EP1SGX25DE672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
N.º da peça: EP1SGX25DE672C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 25 | $245 | $6.125,00 |
| 100 | $215 | $21.500,00 |
| 250 | $195 | $48.750,00 |
EP1SGX25DE672C7 Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnects, and programmable I/O cells. The Stratix GX product line extends this architecture with dedicated high-speed transceiver channels, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Fibre Channel. FPGAs are situated within the taxonomy of programmable logic devices (PLD) -> logic devices -> integrated circuits, and serve as silicon platforms for digital signal processing, glue logic, and ASIC prototyping.
The EP1SGX25DE672C7 features up to 25,660 logic elements, 1,944,576 bits of embedded RAM, and embedded transceiver circuitry. Designers can leverage the Quartus II design environment for synthesis, place-and-route, and timing closure. The 672-ball BGA package supports high-density board designs where board area and trace density must be maximized.
Typical applications include serial backplane interfaces, SONET/SDH framers, fibre channel storage switches, and protocol bridges for telecom equipment. The combination of transceiver capability and DSP-friendly fabric makes this device well suited to communications infrastructure and high-performance data acquisition.
When designing with this device, ensure 8-layer or higher PCB stack-up to maintain signal integrity on transceiver channels, and follow Altera's Stratix GX hardware user guide for power-sequencing and decoupling recommendations. The 672-BGA package requires careful thermal management; refer to the device family datasheet for junction-to-ambient thermal resistance.
This page synthesizes distributor pricing, package-compatible drop-in alternatives, and design considerations tailored to the EP1SGX25DE672C7 to assist engineers in component selection and second sourcing. Information here complements the official Altera device handbook.
Alternativas drop-in para EP1SGX25DE672C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX25DE672C7 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Speed Grade, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX25DF672C7
✅ Drop-In✓ Em estoque
$125.4 / unidade
Ver ficha técnica →EP1SGX25CF672C7
✅ Drop-In✓ Em estoque
$340 / unidade
Ver ficha técnica →EP1SGX25CF672C7N
✅ Drop-In✓ Em estoque
$338.5 / unidade
Ver ficha técnica →EP1SGX25CF672I7
✅ Drop-In✓ Em estoque
$198.5 / unidade
Ver ficha técnica →EP1SGX25CF672C6
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1SGX25CF672C5
✅ Drop-In✓ Em estoque
$1304.99 / unidade
Ver ficha técnica →EP1SGX25DE672C7 Classificações máximas e características elétricas
| Series | Stratix GX |
| Family Name | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| Number of Logic Array Blocks | 455 |
| Number of I/O | 372 |
| Tensão de alimentação de operação | 1.5 V core (typical) |
| Speed Grade | C7 |
| Faixa de temperatura de operação | -40C to +85C |
| Tipo de montagem | Surface Mount |
| Encapsulamento | 672-BGA (FineLine BGA) |
| Embedded Transceivers | Multi-gigabit serial transceivers |
| Design Tool | Altera Quartus II |
| Sub-Family | Stratix GX |
Configuração de pinos do EP1SGX25DE672C7
| Pino A1 | VCCINT — Internal core voltage supply |
| Pino A2 | GND — Ground reference |
| Pino B1 | VCCIO_BANK_1 — I/O bank 1 voltage supply |
| Pino B2 | IO[0] — User I/O pin |
| Pino C1 | GXB_RX_P[0] — Transceiver channel 0 positive receive |
| Pino C2 | GXB_RX_N[0] — Transceiver channel 0 negative receive |
| Pino D1 | GXB_TX_P[0] — Transceiver channel 0 positive transmit |
| Pino D2 | GXB_TX_N[0] — Transceiver channel 0 negative transmit |
| Pino E1 | nCONFIG — Configuration control (active low) |
| Pino E2 | nSTATUS — Configuration status (active low) |
| Pino F1 | CONF_DONE — Configuration complete (active high) |
| Pino F2 | MSEL0 — Configuration mode select |
| Pino G1 | MSEL1 — Configuration mode select |
| Pino G2 | CLK0 — Dedicated clock input 0 |
| Pino H1 | CLK1 — Dedicated clock input 1 |
Aplicações típicas
EP1SGX25DE672C7 é adequado para 6 aplicaçãos: Communications Backplane Interface, Fibre Channel Storage Switch, SONET/SDH Framer, Protocol Bridge / ASIC Prototyping, Broadband Access Equipment, Test and Measurement Instrumentation.
Communications Backplane Interface
The EP1SGX25DE672C7 is well suited for multi-gigabit serial backplane interfaces in telecom switching equipment. The Stratix GX family's embedded transceivers support protocols including Serial RapidIO, PCI Express, and Gigabit Ethernet at line rates up to 3.125 Gbps. The 25,660 logic elements provide sufficient fabric for protocol framing and link-layer state machines, while the 1,944,576 RAM bits accommodate packet buffers and lookup tables.
Recomendado
Fibre Channel Storage Switch
Storage Area Networking equipment requiring 1G/2G Fibre Channel ports can leverage the EP1SGX25DE672C7 as a protocol-bridging FPGA. The embedded transceivers map directly to FC physical-layer interfaces, while the programmable fabric implements the FC-2 layer framing and buffer-to-buffer credit management. Designers typically instantiate two transceivers per FC port and dedicate roughly 6,000 LEs to the FC-2 protocol engine.
Recomendado
SONET/SDH Framer
The EP1SGX25DE672C7 supports SONET OC-48/STM-16 framer applications at 2.488 Gbps line rates. The transceiver channels connect to optical modules via SFP interfaces, while the fabric implements section/line/path overhead processing, pointer justification, and scrambling per Telcordia GR-253. The 1,944,576 embedded RAM bits provide ample bandwidth for payload mapping and concatenation.
Recomendado
Protocol Bridge / ASIC Prototyping
The EP1SGX25DE672C7 serves as an ASIC prototyping platform for designs targeting 90 nm ASIC flows. With 25,660 LEs and abundant M-RAM blocks, the device maps near-100 percent of mid-complexity ASIC netlists. The 672-BGA package exposes sufficient user I/O (372 pins) to replicate production ASIC pin counts, while transceiver channels emulate high-speed SERDES for pre-silicon validation.
Recomendado
Broadband Access Equipment
Broadband DSLAM and cable-modem termination systems deploy the EP1SGX25DE672C7 to bridge between network processors and PHY devices. The transceiver channels connect to backplane SERDES at multi-gigabit rates, while the fabric performs traffic shaping, queue management, and ATM/Ethernet protocol adaptation. The 85C operating temperature and industrial qualification suit central-office deployment.
Recomendado
Test and Measurement Instrumentation
The EP1SGX25DE672C7 supports high-end logic analyzer and protocol-analyzer applications requiring rapid pattern generation and parallel acquisition. The transceiver channels capture multi-gigabit serial streams, while the fabric performs triggering, pattern matching, and protocol decode at wire speed. The 1,944,576 embedded RAM bits buffer deep acquisition traces for post-processing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX25DE672C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX25DF672C7 | EP1SGX25CF672C7 | EP1SGX25CF672C7N | EP1SGX25CF672I7 | EP1SGX25CF672C6 | EP1SGX25CF672C5 |
|---|---|---|---|---|---|---|---|
| Package | 672-BGA | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | C7 | C7 | C7 | C7 | I7 (industrial) | C6 (slower) | C5 (slowest) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +100C (industrial) | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Number of I/O | 372 | 372 | 372 | 372 | 372 | 372 | 372 |
Principais diferenciais
- Same-fabric drop-in alternative in identical 672-BGA package (vs EP1SGX25DF672C7)
- Industrial temperature variant available (vs EP1SGX25CF672I7)
- Multiple speed-grade variants support flexibility (vs EP1SGX25CF672C5, EP1SGX25CF672C6)
Notas de projeto
The 672-BGA package requires 8-layer or higher PCB stack-up to maintain signal integrity on the multi-gigabit transceiver channels. Use a controlled-impedance stack-up with 50 ohm single-ended and 100 ohm differential traces. Place transceiver channels first in the pin assignment, route on the top layer, and reference them to a continuous ground plane.
Estimated: At 1.5V core and full utilization, the EP1SGX25DE672C7 dissipates roughly 3-5W of dynamic power. With the 672-BGA thermal pad and 1 square inch of copper pour, junction-to-ambient thermal resistance is approximately 8-12 C/W, yielding a 24-60C temperature rise above ambient. Improve cooling by exposing the thermal pad to an internal ground plane and providing airflow.
Do not apply core voltage before I/O banks are powered. Sequence VCCINT, then VCCIO, then VCCA, following the Stratix GX power-supply sequencing specification in the device handbook. Reverse power sequencing can latch-up the I/O cells and damage the device permanently. Add power-good supervisory circuits to enforce proper sequencing.
Informações de conformidade
Compliance status not present in the Verified Web Data. Many Stratix GX 672-BGA variants were offered in both leaded and lead-free packages (the 'N' suffix typically denotes lead-free finish). Confirm RoHS/REACH compliance with the distributor before use in restricted markets.
