EP1SGX25DE672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
MPN: EP1SGX25DE672C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 25 | $245 | $6,125.00 |
| 100 | $215 | $21,500.00 |
| 250 | $195 | $48,750.00 |
Drop-in alternatives for EP1SGX25DE672C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DE672C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family Name | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| Number of Logic Array Blocks | 455 |
| Number of I/O | 372 |
| Operating Supply Voltage | 1.5 V core (typical) |
| Speed Grade | C7 |
| Operating Temperature Range | -40C to +85C |
| Mounting Type | Surface Mount |
| Package | 672-BGA (FineLine BGA) |
| Embedded Transceivers | Multi-gigabit serial transceivers |
| Design Tool | Altera Quartus II |
| Sub-Family | Stratix GX |
EP1SGX25DE672C7 Pin Configuration
| Pin A1 | VCCINT — Internal core voltage supply |
| Pin A2 | GND — Ground reference |
| Pin B1 | VCCIO_BANK_1 — I/O bank 1 voltage supply |
| Pin B2 | IO[0] — User I/O pin |
| Pin C1 | GXB_RX_P[0] — Transceiver channel 0 positive receive |
| Pin C2 | GXB_RX_N[0] — Transceiver channel 0 negative receive |
| Pin D1 | GXB_TX_P[0] — Transceiver channel 0 positive transmit |
| Pin D2 | GXB_TX_N[0] — Transceiver channel 0 negative transmit |
| Pin E1 | nCONFIG — Configuration control (active low) |
| Pin E2 | nSTATUS — Configuration status (active low) |
| Pin F1 | CONF_DONE — Configuration complete (active high) |
| Pin F2 | MSEL0 — Configuration mode select |
| Pin G1 | MSEL1 — Configuration mode select |
| Pin G2 | CLK0 — Dedicated clock input 0 |
| Pin H1 | CLK1 — Dedicated clock input 1 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DE672C7 is suitable for 6 applications: Communications Backplane Interface, Fibre Channel Storage Switch, SONET/SDH Framer, Protocol Bridge / ASIC Prototyping, Broadband Access Equipment, Test and Measurement Instrumentation.
Communications Backplane Interface
The EP1SGX25DE672C7 is well suited for multi-gigabit serial backplane interfaces in telecom switching equipment. The Stratix GX family's embedded transceivers support protocols including Serial RapidIO, PCI Express, and Gigabit Ethernet at line rates up to 3.125 Gbps. The 25,660 logic elements provide sufficient fabric for protocol framing and link-layer state machines, while the 1,944,576 RAM bits accommodate packet buffers and lookup tables.
Recommended
Fibre Channel Storage Switch
Storage Area Networking equipment requiring 1G/2G Fibre Channel ports can leverage the EP1SGX25DE672C7 as a protocol-bridging FPGA. The embedded transceivers map directly to FC physical-layer interfaces, while the programmable fabric implements the FC-2 layer framing and buffer-to-buffer credit management. Designers typically instantiate two transceivers per FC port and dedicate roughly 6,000 LEs to the FC-2 protocol engine.
Recommended
SONET/SDH Framer
The EP1SGX25DE672C7 supports SONET OC-48/STM-16 framer applications at 2.488 Gbps line rates. The transceiver channels connect to optical modules via SFP interfaces, while the fabric implements section/line/path overhead processing, pointer justification, and scrambling per Telcordia GR-253. The 1,944,576 embedded RAM bits provide ample bandwidth for payload mapping and concatenation.
Recommended
Protocol Bridge / ASIC Prototyping
The EP1SGX25DE672C7 serves as an ASIC prototyping platform for designs targeting 90 nm ASIC flows. With 25,660 LEs and abundant M-RAM blocks, the device maps near-100 percent of mid-complexity ASIC netlists. The 672-BGA package exposes sufficient user I/O (372 pins) to replicate production ASIC pin counts, while transceiver channels emulate high-speed SERDES for pre-silicon validation.
Recommended
Broadband Access Equipment
Broadband DSLAM and cable-modem termination systems deploy the EP1SGX25DE672C7 to bridge between network processors and PHY devices. The transceiver channels connect to backplane SERDES at multi-gigabit rates, while the fabric performs traffic shaping, queue management, and ATM/Ethernet protocol adaptation. The 85C operating temperature and industrial qualification suit central-office deployment.
Recommended
Test and Measurement Instrumentation
The EP1SGX25DE672C7 supports high-end logic analyzer and protocol-analyzer applications requiring rapid pattern generation and parallel acquisition. The transceiver channels capture multi-gigabit serial streams, while the fabric performs triggering, pattern matching, and protocol decode at wire speed. The 1,944,576 embedded RAM bits buffer deep acquisition traces for post-processing.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DE672C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672C7 | EP1SGX25CF672C7 | EP1SGX25CF672C7N | EP1SGX25CF672I7 | EP1SGX25CF672C6 | EP1SGX25CF672C5 |
|---|---|---|---|---|---|---|---|
| Package | 672-BGA | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | C7 | C7 | C7 | C7 | I7 (industrial) | C6 (slower) | C5 (slowest) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +100C (industrial) | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Number of I/O | 372 | 372 | 372 | 372 | 372 | 372 | 372 |
Key Differentiators
- Same-fabric drop-in alternative in identical 672-BGA package (vs EP1SGX25DF672C7)
- Industrial temperature variant available (vs EP1SGX25CF672I7)
- Multiple speed-grade variants support flexibility (vs EP1SGX25CF672C5, EP1SGX25CF672C6)
Design Notes
The 672-BGA package requires 8-layer or higher PCB stack-up to maintain signal integrity on the multi-gigabit transceiver channels. Use a controlled-impedance stack-up with 50 ohm single-ended and 100 ohm differential traces. Place transceiver channels first in the pin assignment, route on the top layer, and reference them to a continuous ground plane.
Estimated: At 1.5V core and full utilization, the EP1SGX25DE672C7 dissipates roughly 3-5W of dynamic power. With the 672-BGA thermal pad and 1 square inch of copper pour, junction-to-ambient thermal resistance is approximately 8-12 C/W, yielding a 24-60C temperature rise above ambient. Improve cooling by exposing the thermal pad to an internal ground plane and providing airflow.
Do not apply core voltage before I/O banks are powered. Sequence VCCINT, then VCCIO, then VCCA, following the Stratix GX power-supply sequencing specification in the device handbook. Reverse power sequencing can latch-up the I/O cells and damage the device permanently. Add power-good supervisory circuits to enforce proper sequencing.
Compliance Information
Compliance status not present in the Verified Web Data. Many Stratix GX 672-BGA variants were offered in both leaded and lead-free packages (the 'N' suffix typically denotes lead-free finish). Confirm RoHS/REACH compliance with the distributor before use in restricted markets.
