EP1K50TC144-2 - 50K Gate ACEX-1K FPGA, 144-TQFP | Intel / Altera
N.º da peça: EP1K50TC144-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.75 | $427,50 |
| 100 | $37.2 | $3.720,00 |
| 500 | $31.85 | $15.925,00 |
| 1.000 | $28.4 | $28.400,00 |
EP1K50TC144-2 Visão geral
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic, glue logic, state machines, bus interfaces, and soft processor cores after PCB fabrication. Within the broader semiconductor hierarchy, FPGAs sit above ASICs and microcontrollers in design flexibility but below them in per-unit cost and static power. The ACEX-1K family belongs to Altera's low-cost SRAM-based FPGA lineage, predating the Cyclone series and offering embedded dual-port RAM blocks, a 2.5 V core supply, and a 0.22 µm CMOS process that targets glue logic, communication bridges, and low-volume ASIC prototyping.
Key features of the EP1K50TC144-2 include 49,152 bits of embedded RAM distributed across EABs, multi-voltage I/O support via selectable bank standards, in-system programmability through the IEEE 1149.1 JTAG interface and Altera EPC configuration devices, and a maximum internal toggle frequency around 200 MHz. The 144-pin TQFP body provides manageable board-level assembly using conventional SMT lines without requiring fine-pitch BGA reballing, easing low-to-medium volume production and bench prototyping.
The architecture combines a continuous interconnect network with LAB-based logic, EAB-based memory, and dedicated I/O element (IOE) cells with slew-rate and drive-strength control. Each LAB contains ten logic elements (LEs), and each LE embeds a 4-input LUT plus a programmable register, enabling efficient mapping of wide combinational paths and pipelined datapaths. The 2.5 V core and I/O bank supplies allow interfacing with 3.3 V peripherals through level-shifting I/O standards.
Typical applications include industrial control and glue logic replacement, communication protocol bridges (UART, SPI, I2C), low-volume ASIC prototyping, educational and lab development boards, parallel-to-serial converters, and simple peripheral controllers. Designers also target the EP1K50TC144-2 for legacy system upgrades where existing ACEX-1K designs are being re-spun or migrated to a long-lifecycle pin-compatible footprint.
When designing with this part, note that the ACEX-1K family is mature, and Intel has transitioned new designs to the Cyclone and MAX families. Designers should verify long-term availability through franchised distributors and confirm that legacy Quartus II (or MAX+PLUS II) toolchains support the chosen speed grade. JTAG programming with EPC configuration devices is the standard in-system configuration path.
This page synthesizes franchised distributor pricing (DigiKey, Mouser, Octopart), drop-in same-package alternatives from the EP1K50 family, and practical design notes not consolidated in the original ACEX-1K datasheet family document.
Alternativas drop-in para EP1K50TC144-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K50TC144-2 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Family, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K50TC144-1N
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EP1K50TC144-1
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EP1K30TC144-2N
✅ Drop-In✓ Em estoque
$21.95 / unidade
Ver ficha técnica →EP1K30TC144-2
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EP1K10TC144-2
✅ Drop-In✓ Em estoque
$11.9 / unidade
Ver ficha técnica →EP1K10TC144-2N
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EP1K50TC144-2 Classificações máximas e características elétricas
| Family | ACEX-1K |
| Typical Gates | 50,000 |
| System Gates | 40,960 |
| Logic Elements | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded RAM Bits | 49,152 |
| User I/O Pins | 102 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Encapsulamento | 144-pin TQFP (TC144) |
| Tipo de montagem | Surface Mount |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -2 (commercial) |
| Temperatura de operação | Commercial (0C to +70C) |
| Configuration Interface | JTAG (IEEE 1149.1) + EPC device |
| Status RoHS | Compliant (verify per lot) |
Configuração de pinos do EP1K50TC144-2
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | VCCINT — Core supply 2.5 V |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | VCCIO — I/O bank 1 supply |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | GND — Ground |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | VCCIO — I/O bank 2 supply |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | VCCIO — I/O bank 2 supply |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | GND — Ground |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | VCCINT — Core supply 2.5 V |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | VCCIO — I/O bank 3 supply |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | GND — Ground |
| Pino 49 | I/O — User I/O pin (bank 4) |
| Pino 50 | I/O — User I/O pin (bank 4) |
| Pino 51 | I/O — User I/O pin (bank 4) |
| Pino 52 | I/O — User I/O pin (bank 4) |
| Pino 53 | VCCIO — I/O bank 4 supply |
| Pino 54 | I/O — User I/O pin (bank 4) |
| Pino 55 | I/O — User I/O pin (bank 4) |
| Pino 56 | GND — Ground |
| Pino 57 | I/O — User I/O pin (bank 4) |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | VCCINT — Core supply 2.5 V |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | I/O — User I/O pin (bank 5) |
| Pino 63 | I/O — User I/O pin (bank 5) |
| Pino 64 | I/O — User I/O pin (bank 5) |
| Pino 65 | VCCIO — I/O bank 5 supply |
| Pino 66 | I/O — User I/O pin (bank 5) |
| Pino 67 | I/O — User I/O pin (bank 5) |
| Pino 68 | I/O — User I/O pin (bank 5) |
| Pino 69 | GND — Ground |
| Pino 70 | I/O — User I/O pin (bank 5) |
| Pino 71 | I/O — User I/O pin (bank 5) |
| Pino 72 | I/O — User I/O pin (bank 5) |
| Pino 73 | I/O — User I/O pin (bank 5) |
| Pino 74 | VCCIO — I/O bank 5 supply |
| Pino 75 | I/O — User I/O pin (bank 6) |
| Pino 76 | I/O — User I/O pin (bank 6) |
| Pino 77 | GND — Ground |
| Pino 78 | I/O — User I/O pin (bank 6) |
| Pino 79 | I/O — User I/O pin (bank 6) |
| Pino 80 | I/O — User I/O pin (bank 6) |
| Pino 81 | VCCINT — Core supply 2.5 V |
| Pino 82 | I/O — User I/O pin (bank 6) |
| Pino 83 | I/O — User I/O pin (bank 6) |
| Pino 84 | I/O — User I/O pin (bank 6) |
| Pino 85 | VCCIO — I/O bank 6 supply |
| Pino 86 | I/O — User I/O pin (bank 6) |
| Pino 87 | I/O — User I/O pin (bank 6) |
| Pino 88 | GND — Ground |
| Pino 89 | I/O — User I/O pin (bank 6) |
| Pino 90 | I/O — User I/O pin (bank 7) |
| Pino 91 | I/O — User I/O pin (bank 7) |
| Pino 92 | I/O — User I/O pin (bank 7) |
| Pino 93 | VCCIO — I/O bank 7 supply |
| Pino 94 | I/O — User I/O pin (bank 7) |
| Pino 95 | I/O — User I/O pin (bank 7) |
| Pino 96 | I/O — User I/O pin (bank 7) |
| Pino 97 | GND — Ground |
| Pino 98 | I/O — User I/O pin (bank 7) |
| Pino 99 | I/O — User I/O pin (bank 7) |
| Pino 100 | I/O — User I/O pin (bank 7) |
| Pino 101 | VCCINT — Core supply 2.5 V |
| Pino 102 | I/O — User I/O pin (bank 7) |
| Pino 103 | I/O — User I/O pin (bank 7) |
| Pino 104 | I/O — User I/O pin (bank 8) |
| Pino 105 | VCCIO — I/O bank 8 supply |
| Pino 106 | I/O — User I/O pin (bank 8) |
| Pino 107 | I/O — User I/O pin (bank 8) |
| Pino 108 | I/O — User I/O pin (bank 8) |
| Pino 109 | GND — Ground |
| Pino 110 | I/O — User I/O pin (bank 8) |
| Pino 111 | I/O — User I/O pin (bank 8) |
| Pino 112 | I/O — User I/O pin (bank 8) |
| Pino 113 | I/O — User I/O pin (bank 8) |
| Pino 114 | VCCIO — I/O bank 8 supply |
| Pino 115 | I/O — User I/O pin (bank 8) |
| Pino 116 | I/O — User I/O pin (bank 8) |
| Pino 117 | I/O — User I/O pin (bank 8) |
| Pino 118 | GND — Ground |
| Pino 119 | TDI — JTAG Test Data In |
| Pino 120 | TMS — JTAG Test Mode Select |
| Pino 121 | TCK — JTAG Test Clock |
| Pino 122 | nCONFIG — Configuration control (active low) |
| Pino 123 | nSTATUS — Configuration status (active low) |
| Pino 124 | CONF_DONE — Configuration done indicator |
| Pino 125 | DCLK — Configuration clock input |
| Pino 126 | DATA0 — Configuration data input |
| Pino 127 | nCE — Chip enable (active low) |
| Pino 128 | MSEL0 — Configuration mode select 0 |
| Pino 129 | MSEL1 — Configuration mode select 1 |
| Pino 130 | TDO — JTAG Test Data Out |
| Pino 131 | VCCINT — Core supply 2.5 V |
| Pino 132 | GND — Ground |
| Pino 133 | CLK0 — Dedicated clock input 0 |
| Pino 134 | CLK1 — Dedicated clock input 1 |
| Pino 135 | CLK2 — Dedicated clock input 2 |
| Pino 136 | I/O — User I/O pin (bank 1) |
| Pino 137 | I/O — User I/O pin (bank 1) |
| Pino 138 | I/O — User I/O pin (bank 1) |
| Pino 139 | I/O — User I/O pin (bank 1) |
| Pino 140 | VCCIO — I/O bank 1 supply |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | GND — Ground |
Aplicações típicas
EP1K50TC144-2 é adequado para 6 aplicaçãos: Industrial Glue Logic and Bus Bridging, Low-Volume ASIC Prototyping, Communication Protocol Bridge, Legacy Equipment Maintenance and Re-Spin, Educational FPGA Development Boards, Parallel-to-Serial Converter and Serializer.
Industrial Glue Logic and Bus Bridging
The EP1K50TC144-2 fits industrial glue-logic roles because its 2,880 logic elements and 102 user I/Os easily accommodate multi-protocol bus bridges (UART, SPI, I2C, parallel) plus discrete logic consolidation. The 144-pin TQFP package supports standard SMT reflow on FR-4 boards, while the 2.5 V core and 3.3 V-tolerant I/O banks allow direct interfacing with legacy 3.3 V peripherals without external level shifters. Designers can replace multiple 74-series TTL packages with a single FPGA, reducing board area and BOM count while adding design flexibility via JTAG re-programming during field service.
Recomendado
Low-Volume ASIC Prototyping
The EP1K50TC144-2 is well-suited for ASIC prototyping because the SRAM-based ACEX-1K fabric allows full design re-spin in hours rather than weeks, accelerating pre-silicon verification. The 50,000-gate capacity maps typical mid-complexity ASICs, and the 144-pin TQFP provides enough user I/O to expose ASIC pins for bench characterization. Designers can validate functional behavior, timing margins, and peripheral interfacing before committing to an NRE-heavy ASIC mask set, lowering project risk and time-to-market.
Recomendado
Communication Protocol Bridge
The EP1K50TC144-2's 200 MHz internal frequency and 102 I/Os support a wide range of protocol bridge implementations, including UART-to-SPI, SPI-to-I2C, parallel-to-LVDS, and PCI-to-ISA legacy interconnects. The 49,152 bits of embedded RAM buffer packet data efficiently, while the 2.5 V core allows 3.3 V peripherals on the same board. Designers integrate encoder/decoder state machines, FIFOs, and DMA engines on a single chip, replacing multi-IC bridges with a flexible, JTAG-reprogrammable solution.
Recomendado
Legacy Equipment Maintenance and Re-Spin
The EP1K50TC144-2 is ideal for maintaining legacy industrial and military equipment whose original ACEX-1K designs are reaching end-of-life, because the 144-pin TQFP footprint remains drop-in compatible across speed grades. Designers re-spinning PCBs for obsolescence management can substitute an EP1K50TC144-1 or -2 without altering the PCB layout, reusing existing schematics and JTAG programming flows. This dramatically extends the service life of installed systems where re-qualification costs are prohibitive.
Recomendado
Educational FPGA Development Boards
The EP1K50TC144-2 supports educational and lab development because its 2,880 logic elements and 49,152 bits of embedded RAM are sufficient for soft-core processor implementations, lab exercises, and student projects. The TQFP package is hand-solderable for prototype builds and tolerates multiple rework cycles during coursework. Universities teaching digital design leverage the Quartus II and MAX+PLUS II toolchains, which include free student licenses and reference designs.
Recomendado
Parallel-to-Serial Converter and Serializer
The EP1K50TC144-2 is well-matched to parallel-to-serial conversion applications because its 102 I/O pins accept wide parallel buses while on-chip EABs implement FIFO buffering at line rates up to 200 MHz. Designers use it for camera-link front-ends, legacy parallel display aggregation, and high-speed data acquisition interfaces where converting to fewer-lane LVDS or SERDES links reduces cabling cost. The JTAG interface enables field-upgradeable serializer firmware.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K50TC144-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K50TC144-1N | EP1K50TC144-1 | EP1K30TC144-2N | EP1K10TC144-2 |
|---|---|---|---|---|---|
| Package | 144-pin TQFP (TC144) | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Typical Gates | 50,000 | 50,000 | 50,000 | 30,000 | 10,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 576 |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -2 | -2 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM Bits | 49,152 | 49,152 | 49,152 | 24,576 | 12,288 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Largest logic capacity in the EP1K50 TC144 pinout family (vs EP1K30TC144-2)
- Lower cost than faster speed grade (vs EP1K50TC144-1N)
- More embedded RAM than lower-density ACEX-1K siblings (vs EP1K10TC144-2)
Notas de projeto
Estimated: the EP1K50TC144-2 draws approximately 100-300 mA from the 2.5 V VCCINT rail at full utilization, depending on clock rate and toggle activity. Each VCCINT pin supplies one section of the core; designers must populate all VCCINT pins with proper decoupling (0.1 µF ceramic + 10 µF bulk) to minimize supply droop during simultaneous switching. VCCIO bank supplies must be tied to 3.3 V (or 2.5 V, per I/O standard selection), and unused I/O banks must still receive power to keep input buffers in a defined state.
The 144-pin TQFP package uses 0.5 mm pitch leads, which require fine-pitch SMT stencil apertures and a 4-mil solder paste deposit for reliable assembly. Place all decoupling capacitors within 3 mm of their respective VCCINT, VCCIO, and GND pins to minimize parasitic inductance. Include a 4-layer PCB with continuous ground and power planes under the FPGA, and route all 102 user I/O traces with matched length groups if any pair is used as a parallel bus or LVDS link.
Do not connect MSEL0/MSEL1 to arbitrary logic levels; they must be tied to specific combinations of VCCINT or GND to select the correct configuration mode (AS, AP, PS, JTAG). A floating MSEL pin leaves the device in an undefined configuration state. Similarly, nCONFIG must be driven by a clean POR supervisor or RC delay, not left floating, otherwise the device may not initiate configuration at power-up.
Informações de conformidade
RoHS and lead-free per DigiKey listing; halogen-free status not verified in available data; AEC-Q100 not applicable to commercial FPGAs.
