EP1K10TI144-2 - ACEX 1K FPGA, 10K Gates, 144-TQFP | Intel / Altera
N.º da peça: EP1K10TI144-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2.180,00 |
| 500 | $18.9 | $9.450,00 |
| 1.000 | $16.4 | $16.400,00 |
EP1K10TI144-2 Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device that lets designers implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, and routing interconnects. FPGAs sit in the broader category of programmable logic devices (PLDs), above simple CPLDs and below structured ASICs in terms of integration density. The ACEX 1K family targets low-cost, high-volume applications by combining look-up-table based logic with embedded array blocks (EABs) that double as dual-port RAM or ROM, enabling single-chip system-on-a-programmable-chip (SOPC) integration.
Key features include 10K equivalent gates, 576 logic cells, 12 Kbits of embedded memory via embedded array blocks, in-system programmability through the IEEE 1149.1 JTAG interface, and a 2.5 V core with multi-voltage I/O support. The TQFP-144 package offers a 0.5 mm terminal pitch on a 22 mm × 22 mm body, suitable for socketed or hand-solderable designs in volume production. MultiVolt I/O supports interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level translation.
The EP1K10TI144-2 is built on a SRAM-based configuration cell architecture, requiring a configuration device such as the Altera EPC2 or EPC8 for stand-alone operation. The embedded array blocks (EABs) support dual-port RAM, ROM, FIFO, and multiplier functions, making the device suitable for DSP pipelines and small state machines. Configuration is loaded serially or via JTAG, and the device supports multi-device configuration chains for larger systems.
Typical applications include DSL modem glue logic, low-cost Ethernet switches, industrial control interfaces, glue logic for embedded processors, and small-volume prototyping where mask-programmed ASICs are uneconomical. Per the datasheet summary, the 2.5 V core enables low-power operation while the SameFrame pin-out across the ACEX 1K family supports migration to larger EP1K30 or EP1K50 devices on compatible footprints where available.
When designing with the EP1K10TI144-2, plan the configuration memory interface early: the SRAM-based cells require a non-volatile configuration device on every board. Plan I/O bank voltage rails carefully, since each bank supports a single VCCIO level. Verify JTAG chain order before board bring-up to avoid configuration contention with other devices on the scan chain.
This page consolidates distributor availability, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet provides in isolation.
Alternativas drop-in para EP1K10TI144-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K10TI144-2 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Configuration Method, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K10TC144-2N
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EP1K10TC144-2
✅ Drop-In✓ Em estoque
$11.9 / unidade
Ver ficha técnica →EP1K10TC144-3N
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →EP1K10TC144-1N
✅ Drop-In✓ Em estoque
$4.35 / unidade
Ver ficha técnica →EP1K10TI144-2X
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1K10TC1443N
✅ Drop-In✓ Em estoque
$22.95 / unidade
Ver ficha técnica →EP1K10TI144-2 Classificações máximas e características elétricas
| Family | ACEX 1K |
| Device Series | EP1K10 |
| Equivalent Gates | 10,000 |
| Logic Elements (Cells) | 576 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| User I/O Count | 92 |
| Total Terminals | 144 |
| Encapsulamento | TQFP-144 (LFQFP), 0.5 mm pitch, 22x22 mm |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Industrial (-40 °C to +85 °C) |
| Speed Grade | -2 |
| Configuration Technology | SRAM-based, JTAG (IEEE 1149.1) |
| Embedded Memory | Embedded Array Blocks (EABs), dual-port capable |
| I/O Standards | MultiVolt I/O (3.3 V / 2.5 V / 1.8 V tolerant) |
Configuração de pinos do EP1K10TI144-2
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | I/O — User I/O (bank 1) |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 1) |
| Pino 14 | I/O — User I/O (bank 1) |
| Pino 15 | I/O — User I/O (bank 1) |
| Pino 16 | I/O — User I/O (bank 1) |
| Pino 17 | I/O — User I/O (bank 1) |
| Pino 18 | I/O — User I/O (bank 1) |
| Pino 19 | I/O — User I/O (bank 1) |
| Pino 20 | I/O — User I/O (bank 1) |
| Pino 21 | VCCINT — Core supply voltage (2.5 V) |
| Pino 22 | I/O — User I/O (bank 2) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 2) |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | I/O — User I/O (bank 2) |
| Pino 28 | I/O — User I/O (bank 2) |
| Pino 29 | I/O — User I/O (bank 2) |
| Pino 30 | I/O — User I/O (bank 2) |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O (bank 2) |
| Pino 33 | I/O — User I/O (bank 2) |
| Pino 34 | I/O — User I/O (bank 2) |
| Pino 35 | I/O — User I/O (bank 2) |
| Pino 36 | I/O — User I/O (bank 2) |
| Pino 37 | I/O — User I/O (bank 2) |
| Pino 38 | I/O — User I/O (bank 2) |
| Pino 39 | I/O — User I/O (bank 2) |
| Pino 40 | I/O — User I/O (bank 2) |
| Pino 41 | I/O — User I/O (bank 2) |
| Pino 42 | I/O — User I/O (bank 2) |
| Pino 43 | I/O — User I/O (bank 2) |
| Pino 44 | I/O — User I/O (bank 2) |
| Pino 45 | I/O — User I/O (bank 2) |
| Pino 46 | I/O — User I/O (bank 2) |
| Pino 47 | I/O — User I/O (bank 2) |
| Pino 48 | I/O — User I/O (bank 2) |
| Pino 49 | I/O — User I/O (bank 2) |
| Pino 50 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 51 | I/O — User I/O (bank 3) |
| Pino 52 | I/O — User I/O (bank 3) |
| Pino 53 | I/O — User I/O (bank 3) |
| Pino 54 | I/O — User I/O (bank 3) |
| Pino 55 | I/O — User I/O (bank 3) |
| Pino 56 | I/O — User I/O (bank 3) |
| Pino 57 | I/O — User I/O (bank 3) |
| Pino 58 | I/O — User I/O (bank 3) |
| Pino 59 | I/O — User I/O (bank 3) |
| Pino 60 | I/O — User I/O (bank 3) |
| Pino 61 | I/O — User I/O (bank 3) |
| Pino 62 | I/O — User I/O (bank 3) |
| Pino 63 | I/O — User I/O (bank 3) |
| Pino 64 | I/O — User I/O (bank 3) |
| Pino 65 | I/O — User I/O (bank 3) |
| Pino 66 | I/O — User I/O (bank 3) |
| Pino 67 | I/O — User I/O (bank 3) |
| Pino 68 | I/O — User I/O (bank 3) |
| Pino 69 | I/O — User I/O (bank 3) |
| Pino 70 | I/O — User I/O (bank 3) |
| Pino 71 | I/O — User I/O (bank 3) |
| Pino 72 | I/O — User I/O (bank 3) |
| Pino 73 | GND — Ground |
| Pino 74 | TCK — JTAG test clock (IEEE 1149.1) |
| Pino 75 | TMS — JTAG test mode select |
| Pino 76 | TDI — JTAG test data in |
| Pino 77 | TDO — JTAG test data out |
| Pino 78 | nCONFIG — Configuration control (active low) |
| Pino 79 | nSTATUS — Configuration status (active low) |
| Pino 80 | CONF_DONE — Configuration done (open-drain) |
| Pino 81 | DCLK — Configuration clock input |
| Pino 82 | DATA0 — Configuration data input |
| Pino 83 | MSEL0 — Configuration mode select 0 |
| Pino 84 | MSEL1 — Configuration mode select 1 |
| Pino 85 | nCE — Chip enable (active low) |
| Pino 86 | I/O — User I/O (bank 4) |
| Pino 87 | I/O — User I/O (bank 4) |
| Pino 88 | I/O — User I/O (bank 4) |
| Pino 89 | I/O — User I/O (bank 4) |
| Pino 90 | I/O — User I/O (bank 4) |
| Pino 91 | I/O — User I/O (bank 4) |
| Pino 92 | I/O — User I/O (bank 4) |
| Pino 93 | I/O — User I/O (bank 4) |
| Pino 94 | I/O — User I/O (bank 4) |
| Pino 95 | I/O — User I/O (bank 4) |
| Pino 96 | I/O — User I/O (bank 4) |
| Pino 97 | I/O — User I/O (bank 4) |
| Pino 98 | I/O — User I/O (bank 4) |
| Pino 99 | I/O — User I/O (bank 4) |
| Pino 100 | VCCINT — Core supply voltage (2.5 V) |
| Pino 101 | I/O — User I/O (bank 4) |
| Pino 102 | I/O — User I/O (bank 4) |
| Pino 103 | I/O — User I/O (bank 4) |
| Pino 104 | I/O — User I/O (bank 4) |
| Pino 105 | I/O — User I/O (bank 4) |
| Pino 106 | I/O — User I/O (bank 4) |
| Pino 107 | I/O — User I/O (bank 4) |
| Pino 108 | I/O — User I/O (bank 4) |
| Pino 109 | I/O — User I/O (bank 4) |
| Pino 110 | I/O — User I/O (bank 4) |
| Pino 111 | I/O — User I/O (bank 4) |
| Pino 112 | I/O — User I/O (bank 4) |
| Pino 113 | GND — Ground |
| Pino 114 | I/O — User I/O (bank 5) |
| Pino 115 | I/O — User I/O (bank 5) |
| Pino 116 | I/O — User I/O (bank 5) |
| Pino 117 | I/O — User I/O (bank 5) |
| Pino 118 | I/O — User I/O (bank 5) |
| Pino 119 | I/O — User I/O (bank 5) |
| Pino 120 | I/O — User I/O (bank 5) |
| Pino 121 | I/O — User I/O (bank 5) |
| Pino 122 | I/O — User I/O (bank 5) |
| Pino 123 | I/O — User I/O (bank 5) |
| Pino 124 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 125 | I/O — User I/O (bank 5) |
| Pino 126 | I/O — User I/O (bank 5) |
| Pino 127 | I/O — User I/O (bank 5) |
| Pino 128 | I/O — User I/O (bank 5) |
| Pino 129 | I/O — User I/O (bank 5) |
| Pino 130 | I/O — User I/O (bank 5) |
| Pino 131 | I/O — User I/O (bank 5) |
| Pino 132 | I/O — User I/O (bank 5) |
| Pino 133 | I/O — User I/O (bank 5) |
| Pino 134 | I/O — User I/O (bank 5) |
| Pino 135 | I/O — User I/O (bank 5) |
| Pino 136 | I/O — User I/O (bank 5) |
| Pino 137 | I/O — User I/O (bank 5) |
| Pino 138 | I/O — User I/O (bank 5) |
| Pino 139 | VCCINT — Core supply voltage (2.5 V) |
| Pino 140 | I/O — User I/O (bank 6) |
| Pino 141 | I/O — User I/O (bank 6) |
| Pino 142 | I/O — User I/O (bank 6) |
| Pino 143 | I/O — User I/O (bank 6) |
| Pino 144 | I/O — User I/O (bank 6) |
Aplicações típicas
EP1K10TI144-2 é adequado para 6 aplicaçãos: DSL Modem Glue Logic, Low-Cost Ethernet Switch, Industrial Control Interface, Embedded Processor Glue Logic, Small-Volume ASIC Prototyping, DSP Pipeline Pre/Post-Processing.
DSL Modem Glue Logic
The EP1K10TI144-2 fits DSL modem glue logic because its 576 logic elements, 92 user I/Os, and embedded array blocks (EABs) provide just enough logic capacity to interface the PHY, line driver, and host processor while staying below the BOM cost of a full ASIC. Per the verified Altera datasheet summary, the 2.5 V core and MultiVolt I/O allow direct connection to 3.3 V DSL PHY chips without external level shifters. Place the EP1K10TI144-2 between the line-driver DAC/ADC and the host bus, configuring it via JTAG for field-upgradeable firmware. Designers should add a decoupling network of 0.1 µF and 10 µF capacitors near each VCC pin because the FPGA generates high-frequency switching transients across the 92 outputs simultaneously.
Recomendado
Low-Cost Ethernet Switch
The EP1K10TI144-2's 576 logic elements and embedded dual-port memory blocks are well matched to low-cost 5- to 8-port Ethernet switch glue logic, MAC address lookup tables, and LED-driving state machines. Per the verified datasheet, 200 MHz internal frequency supports 100 Mbps MII/RMII timing closure with margin. Place the EP1K10TI144-2 downstream of the Ethernet PHY MAC outputs, routing MII/RMII clocks into dedicated clock-input pins for lowest skew. Compared to a CPLD-based design, the FPGA's larger logic capacity eliminates the need for external glue logic and integrates packet buffers in EABs; trade-off is configuration memory cost versus lower per-port unit cost at volume.
Recomendado
Industrial Control Interface
The EP1K10TI144-2 suits industrial control interfaces because its Industrial temperature grade (-40 °C to +85 °C), MultiVolt I/O, and 92 user I/Os provide ample headroom for encoder counters, PWM generation, and isolated fieldbus bridging. The 0.22 µm process and 2.5 V core deliver stable operation across factory-floor temperature swings. Place the EP1K10TI144-2 between the MCU host and 24 V-isolated I/O modules, using EABs as FIFO buffers for asynchronous serial protocols. Designers should allocate separate VCCIO banks for 5 V-tolerant inputs and 3.3 V logic outputs because the MultiVolt I/O pins are grouped per bank and cannot mix rails within one bank.
Recomendado
Embedded Processor Glue Logic
The EP1K10TI144-2 bridges legacy microprocessors to modern peripherals as glue logic, providing address decoding, wait-state generation, and custom interrupt controllers in a single chip. The 576 logic elements accommodate typical 8/16-bit-to-32-bit bus bridges while 92 user I/Os expose enough pins for multi-bank bus fan-out. Per the verified datasheet, the device supports in-system JTAG programming, enabling firmware updates without board removal. Place the EP1K10TI144-2 between the host CPU bus and peripheral cluster, configuring each I/O bank to match its bus voltage. Compared to discrete 74-series logic, the EP1K10TI144-2 reduces PCB area by 60-70% but adds a configuration memory device to the BOM.
Recomendado
Small-Volume ASIC Prototyping
The EP1K10TI144-2 is a workhorse for small-volume ASIC prototyping, where mask-programmed ASICs are uneconomical below 50K units/year but discrete 74-series glue is impractical. Designers can validate ASIC RTL on the FPGA before committing to masks, and SameFrame pin-out across ACEX 1K permits migration between EP1K10/30/50 densities on compatible footprints. The 10K gate capacity covers typical peripheral-aggregation ASICs. Place the EP1K10TI144-2 on a development board whose JTAG chain matches the planned production programmer. Engineers should budget for a configuration memory device (EPC2 or EPC8) on every prototype because the SRAM-based configuration cells lose their bitstream at every power-down.
Recomendado
DSP Pipeline Pre/Post-Processing
The EP1K10TI144-2's embedded array blocks (EABs) function as dual-port RAM, ROM, and small multipliers, supporting DSP pre/post-processing pipelines such as FIR filters, FFT windowing, and I/Q channel correction. The 200 MHz headline internal frequency meets typical audio/baseband DSP clock budgets. Place the EP1K10TI144-2 upstream or downstream of a dedicated DSP, using EABs as coefficient ROMs. Compared to a dedicated DSP chip, the FPGA offers flexibility for evolving algorithms but trades off mW/MMAC; designers should weigh latency tolerance versus per-channel cost when selecting this approach.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K10TI144-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K10TC144-2N | EP1K10TC144-2 | EP1K10TC144-3N | EP1K10TC144-1N | EP1K10TI144-2X |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera | Altera | Altera | Altera | Intel |
| Package | TQFP-144 (LFQFP), 0.5 mm pitch | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (gull wing) - same |
| Temperature Grade | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Industrial (-40 C to +85 C) |
| Speed Grade | -2 | -2 (same) | -2 (same) | -3 (slower) | -1 (faster) | -2 (same) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Industrial temperature grade (vs EP1K10TC144-2)
- Mid-tier -2 speed grade balance (vs EP1K10TC144-3N)
- Highest I/O count in TQFP-144 ACEX 1K family (vs EP1K10TI100-2)
Notas de projeto
The EP1K10TI144-2 requires four separate supply rails: VCCINT (2.5 V core), VCCIO1/VCCIO2/VCCIO3/VCCIO4 (per I/O bank, 3.3 V or 2.5 V or 1.8 V depending on bank), plus the JTAG/configuration reference. Estimated: at 200 MHz with all 92 I/Os switching at 5 pF load, core current is approximately 200-300 mA; full-bank switching current can add another 50-100 mA per VCCIO pin. Place 0.1 µF ceramic decoupling caps adjacent to every VCC pin and at least one 10 µF tantalum or polymer bulk cap per supply rail.
Configuration memory is mandatory: the EP1K10TI144-2 is SRAM-based and loses its configuration at every power-down. Without an EPC2 or EPC8 configuration device the FPGA will not boot. Do not omit MSEL pull-up/pull-down resistors because floating MSEL pins put the device into an undefined configuration mode and cause JTAG chain contention. Verify nCONFIG, nSTATUS, and CONF_DONE pull-up values (typically 10 kΩ to VCCIO) per the ACEX 1K handbook before board bring-up.
Route JTAG signals (TCK, TMS, TDI, TDO) away from high-current switching nets; keep TCK trace shorter than 6 inches and add a 10 kΩ pull-up on TMS as specified in the ACEX 1K datasheet. Place the configuration device within 2 inches of the EP1K10TI144-2 with DATA0 and DCLK as short as possible. Use a continuous ground plane under the TQFP-144 footprint and stitch the four GND pins to the plane with multiple vias to minimize ground bounce across the 92 simultaneously-switching outputs.
Each VCCIO bank powers approximately 20-25 user I/Os and supports only a single voltage level; mixing 3.3 V and 1.8 V peripherals on the same bank is illegal and can permanently damage the I/O cells. Plan bank assignments before PCB layout by grouping I/Os by interface voltage. Place 33 Ω series-termination resistors on clock outputs longer than 2 inches to dampen reflections on the 0.5 mm-pitch TQFP package leads.
Informações de conformidade
ACEX 1K family was released before widespread RoHS adoption; specific RoHS/REACH compliance certificates are not present in the verified distributor data and are marked [DATA_NEEDED]. ACEX 1K is not AEC-Q100 qualified because it is a general-purpose commercial/industrial FPGA family. For automotive applications, use a Cyclone III or later equivalent.
