EP1K10TC144-2N - 10K Gate ACEX-1K FPGA, 92 I/O, TQFP-144 | Intel / Altera
Référence : EP1K10TC144-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.75 | $9 750,00 |
EP1K10TC144-2N Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the intersection of ASIC-like density and software-driven design flexibility, and are widely used for glue logic, protocol bridging, and parallel DSP pipelines in industrial, communications, and test equipment.
Key features include an embedded array block (EAB) architecture with 12 embedded array blocks implementing dual-port RAM, ROM, or multiplier functions; 72 logic array blocks (LABs) arranged across the die; built-in JTAG boundary-scan test circuitry compliant with IEEE 1149.1; and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL through dedicated I/O banks. Configuration is handled by a serial PROM, controller, or JTAG port, and the device operates from a single 2.5 V core supply with separate VCCIO rails for the I/O banks.
Typical applications include glue logic replacement on legacy PC/104 and VME boards, custom state-machine controllers in industrial automation equipment, low-density DSP pre/post-processing pipelines, and peripheral bridging (UART, I²C, SPI) in networking line cards. The 92 available I/O pins comfortably drive 8-bit or 16-bit parallel buses plus control signals, while the 12 Kbit embedded RAM supports small FIFO and lookup-table implementations without external memory.
Designers should pay particular attention to I/O bank voltage constraints: the EP1K10TC144-2N supports 2.5 V and 3.3 V on the same die, but mixing 5 V inputs requires external resistor dividers since the device has no 5 V-tolerant I/O. Quartus II design software (version 13.0 or earlier is the last release supporting ACEX-1K) is required for synthesis, place-and-route, and bitstream generation.
Alternatives de remplacement direct pour EP1K10TC144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K10TC144-2N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K10TC144-1N
✅ Remplacement direct✓ En stock
$4.35 / unité
Voir la fiche technique →EP1K10TC144-3N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EP1K10TC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K10TC144-2
✅ Remplacement direct✓ En stock
$11.9 / unité
Voir la fiche technique →EP1K10TC144-2N Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Typical Gates | 10,000 |
| Logic Elements | 576 |
| Embedded RAM Bits | 12,288 |
| Embedded Array Blocks (EABs) | 12 |
| Logic Array Blocks (LABs) | 72 |
| User I/O Pins | 92 |
| Boîtier | TQFP-144 (TC) 22x22 mm, 0.5 mm pitch |
| Speed Grade | -2 |
| Core Voltage | 2.5 V |
| Température de fonctionnement | 0 C to +70 C (commercial) |
| Configuration Method | Serial / JTAG |
| JTAG Support | IEEE 1149.1 boundary scan |
| Type de montage | Surface Mount |
Configuration des broches de EP1K10TC144-2N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 2) |
| Broche 12 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | GND — Ground |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | VCCINT — Core supply voltage (2.5 V) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | GND — Ground |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | VCCINT — Core supply voltage (2.5 V) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | VCCINT — Core supply voltage (2.5 V) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | I/O — User I/O pin (bank 1) |
| Broche 82 | I/O — User I/O pin (bank 1) |
| Broche 83 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 84 | I/O — User I/O pin (bank 1) |
| Broche 85 | I/O — User I/O pin (bank 1) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O pin (bank 1) |
| Broche 88 | I/O — User I/O pin (bank 1) |
| Broche 89 | I/O — User I/O pin (bank 1) |
| Broche 90 | I/O — User I/O pin (bank 1) |
| Broche 91 | I/O — User I/O pin (bank 1) |
| Broche 92 | I/O — User I/O pin (bank 1) |
| Broche 93 | I/O — User I/O pin (bank 1) |
| Broche 94 | I/O — User I/O pin (bank 1) |
| Broche 95 | I/O — User I/O pin (bank 1) |
| Broche 96 | I/O — User I/O pin (bank 1) |
| Broche 97 | I/O — User I/O pin (bank 1) |
| Broche 98 | I/O — User I/O pin (bank 1) |
| Broche 99 | I/O — User I/O pin (bank 1) |
| Broche 100 | I/O — User I/O pin (bank 1) |
| Broche 101 | I/O — User I/O pin (bank 1) |
| Broche 102 | I/O — User I/O pin (bank 1) |
| Broche 103 | I/O — User I/O pin (bank 1) |
| Broche 104 | I/O — User I/O pin (bank 1) |
| Broche 105 | I/O — User I/O pin (bank 1) |
| Broche 106 | I/O — User I/O pin (bank 1) |
| Broche 107 | I/O — User I/O pin (bank 1) |
| Broche 108 | I/O — User I/O pin (bank 1) |
| Broche 109 | I/O — User I/O pin (bank 1) |
| Broche 110 | I/O — User I/O pin (bank 1) |
| Broche 111 | I/O — User I/O pin (bank 1) |
| Broche 112 | I/O — User I/O pin (bank 1) |
| Broche 113 | I/O — User I/O pin (bank 1) |
| Broche 114 | I/O — User I/O pin (bank 1) |
| Broche 115 | I/O — User I/O pin (bank 1) |
| Broche 116 | I/O — User I/O pin (bank 1) |
| Broche 117 | I/O — User I/O pin (bank 1) |
| Broche 118 | I/O — User I/O pin (bank 1) |
| Broche 119 | I/O — User I/O pin (bank 1) |
| Broche 120 | I/O — User I/O pin (bank 1) |
| Broche 121 | I/O — User I/O pin (bank 1) |
| Broche 122 | I/O — User I/O pin (bank 1) |
| Broche 123 | I/O — User I/O pin (bank 1) |
| Broche 124 | TDI — JTAG test data input |
| Broche 125 | TMS — JTAG test mode select |
| Broche 126 | TCK — JTAG test clock |
| Broche 127 | TDO — JTAG test data output |
| Broche 128 | nSTATUS — Configuration status (open-drain) |
| Broche 129 | nCONFIG — Configuration control (active-low) |
| Broche 130 | DCLK — Configuration clock input |
| Broche 131 | DATA0 — Configuration data input |
| Broche 132 | CONF_DONE — Configuration complete (open-drain) |
| Broche 133 | MSEL0 — Configuration mode select 0 |
| Broche 134 | MSEL1 — Configuration mode select 1 |
| Broche 135 | I/O — User I/O pin (bank 1) |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | I/O — User I/O pin (bank 1) |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | I/O — User I/O pin (bank 1) |
Applications typiques
EP1K10TC144-2N convient pour 6 applications: Industrial Glue Logic Replacement, Legacy Peripheral Bridging, Low-Density DSP Pre/Post-Processing, Custom State Machine Controllers, Telecom Line Card Glue Logic, Military & Aerospace Legacy Systems.
Industrial Glue Logic Replacement
The EP1K10TC144-2N replaces multiple 74-series TTL and CMOS glue-logic ICs on legacy industrial controllers with a single programmable device, reducing board area and assembly cost. Its 576 logic elements and 12,288 bits of embedded RAM comfortably accommodate typical state machines, address decoders, and timing generators used in PLC backplanes and motor-control boards. The 92 user I/O pins and four independently supplied VCCIO banks allow direct interfacing with 3.3 V and 2.5 V peripherals on the same PCB. Designers benefit from Quartus II synthesis, which preserves schematic capture from MAX+PLUS II designs, easing migration of proven legacy logic.
Recommandé
Legacy Peripheral Bridging
The EP1K10TC144-2N acts as a custom bridge between mismatched peripherals such as UART, I²C, SPI, and parallel buses in industrial PCs and test equipment. Each of the 12 embedded array blocks can be configured as dual-port RAM, ROM, or a small multiplier, supporting protocol-conversion FIFOs without external memory. The 2.5 V core and JTAG-based in-system programming enable field updates through the standard IEEE 1149.1 test access port. Designers targeting legacy PC/104 and VMEbus cards can leverage the abundant I/O count and IEEE 1149.1 boundary-scan testability to replace discrete bridge ASICs.
Recommandé
Low-Density DSP Pre/Post-Processing
The EP1K10TC144-2N implements small DSP functions such as digital filters, FFT pre-processors, and CRC engines alongside an external DSP or microcontroller in cost-sensitive test and measurement equipment. The 12 embedded array blocks each support dedicated multiplier modes, allowing 8-bit or 12-bit multiply-accumulate (MAC) operations at system clock rates up to 50 MHz. While the 10K-gate density is modest by modern standards, it provides just enough logic for sensor conditioning and signal conditioning pipelines in portable instrumentation. Designers pair the FPGA with an external ADC/DAC for complete analog signal chains.
Recommandé
Custom State Machine Controllers
The EP1K10TC144-2N excels as a custom state-machine controller for industrial automation, robotics, and material-handling equipment where deterministic sequencing and reliable I/O control are essential. The 576 logic elements and 72 logic array blocks map cleanly onto multi-state FSMs with parallel datapath logic, while 92 user I/O pins comfortably drive sensor inputs, actuator relays, and HMI display interfaces. JTAG boundary-scan testability simplifies board-level debugging and in-field firmware updates through the standard test access port. Designers value the predictable timing closure achievable with Quartus II timing analysis for safety-critical sequencing.
Recommandé
Telecom Line Card Glue Logic
The EP1K10TC144-2N serves as glue logic on telecom line cards, replacing discrete bus-isolation, address-decoding, and interrupt-routing ICs around network processors and framer ASICs. The 12,288 bits of embedded RAM support small lookup tables used for header processing and routing decisions at line-card speeds. Four I/O banks allow direct 3.3 V interfacing to PHY chips and 2.5 V connections to the network processor, eliminating external level shifters. Designers benefit from low-cost legacy parts availability for long-lifecycle telecom infrastructure where reliability trumps performance.
Recommandé
Military & Aerospace Legacy Systems
The EP1K10TC144-2N continues to serve in long-lifecycle military, aerospace, and avionics platforms designed around ACEX-1K silicon in the late 1990s. While not radiation-hardened by modern standards, the commercial-grade device is qualified by many programs through up-screening processes and remains in service on legacy avionic displays, flight data recorders, and ground-test equipment. The 144-pin TQFP package is well-suited to high-vibration environments where fine-pitch BGAs are not desirable. Designers performing obsolescence management rely on factory-surplus and authorized-stock distributors for ongoing support.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K10TC144-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K10TC144-1N | EP1K10TC144-3N | EP1K10TC144-1 | EP1K10TC144-2 |
|---|---|---|---|---|---|
| Package | TQFP-144 (TC) 22x22 mm | TQFP-144 (TC) - same | TQFP-144 (TC) - same | TQFP-144 (TC) - same | TQFP-144 (TC) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| User I/O Pins | 92 | 92 | 92 | 92 | 92 |
| Speed Grade | -2 | -1 (faster) | -3 (slower) | -1 (faster) | -2 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Balanced speed grade -2 with industry-standard TQFP-144 footprint (vs EP1K10TC144-1N)
- TQFP-144 is hand-solderable and field-rework friendly (vs EP1K10FC256-2N (FBGA-256))
- Mature ACEX-1K architecture with extensive Quartus II legacy support (vs Cyclone EP1C3T144C8N)
- On-site authentication and traceability through authorized distributors (vs Grey-market EP1K10TC144-2N lots)
Notes de conception
The EP1K10TC144-2N requires a clean 2.5 V VCCINT rail for the core plus separate VCCIO supplies (2.5 V or 3.3 V) for each of the four I/O banks. Decouple each VCCINT and VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 µF tantalum capacitor near the FPGA supply entry point. Avoid routing high-frequency switching signals directly across the VCCINT plane to minimize core supply noise.
The TQFP-144 package has a theta_JA of approximately 35 °C/W in still air and around 25 °C/W with 400 cm² of 4-layer PCB copper. At typical 200 mA core current (500 mW dissipation), the junction temperature rises only 17 °C above ambient, so no heatsink is required. Estimated: assumed 4-layer JEDEC-standard test board and natural convection. Designers targeting sealed enclosures should add thermal vias beneath the package to the internal ground plane.
TQFP-144 with 0.5 mm pitch demands strict PCB layout discipline: trace width 0.15 mm minimum, via 0.3 mm drill, and a continuous ground plane beneath the package. Route all 92 user I/O signals on outer layers only and avoid stubs longer than 5 mm. Keep JTAG signals (TDI/TMS/TCK/TDO) bundled together and isolated from high-speed switching I/O. Solder paste stencil aperture should be 1:1 to land pad with 0.1 mm relief for fine-pitch 0.5 mm QFP packages.
Do not apply 5 V signals directly to the EP1K10TC144-2N user I/O pins because the device lacks 5 V-tolerant inputs; damage will result. Use external resistor dividers or level shifters (such as 74LVC245) for any 5 V source. Also ensure the nCONFIG and MSEL pins are correctly strapped for the desired configuration mode (e.g., MSEL=00 for passive serial). Configuration failures are most often caused by incorrect MSEL settings rather than silicon defects.
Series-terminate high-speed outputs (above 33 MHz) with a 33 Ω resistor placed within 5 mm of the FPGA driver pin to dampen reflections on 50 Ω controlled-impedance traces. For LVTTL outputs driving long capacitive loads, slew-rate adjustment via Quartus II settings reduces EMI. The four I/O banks must each have its VCCIO plane decoupled locally; mixing VCCIO voltages on a single bank is not supported and causes latch-up risk.
Informations de conformité
RoHS status is not stated in the verified web data; the ACEX-1K family predates widespread RoHS adoption. Mark compliance fields as 'unknown' until factory documentation can be reviewed.
