EP1SGX25DE672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
부품 번호: EP1SGX25DE672C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 25 | $245 | $6,125.00 |
| 100 | $215 | $21,500.00 |
| 250 | $195 | $48,750.00 |
EP1SGX25DE672C7 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnects, and programmable I/O cells. The Stratix GX product line extends this architecture with dedicated high-speed transceiver channels, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Fibre Channel. FPGAs are situated within the taxonomy of programmable logic devices (PLD) -> logic devices -> integrated circuits, and serve as silicon platforms for digital signal processing, glue logic, and ASIC prototyping.
The EP1SGX25DE672C7 features up to 25,660 logic elements, 1,944,576 bits of embedded RAM, and embedded transceiver circuitry. Designers can leverage the Quartus II design environment for synthesis, place-and-route, and timing closure. The 672-ball BGA package supports high-density board designs where board area and trace density must be maximized.
Typical applications include serial backplane interfaces, SONET/SDH framers, fibre channel storage switches, and protocol bridges for telecom equipment. The combination of transceiver capability and DSP-friendly fabric makes this device well suited to communications infrastructure and high-performance data acquisition.
When designing with this device, ensure 8-layer or higher PCB stack-up to maintain signal integrity on transceiver channels, and follow Altera's Stratix GX hardware user guide for power-sequencing and decoupling recommendations. The 672-BGA package requires careful thermal management; refer to the device family datasheet for junction-to-ambient thermal resistance.
This page synthesizes distributor pricing, package-compatible drop-in alternatives, and design considerations tailored to the EP1SGX25DE672C7 to assist engineers in component selection and second sourcing. Information here complements the official Altera device handbook.
드롭인 대체품: EP1SGX25DE672C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DE672C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF672C7
✅ 드롭인✓ 재고 있음
$125.4 / 개
데이터시트 보기 →EP1SGX25CF672C7
✅ 드롭인✓ 재고 있음
$340 / 개
데이터시트 보기 →EP1SGX25CF672C7N
✅ 드롭인✓ 재고 있음
$338.5 / 개
데이터시트 보기 →EP1SGX25CF672I7
✅ 드롭인✓ 재고 있음
$198.5 / 개
데이터시트 보기 →EP1SGX25CF672C6
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672C5
✅ 드롭인✓ 재고 있음
$1304.99 / 개
데이터시트 보기 →EP1SGX25DE672C7 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Family Name | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| Number of Logic Array Blocks | 455 |
| Number of I/O | 372 |
| 동작 공급 전압 | 1.5 V core (typical) |
| Speed Grade | C7 |
| 동작 온도 범위 | -40C to +85C |
| 실장 유형 | Surface Mount |
| 패키지 | 672-BGA (FineLine BGA) |
| Embedded Transceivers | Multi-gigabit serial transceivers |
| Design Tool | Altera Quartus II |
| Sub-Family | Stratix GX |
EP1SGX25DE672C7 핀 구성
| 핀 A1 | VCCINT — Internal core voltage supply |
| 핀 A2 | GND — Ground reference |
| 핀 B1 | VCCIO_BANK_1 — I/O bank 1 voltage supply |
| 핀 B2 | IO[0] — User I/O pin |
| 핀 C1 | GXB_RX_P[0] — Transceiver channel 0 positive receive |
| 핀 C2 | GXB_RX_N[0] — Transceiver channel 0 negative receive |
| 핀 D1 | GXB_TX_P[0] — Transceiver channel 0 positive transmit |
| 핀 D2 | GXB_TX_N[0] — Transceiver channel 0 negative transmit |
| 핀 E1 | nCONFIG — Configuration control (active low) |
| 핀 E2 | nSTATUS — Configuration status (active low) |
| 핀 F1 | CONF_DONE — Configuration complete (active high) |
| 핀 F2 | MSEL0 — Configuration mode select |
| 핀 G1 | MSEL1 — Configuration mode select |
| 핀 G2 | CLK0 — Dedicated clock input 0 |
| 핀 H1 | CLK1 — Dedicated clock input 1 |
일반적인 애플리케이션
EP1SGX25DE672C7 적합 용도: 6 애플리케이션s: Communications Backplane Interface, Fibre Channel Storage Switch, SONET/SDH Framer, Protocol Bridge / ASIC Prototyping, Broadband Access Equipment, Test and Measurement Instrumentation.
Communications Backplane Interface
The EP1SGX25DE672C7 is well suited for multi-gigabit serial backplane interfaces in telecom switching equipment. The Stratix GX family's embedded transceivers support protocols including Serial RapidIO, PCI Express, and Gigabit Ethernet at line rates up to 3.125 Gbps. The 25,660 logic elements provide sufficient fabric for protocol framing and link-layer state machines, while the 1,944,576 RAM bits accommodate packet buffers and lookup tables.
추천
Fibre Channel Storage Switch
Storage Area Networking equipment requiring 1G/2G Fibre Channel ports can leverage the EP1SGX25DE672C7 as a protocol-bridging FPGA. The embedded transceivers map directly to FC physical-layer interfaces, while the programmable fabric implements the FC-2 layer framing and buffer-to-buffer credit management. Designers typically instantiate two transceivers per FC port and dedicate roughly 6,000 LEs to the FC-2 protocol engine.
추천
SONET/SDH Framer
The EP1SGX25DE672C7 supports SONET OC-48/STM-16 framer applications at 2.488 Gbps line rates. The transceiver channels connect to optical modules via SFP interfaces, while the fabric implements section/line/path overhead processing, pointer justification, and scrambling per Telcordia GR-253. The 1,944,576 embedded RAM bits provide ample bandwidth for payload mapping and concatenation.
추천
Protocol Bridge / ASIC Prototyping
The EP1SGX25DE672C7 serves as an ASIC prototyping platform for designs targeting 90 nm ASIC flows. With 25,660 LEs and abundant M-RAM blocks, the device maps near-100 percent of mid-complexity ASIC netlists. The 672-BGA package exposes sufficient user I/O (372 pins) to replicate production ASIC pin counts, while transceiver channels emulate high-speed SERDES for pre-silicon validation.
추천
Broadband Access Equipment
Broadband DSLAM and cable-modem termination systems deploy the EP1SGX25DE672C7 to bridge between network processors and PHY devices. The transceiver channels connect to backplane SERDES at multi-gigabit rates, while the fabric performs traffic shaping, queue management, and ATM/Ethernet protocol adaptation. The 85C operating temperature and industrial qualification suit central-office deployment.
추천
Test and Measurement Instrumentation
The EP1SGX25DE672C7 supports high-end logic analyzer and protocol-analyzer applications requiring rapid pattern generation and parallel acquisition. The transceiver channels capture multi-gigabit serial streams, while the fabric performs triggering, pattern matching, and protocol decode at wire speed. The 1,944,576 embedded RAM bits buffer deep acquisition traces for post-processing.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DE672C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF672C7 | EP1SGX25CF672C7 | EP1SGX25CF672C7N | EP1SGX25CF672I7 | EP1SGX25CF672C6 | EP1SGX25CF672C5 |
|---|---|---|---|---|---|---|---|
| Package | 672-BGA | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | C7 | C7 | C7 | C7 | I7 (industrial) | C6 (slower) | C5 (slowest) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +100C (industrial) | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Number of I/O | 372 | 372 | 372 | 372 | 372 | 372 | 372 |
주요 차별점
- Same-fabric drop-in alternative in identical 672-BGA package (vs EP1SGX25DF672C7)
- Industrial temperature variant available (vs EP1SGX25CF672I7)
- Multiple speed-grade variants support flexibility (vs EP1SGX25CF672C5, EP1SGX25CF672C6)
설계 노트
The 672-BGA package requires 8-layer or higher PCB stack-up to maintain signal integrity on the multi-gigabit transceiver channels. Use a controlled-impedance stack-up with 50 ohm single-ended and 100 ohm differential traces. Place transceiver channels first in the pin assignment, route on the top layer, and reference them to a continuous ground plane.
Estimated: At 1.5V core and full utilization, the EP1SGX25DE672C7 dissipates roughly 3-5W of dynamic power. With the 672-BGA thermal pad and 1 square inch of copper pour, junction-to-ambient thermal resistance is approximately 8-12 C/W, yielding a 24-60C temperature rise above ambient. Improve cooling by exposing the thermal pad to an internal ground plane and providing airflow.
Do not apply core voltage before I/O banks are powered. Sequence VCCINT, then VCCIO, then VCCA, following the Stratix GX power-supply sequencing specification in the device handbook. Reverse power sequencing can latch-up the I/O cells and damage the device permanently. Add power-good supervisory circuits to enforce proper sequencing.
규정 준수 정보
Compliance status not present in the Verified Web Data. Many Stratix GX 672-BGA variants were offered in both leaded and lead-free packages (the 'N' suffix typically denotes lead-free finish). Confirm RoHS/REACH compliance with the distributor before use in restricted markets.
