EP1K10TC144-2N - 10K Gate ACEX-1K FPGA, 92 I/O, TQFP-144 | Intel / Altera
N.º da peça: EP1K10TC144-2N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
EP1K10TC144-2N Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the intersection of ASIC-like density and software-driven design flexibility, and are widely used for glue logic, protocol bridging, and parallel DSP pipelines in industrial, communications, and test equipment.
Key features include an embedded array block (EAB) architecture with 12 embedded array blocks implementing dual-port RAM, ROM, or multiplier functions; 72 logic array blocks (LABs) arranged across the die; built-in JTAG boundary-scan test circuitry compliant with IEEE 1149.1; and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL through dedicated I/O banks. Configuration is handled by a serial PROM, controller, or JTAG port, and the device operates from a single 2.5 V core supply with separate VCCIO rails for the I/O banks.
Typical applications include glue logic replacement on legacy PC/104 and VME boards, custom state-machine controllers in industrial automation equipment, low-density DSP pre/post-processing pipelines, and peripheral bridging (UART, I²C, SPI) in networking line cards. The 92 available I/O pins comfortably drive 8-bit or 16-bit parallel buses plus control signals, while the 12 Kbit embedded RAM supports small FIFO and lookup-table implementations without external memory.
Designers should pay particular attention to I/O bank voltage constraints: the EP1K10TC144-2N supports 2.5 V and 3.3 V on the same die, but mixing 5 V inputs requires external resistor dividers since the device has no 5 V-tolerant I/O. Quartus II design software (version 13.0 or earlier is the last release supporting ACEX-1K) is required for synthesis, place-and-route, and bitstream generation.
Alternativas drop-in para EP1K10TC144-2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K10TC144-2N (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Configuration Method, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K10TC144-1N
✅ Drop-In✓ Em estoque
$4.35 / unidade
Ver ficha técnica →EP1K10TC144-3N
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →EP1K10TC144-1
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EP1K10TC144-2
✅ Drop-In✓ Em estoque
$11.9 / unidade
Ver ficha técnica →EP1K10TC144-2N Classificações máximas e características elétricas
| Family | ACEX-1K |
| Typical Gates | 10,000 |
| Logic Elements | 576 |
| Embedded RAM Bits | 12,288 |
| Embedded Array Blocks (EABs) | 12 |
| Logic Array Blocks (LABs) | 72 |
| User I/O Pins | 92 |
| Encapsulamento | TQFP-144 (TC) 22x22 mm, 0.5 mm pitch |
| Speed Grade | -2 |
| Core Voltage | 2.5 V |
| Temperatura de operação | 0 C to +70 C (commercial) |
| Configuration Method | Serial / JTAG |
| JTAG Support | IEEE 1149.1 boundary scan |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EP1K10TC144-2N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 2) |
| Pino 12 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | GND — Ground |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | VCCINT — Core supply voltage (2.5 V) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 3) |
| Pino 35 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | GND — Ground |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | VCCINT — Core supply voltage (2.5 V) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 55 | GND — Ground |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | GND — Ground |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | VCCINT — Core supply voltage (2.5 V) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 79 | GND — Ground |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | I/O — User I/O pin (bank 1) |
| Pino 82 | I/O — User I/O pin (bank 1) |
| Pino 83 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 84 | I/O — User I/O pin (bank 1) |
| Pino 85 | I/O — User I/O pin (bank 1) |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — User I/O pin (bank 1) |
| Pino 88 | I/O — User I/O pin (bank 1) |
| Pino 89 | I/O — User I/O pin (bank 1) |
| Pino 90 | I/O — User I/O pin (bank 1) |
| Pino 91 | I/O — User I/O pin (bank 1) |
| Pino 92 | I/O — User I/O pin (bank 1) |
| Pino 93 | I/O — User I/O pin (bank 1) |
| Pino 94 | I/O — User I/O pin (bank 1) |
| Pino 95 | I/O — User I/O pin (bank 1) |
| Pino 96 | I/O — User I/O pin (bank 1) |
| Pino 97 | I/O — User I/O pin (bank 1) |
| Pino 98 | I/O — User I/O pin (bank 1) |
| Pino 99 | I/O — User I/O pin (bank 1) |
| Pino 100 | I/O — User I/O pin (bank 1) |
| Pino 101 | I/O — User I/O pin (bank 1) |
| Pino 102 | I/O — User I/O pin (bank 1) |
| Pino 103 | I/O — User I/O pin (bank 1) |
| Pino 104 | I/O — User I/O pin (bank 1) |
| Pino 105 | I/O — User I/O pin (bank 1) |
| Pino 106 | I/O — User I/O pin (bank 1) |
| Pino 107 | I/O — User I/O pin (bank 1) |
| Pino 108 | I/O — User I/O pin (bank 1) |
| Pino 109 | I/O — User I/O pin (bank 1) |
| Pino 110 | I/O — User I/O pin (bank 1) |
| Pino 111 | I/O — User I/O pin (bank 1) |
| Pino 112 | I/O — User I/O pin (bank 1) |
| Pino 113 | I/O — User I/O pin (bank 1) |
| Pino 114 | I/O — User I/O pin (bank 1) |
| Pino 115 | I/O — User I/O pin (bank 1) |
| Pino 116 | I/O — User I/O pin (bank 1) |
| Pino 117 | I/O — User I/O pin (bank 1) |
| Pino 118 | I/O — User I/O pin (bank 1) |
| Pino 119 | I/O — User I/O pin (bank 1) |
| Pino 120 | I/O — User I/O pin (bank 1) |
| Pino 121 | I/O — User I/O pin (bank 1) |
| Pino 122 | I/O — User I/O pin (bank 1) |
| Pino 123 | I/O — User I/O pin (bank 1) |
| Pino 124 | TDI — JTAG test data input |
| Pino 125 | TMS — JTAG test mode select |
| Pino 126 | TCK — JTAG test clock |
| Pino 127 | TDO — JTAG test data output |
| Pino 128 | nSTATUS — Configuration status (open-drain) |
| Pino 129 | nCONFIG — Configuration control (active-low) |
| Pino 130 | DCLK — Configuration clock input |
| Pino 131 | DATA0 — Configuration data input |
| Pino 132 | CONF_DONE — Configuration complete (open-drain) |
| Pino 133 | MSEL0 — Configuration mode select 0 |
| Pino 134 | MSEL1 — Configuration mode select 1 |
| Pino 135 | I/O — User I/O pin (bank 1) |
| Pino 136 | I/O — User I/O pin (bank 1) |
| Pino 137 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 138 | I/O — User I/O pin (bank 1) |
| Pino 139 | I/O — User I/O pin (bank 1) |
| Pino 140 | GND — Ground |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | I/O — User I/O pin (bank 1) |
Aplicações típicas
EP1K10TC144-2N é adequado para 6 aplicaçãos: Industrial Glue Logic Replacement, Legacy Peripheral Bridging, Low-Density DSP Pre/Post-Processing, Custom State Machine Controllers, Telecom Line Card Glue Logic, Military & Aerospace Legacy Systems.
Industrial Glue Logic Replacement
The EP1K10TC144-2N replaces multiple 74-series TTL and CMOS glue-logic ICs on legacy industrial controllers with a single programmable device, reducing board area and assembly cost. Its 576 logic elements and 12,288 bits of embedded RAM comfortably accommodate typical state machines, address decoders, and timing generators used in PLC backplanes and motor-control boards. The 92 user I/O pins and four independently supplied VCCIO banks allow direct interfacing with 3.3 V and 2.5 V peripherals on the same PCB. Designers benefit from Quartus II synthesis, which preserves schematic capture from MAX+PLUS II designs, easing migration of proven legacy logic.
Recomendado
Legacy Peripheral Bridging
The EP1K10TC144-2N acts as a custom bridge between mismatched peripherals such as UART, I²C, SPI, and parallel buses in industrial PCs and test equipment. Each of the 12 embedded array blocks can be configured as dual-port RAM, ROM, or a small multiplier, supporting protocol-conversion FIFOs without external memory. The 2.5 V core and JTAG-based in-system programming enable field updates through the standard IEEE 1149.1 test access port. Designers targeting legacy PC/104 and VMEbus cards can leverage the abundant I/O count and IEEE 1149.1 boundary-scan testability to replace discrete bridge ASICs.
Recomendado
Low-Density DSP Pre/Post-Processing
The EP1K10TC144-2N implements small DSP functions such as digital filters, FFT pre-processors, and CRC engines alongside an external DSP or microcontroller in cost-sensitive test and measurement equipment. The 12 embedded array blocks each support dedicated multiplier modes, allowing 8-bit or 12-bit multiply-accumulate (MAC) operations at system clock rates up to 50 MHz. While the 10K-gate density is modest by modern standards, it provides just enough logic for sensor conditioning and signal conditioning pipelines in portable instrumentation. Designers pair the FPGA with an external ADC/DAC for complete analog signal chains.
Recomendado
Custom State Machine Controllers
The EP1K10TC144-2N excels as a custom state-machine controller for industrial automation, robotics, and material-handling equipment where deterministic sequencing and reliable I/O control are essential. The 576 logic elements and 72 logic array blocks map cleanly onto multi-state FSMs with parallel datapath logic, while 92 user I/O pins comfortably drive sensor inputs, actuator relays, and HMI display interfaces. JTAG boundary-scan testability simplifies board-level debugging and in-field firmware updates through the standard test access port. Designers value the predictable timing closure achievable with Quartus II timing analysis for safety-critical sequencing.
Recomendado
Telecom Line Card Glue Logic
The EP1K10TC144-2N serves as glue logic on telecom line cards, replacing discrete bus-isolation, address-decoding, and interrupt-routing ICs around network processors and framer ASICs. The 12,288 bits of embedded RAM support small lookup tables used for header processing and routing decisions at line-card speeds. Four I/O banks allow direct 3.3 V interfacing to PHY chips and 2.5 V connections to the network processor, eliminating external level shifters. Designers benefit from low-cost legacy parts availability for long-lifecycle telecom infrastructure where reliability trumps performance.
Recomendado
Military & Aerospace Legacy Systems
The EP1K10TC144-2N continues to serve in long-lifecycle military, aerospace, and avionics platforms designed around ACEX-1K silicon in the late 1990s. While not radiation-hardened by modern standards, the commercial-grade device is qualified by many programs through up-screening processes and remains in service on legacy avionic displays, flight data recorders, and ground-test equipment. The 144-pin TQFP package is well-suited to high-vibration environments where fine-pitch BGAs are not desirable. Designers performing obsolescence management rely on factory-surplus and authorized-stock distributors for ongoing support.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K10TC144-2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K10TC144-1N | EP1K10TC144-3N | EP1K10TC144-1 | EP1K10TC144-2 |
|---|---|---|---|---|---|
| Package | TQFP-144 (TC) 22x22 mm | TQFP-144 (TC) - same | TQFP-144 (TC) - same | TQFP-144 (TC) - same | TQFP-144 (TC) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| User I/O Pins | 92 | 92 | 92 | 92 | 92 |
| Speed Grade | -2 | -1 (faster) | -3 (slower) | -1 (faster) | -2 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Balanced speed grade -2 with industry-standard TQFP-144 footprint (vs EP1K10TC144-1N)
- TQFP-144 is hand-solderable and field-rework friendly (vs EP1K10FC256-2N (FBGA-256))
- Mature ACEX-1K architecture with extensive Quartus II legacy support (vs Cyclone EP1C3T144C8N)
- On-site authentication and traceability through authorized distributors (vs Grey-market EP1K10TC144-2N lots)
Notas de projeto
The EP1K10TC144-2N requires a clean 2.5 V VCCINT rail for the core plus separate VCCIO supplies (2.5 V or 3.3 V) for each of the four I/O banks. Decouple each VCCINT and VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 µF tantalum capacitor near the FPGA supply entry point. Avoid routing high-frequency switching signals directly across the VCCINT plane to minimize core supply noise.
The TQFP-144 package has a theta_JA of approximately 35 °C/W in still air and around 25 °C/W with 400 cm² of 4-layer PCB copper. At typical 200 mA core current (500 mW dissipation), the junction temperature rises only 17 °C above ambient, so no heatsink is required. Estimated: assumed 4-layer JEDEC-standard test board and natural convection. Designers targeting sealed enclosures should add thermal vias beneath the package to the internal ground plane.
TQFP-144 with 0.5 mm pitch demands strict PCB layout discipline: trace width 0.15 mm minimum, via 0.3 mm drill, and a continuous ground plane beneath the package. Route all 92 user I/O signals on outer layers only and avoid stubs longer than 5 mm. Keep JTAG signals (TDI/TMS/TCK/TDO) bundled together and isolated from high-speed switching I/O. Solder paste stencil aperture should be 1:1 to land pad with 0.1 mm relief for fine-pitch 0.5 mm QFP packages.
Do not apply 5 V signals directly to the EP1K10TC144-2N user I/O pins because the device lacks 5 V-tolerant inputs; damage will result. Use external resistor dividers or level shifters (such as 74LVC245) for any 5 V source. Also ensure the nCONFIG and MSEL pins are correctly strapped for the desired configuration mode (e.g., MSEL=00 for passive serial). Configuration failures are most often caused by incorrect MSEL settings rather than silicon defects.
Series-terminate high-speed outputs (above 33 MHz) with a 33 Ω resistor placed within 5 mm of the FPGA driver pin to dampen reflections on 50 Ω controlled-impedance traces. For LVTTL outputs driving long capacitive loads, slew-rate adjustment via Quartus II settings reduces EMI. The four I/O banks must each have its VCCIO plane decoupled locally; mixing VCCIO voltages on a single bank is not supported and causes latch-up risk.
Informações de conformidade
RoHS status is not stated in the verified web data; the ACEX-1K family predates widespread RoHS adoption. Mark compliance fields as 'unknown' until factory documentation can be reviewed.
