode Select 0 |
| Pino 45 | I/O — User I/O (Bank 3) |
| Pino 46 | MSEL1 — Configuration Mode Select 1 |
| Pino 47 | I/O — User I/O (Bank 3) |
| Pino 48 | GND — Ground |
| Pino 49 | I/O — User I/O (Bank 4) |
| Pino 50 | DCLK — Configuration Clock |
| Pino 51 | I/O — User I/O (Bank 4) |
| Pino 52 | I/O — User I/O (Bank 4) |
| Pino 53 | VCCIO4 — I/O Bank 4 supply |
| Pino 54 | I/O — User I/O (Bank 4) |
| Pino 55 | I/O — User I/O (Bank 4) |
| Pino 56 | I/O — User I/O (Bank 4) |
| Pino 57 | I/O — User I/O (Bank 4) |
| Pino 58 | I/O — User I/O (Bank 4) |
| Pino 59 | I/O — User I/O (Bank 4) |
| Pino 60 | GND — Ground |
| Pino 61 | I/O — User I/O (Bank 4) |
| Pino 62 | nSTATUS — Configuration Status (active low) |
| Pino 63 | I/O — User I/O (Bank 4) |
| Pino 64 | CONF_DONE — Configuration Done (active high) |
| Pino 65 | I/O — User I/O (Bank 4) |
| Pino 66 | VCCINT — Core supply 1.5V |
| Pino 67 | I/O — User I/O (Bank 4) |
| Pino 68 | I/O — User I/O (Bank 4) |
| Pino 69 | I/O — User I/O (Bank 4) |
| Pino 70 | I/O — User I/O (Bank 4) |
| Pino 71 | I/O — User I/O (Bank 4) |
| Pino 72 | — Ground |
| Pino 73 | I/O — User I/O (Bank 4) |
| Pino 74 | I/O — User I/O (Bank 4) |
| Pino 75 | I/O — User I/O (Bank 4) |
| Pino 76 | I/O — User I/O (Bank 4) |
| Pino 77 | I/O — User I/O (Bank 4) |
| Pino 78 | I/O — User I/O (Bank 4) |
| Pino 79 | VCCIO4 — I/O Bank 4 supply |
| Pino 80 | I/O — User I/O (Bank 4) |
| Pino 81 | TDO — JTAG Test Data Out |
| Pino 82 | I/O — User I/O (Bank 4) |
| Pino 83 | GND — Ground |
| Pino 84 | I/O — User I/O (Bank 4) |
| Pino 85 | I/O — User I/O (Bank 4) |
| Pino 86 | I/O — User I/O (Bank 4) |
| Pino 87 | I/O — User I/O (Bank 4) |
| Pino 88 | I/O — User I/O (Bank 4) |
| Pino 89 | I/O — User I/O (Bank 4) |
| Pino 90 | I/O — User I/O (Bank 4) |
| Pino 91 | CLK0 — PLL Clock Input 0 |
| Pino 92 | VCCIO1 — I/O Bank 1 supply |
| Pino 93 | I/O — User I/O (Bank 1) |
| Pino 94 | I/O — User I/O (Bank 1) |
| Pino 95 | GND — Ground |
| Pino 96 | I/O — User I/O (Bank 1) |
| Pino 97 | I/O — User I/O (Bank 1) |
| Pino 98 | I/O — User I/O (Bank 1) |
| Pino 99 | I/O — User I/O (Bank 1) |
| Pino 100 | CLK1 — PLL Clock Input 1 |
| Pino 101 | I/O — User I/O (Bank 1) |
| Pino 102 | VCCINT — Core supply 1.5V |
| Pino 103 | I/O — User I/O (Bank 1) |
| Pino 104 | I/O — User I/O (Bank 1) |
| Pino 105 | I/O — User I/O (Bank 1) |
| Pino 106 | GND — Ground |
| Pino 107 | I/O — User I/O (Bank 1) |
| Pino 108 | I/O — User I/O (Bank 1) |
| Pino 109 | I/O — User I/O (Bank 1) |
| Pino 110 | I/O — User I/O (Bank 1) |
| Pino 111 | I/O — User I/O (Bank 1) |
| Pino 112 | VCCIO1 — I/O Bank 1 supply |
| Pino 113 | I/O — User I/O (Bank 1) |
| Pino 114 | I/O — User I/O (Bank 1) |
| Pino 115 | I/O — User I/O (Bank 1) |
| Pino 116 | I/O — User I/O (Bank 1) |
| Pino 117 | GND — Ground |
| Pino 118 | I/O — User I/O (Bank 1) |
| Pino 119 | I/O — User I/O (Bank 1) |
| Pino 120 | I/O — User I/O (Bank 1) |
| Pino 121 | I/O — User I/O (Bank 1) |
| Pino 122 | I/O — User I/O (Bank 1) |
| Pino 123 | I/O — User I/O (Bank 1) |
| Pino 124 | I/O — User I/O (Bank 1) |
| Pino 125 | VCCIO1 — I/O Bank 1 supply |
| Pino 126 | I/O — User I/O (Bank 1) |
| Pino 127 | I/O — User I/O (Bank 1) |
| Pino 128 | GND — Ground |
| Pino 129 | I/O — User I/O (Bank 1) |
| Pino 130 | I/O — User I/O (Bank 1) |
| Pino 131 | I/O — User I/O (Bank 1) |
| Pino 132 | I/O — User I/O (Bank 1) |
| Pino 133 | I/O — User I/O (Bank 1) |
| Pino 134 | I/O — User I/O (Bank 1) |
| Pino 135 | I/O — User I/O (Bank 1) |
| Pino 136 | VCCINT — Core supply 1.5V |
| Pino 137 | I/O — User I/O (Bank 1) |
| Pino 138 | I/O — User I/O (Bank 1) |
| Pino 139 | I/O — User I/O (Bank 1) |
| Pino 140 | GND — Ground |
| Pino 141 | I/O — User I/O (Bank 1) |
| Pino 142 | I/O — User I/O (Bank 1) |
| Pino 143 | I/O — User I/O (Bank 1) |
| Pino 144 | I/O — User I/O (Bank 1) |
Aplicações típicas
EP1C6T144I7 é adequado para 7 aplicaçãos: Industrial Motor Control, Legacy Telecom Interface Cards, Low-Cost Video Processing Pipelines, FPGA Development and Educational Platforms, Factory Automation and Protocol Bridging, Legacy CPLD-to-FPGA Migration Designs, Data Acquisition Front-End.
Industrial Motor Control
The EP1C6T144I7 fits industrial motor control applications where the 5,980 logic elements implement PID loop computation, PWM generation, and encoder decoding in a single device. The 1.5V core at speed grade 7 delivers up to 250 MHz operation, sufficient for 100 kHz current-loop update rates on 3-phase BLDC or stepper drives. Two on-chip PLLs generate the precise switching frequencies and quadrature-clock domains required by field-oriented control. The 144-LQFP package and -40C to +100C industrial temperature rating match the factory-floor thermal environment and the LQFP's rework-friendly outline eases field-service depanelization. Designers typically pair this FPGA with external gate drivers and isolated current shunts, while keeping the JTAG port accessible for in-system configuration updates.
Recomendado
Legacy Telecom Interface Cards
The EP1C6T144I7 is widely deployed in legacy telecom line cards and baseband processing cards where its 98 user I/Os interface directly to TDM buses, framer ICs, and T1/E1 transceivers. The 92,160 bits of embedded SRAM implement elastic stores, jitter attenuators, and small packet buffers without external memory, simplifying the BOM. LVTTL/LVCMOS I/O standards align with the 3.3V logic levels typical of telecom backplanes, while the two PLLs derive multiple clock domains from a single board-level reference. The industrial temperature rating and 144-LQFP plastic package suit indoor central-office environments, and the JTAG configuration mode supports in-service firmware updates via boundary-scan. Migration paths should retain the 144-LQFP footprint so the same PCB can accept Cyclone I, Cyclone II EP2C6, or even Cyclone IV EP4CE6 with proper pinout remapping.
Recomendado
Low-Cost Video Processing Pipelines
In entry-level video processing pipelines the EP1C6T144I7 functions as a frame-rate converter, scaler, or overlay compositor for digital signage and industrial camera systems. Its 5,980 LEs implement modest SDRAM controllers, color-space converters, and timing generators for resolutions up to 480p/576p without taxing the silicon. The 92,160-bit embedded memory acts as a line buffer, eliminating the need for an external SRAM in many simple pipelines. The 144-LQFP package is friendly to multi-layer video-PCB stack-ups where controlled-impedance routing for parallel RGB or BT.656 buses is required. Designers typically pair this FPGA with a video ADC/DAC and an SDRAM chip, using the two PLLs to derive pixel clocks from an external 27 MHz reference.
Recomendado
FPGA Development and Educational Platforms
The EP1C6T144I7 is a long-standing reference device for university FPGA labs and educational development boards because the 144-LQFP package allows students to probe every pin with standard oscilloscope clips and 0.1 inch headers. The 5,980 LEs provide enough headroom to teach state machines, FIFO design, soft-core CPU instantiation, and basic DSP filtering within a single semester. The Quartus II Web Edition toolchain (free of charge) supports this device end-to-end, including SOPC Builder for Nios II soft-core integration. With two PLLs and 98 user I/Os, students can experiment with multiple clock domains and rich peripheral interfaces (UART, SPI, I2C, VGA) on the same board. The industrial temperature rating protects against lab mishaps such as accidental soldering-iron heat exposure.
Recomendado
Factory Automation and Protocol Bridging
The EP1C6T144I7 is well-suited for factory-automation protocol bridges that translate between Profibus, Modbus RTU, CAN, and Ethernet/IP, where the 98 user I/Os drive multiple isolated RS-485 transceivers and a parallel bus to local sensors. Its 5,980 LEs comfortably host UART, SPI, and I2C soft-cores concurrently, while the on-chip M4K blocks back the protocol stack memory without external SRAM. The two PLLs allow independent clock generation for each fieldbus segment, eliminating the need for multiple oscillators on the BOM. The industrial -40C to +100C rating handles cabinet temperature swings near motor drives, and the LQFP-144 package supports hand-debug rework in low-volume bridge products.
Recomendado
Legacy CPLD-to-FPGA Migration Designs
Engineers migrating from legacy MAX7000/MAX3000 CPLD designs to a low-density FPGA find the EP1C6T144I7 a natural step-up target because the 144-LQFP package closely matches the footprint of many high-pin-count CPLDs. The 5,980 LEs deliver roughly 10x the logic capacity of a typical 256-macrocell CPLD while preserving a familiar JTAG programming interface. The 92,160-bit embedded memory replaces external lookup-table ROM hacks, and the two PLLs enable fine-grained clock-domain control absent in CPLDs. Cyclone I's 1.5V core and 3.3V-tolerant I/O ease migration from 5V-tolerant MAX7000 designs by inserting series resistors or level shifters as needed. Drop-in LQFP-144 variants (EP1C6T144I7N, EP1C6T144I6N) allow hot-grade selection without re-spinning the PCB.
Recomendado
Data Acquisition Front-End
In multi-channel data acquisition front-ends the EP1C6T144I7 sits between high-speed ADCs and an embedded controller, performing channel multiplexing, gain/offset calibration, and digital filtering in real time. Its 98 user I/Os accept parallel LVCMOS/LVTTL ADC buses up to 14 bits wide while the 5,980 LEs run FIR/IIR filters and decimation stages. The 92,160-bit embedded memory implements circular sample buffers, and the two PLLs derive ADC sample clocks and controller interface clocks independently. The 144-LQFP plastic package simplifies thermal management on densely-populated DAQ PCBs, and the industrial temperature grade accommodates benchtop-to-rack transitions in lab and field deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C6T144I7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C6T144I7N | EP1C6T144I6N | EP1C6T144C8N | EP1C6T144C6N | EP1C6T144C7N | EP1C6T14417N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP (T144) | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same |
| Logic Elements | 5,980 LE | 5,980 LE | 5,980 LE | 5,980 LE | 5,980 LE | 5,980 LE | 5,980 LE |
| User I/Os | 98 | 98 | 98 | 98 | 98 | 98 | 98 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | 7 | 7 | 6 | 8 | 6 | 7 | 7 |
| Lead-Free / RoHS | No (SnPb finish) | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) |
| Embedded Memory | 92,160 bits | 92,160 bits | 92,160 bits | 92,160 bits | 92,160 bits | 92,160 bits | 92,160 bits |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Principais diferenciais
- RoHS lead-free finish variant available in identical footprint (vs EP1C6T144I7N)
- Industrial temperature grade vs commercial variants (vs EP1C6T144C8N)
- Speed grade 7 vs lower Fmax alternatives (vs EP1C6T144I6N)
Notas de projeto
The EP1C6T144I7 requires two supply rails: VCCINT (1.5V core) and four VCCIO banks (typically 3.3V for LVTTL). Place 0.1uF ceramic decoupling capacitors as close as possible to every VCCINT and VCCIO pin, and add bulk 10uF tantalum or ceramic capacitors at each supply rail entry point. According to the Cyclone device handbook, inrush during configuration can spike above 1A on VCCINT for several milliseconds, so the 1.5V regulator must source at least 1.5A peak. A ferrite bead or pi-filter on the 1.5V rail improves margin against switching-noise coupling from adjacent digital circuitry.
Although the LQFP-144 package has a theta_JA around 30 C/W, the EP1C6T144I7 typically dissipates less than 1W even at 100% logic utilization because the 130nm Cyclone I process is very efficient. Thermal management is rarely a concern unless the device is operated in a sealed enclosure with no airflow. Estimated: at 0.8W dissipation and 30 C/W theta_JA, junction rise above ambient is about 24 C, well within the 100 C industrial max. Designers should still provide a top-side copper pour connected to GND to assist heat spreading.
Route all configuration-related pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, MSEL0, MSEL1) with short traces and avoid routing them adjacent to high-speed switching signals to prevent configuration errors. The JTAG chain (TCK, TMS, TDI, TDO) should include a 1k pull-down on TCK and 10k pull-ups on TMS and TDI per IEEE 1149.1 best practices. Maintain continuous ground reference under the LQFP-144 leads to control impedance, and use a 4-layer PCB stack-up with dedicated power and ground planes for designs above 50 MHz internal operation.
Do not confuse the EP1C6T144I7 (industrial, speed grade 7, SnPb) with the EP1C6T144I7N (industrial, speed grade 7, lead-free RoHS) when ordering; both share the same datasheet but only the 'N' suffix is RoHS-compliant. Also, the Cyclone I device family does NOT support passive parallel async configuration - use JTAG, Active Serial (EPCS1/EPCS4), or Passive Serial (with external host) only. Attempting to use unsupported modes will result in CONF_DONE never asserting. Lastly, MSEL pins must be tied to specific patterns per configuration mode - consult the Cyclone handbook Table 12 for the correct pull-up/pull-down combinations.
Informações de conformidade
EP1C6T144I7 uses SnPb lead-bearing plating (non-RoHS); for RoHS compliance use EP1C6T144I7N (NiPdAu lead-free finish). AEC-Q100 is not applicable because this is an FPGA, not an automotive-qualified IC. REACH compliance maintained by Intel/Altera substance disclosure.