EP1SGX25DF1020C6BN - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
N.º da peça: EP1SGX25DF1020C6BN ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $355 | $35.500,00 |
| 500 | $320 | $160.000,00 |
| 1.000 | $290 | $290.000,00 |
EP1SGX25DF1020C6BN Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to configure digital logic blocks and interconnect routing after manufacture. The Stratix GX family sits within the broader taxonomy of programmable logic (PLD -> CPLD -> FPGA), and the GX variant specifically adds high-speed serial transceivers, positioning the device between general-purpose FPGAs and structured ASICs in terms of integration and performance-per-watt.
Key features of the EP1SGX25DF1020C6BN include 20 full-duplex embedded transceiver channels supporting multiple serial protocols, 607 user I/O pins, dedicated DSP blocks for high-throughput signal processing, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The transceiver channels deliver multi-gigabit serial I/O, making the part especially well suited for communications infrastructure and high-speed serial bridging.
Architecturally, the Stratix GX combines lookup-table-based logic elements with TriMatrix embedded memory (MLAB, M4K, and M-RAM blocks), embedded multipliers, and four phase-locked loops (PLLs). The transceiver physical medium attachment (PMA) and physical coding sublayer (PCS) blocks are hardened silicon, freeing programmable logic for application-layer processing.
Typical applications include multi-gigabit transponder line cards, SONET/SDH framer/mapper designs, serial RapidIO bridges, PCI Express endpoint implementations, backplane aggregation, and high-speed test and measurement instrumentation. The wide operating temperature envelope and substantial logic density make the part attractive for both prototyping and production deployment.
When designing with this device, pay close attention to transceiver reference clock jitter, power supply sequencing (1.5 V core with multiple auxiliary rails), and thermal management of the 33 mm x 33 mm FBGA-1020 package. Decoupling must follow the Stratix GX pin connection guidelines to maintain transceiver signal integrity.
This page synthesizes distributor pricing, drop-in Altera/Intel Stratix GX alternatives, and practical design considerations not consolidated on a single manufacturer page.
Alternativas drop-in para EP1SGX25DF1020C6BN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX25DF1020C6BN (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Speed Grade, DSP Blocks, Transceivers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX25DF1020C6
✅ Drop-In✓ Em estoque
$289 / unidade
Ver ficha técnica →EP1SGX25DF1020C6B
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP1SGX25DF1020C7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$145 / unidade
Ver ficha técnica →EP1SGX25DF1020C5N
✅ Drop-In✓ Em estoque
$650 / unidade
Ver ficha técnica →EP1SGX25DF1020C4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1180 / unidade
Ver ficha técnica →EP1SGX25DF1020C6BN Classificações máximas e características elétricas
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Total RAM Bits | 1,944,576 |
| User I/O | 607 |
| Number of Transceivers | 20 |
| Supply Voltage (Core) | 1.5 V |
| Temperatura de operação | 0C to 85C (commercial) |
| Speed Grade | -6 |
| Package Type | 1020-BBGA (33 mm x 33 mm, 1 mm pitch) |
| Tipo de montagem | Surface Mount |
| Lead Free | Yes |
| Process Technology | CMOS |
| Configuration | SRAM-based, configuration device required |
Guia de Configuração de Pinos do EP1SGX25DF1020C6BN 1020-bbga (33 mm x 33 mm, 1 mm pitch)
Configuração de pinos para EP1SGX25DF1020C6BN (pacote 1020-bbga (33 mm x 33 mm, 1 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX25DF1020C6BN.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX25DF1020C6BN é adequado para 6 aplicaçãos: SONET/SDH Framer and Mapper, PCI Express Endpoint Card, Serial RapidIO Bridge, Multi-Gigabit Backplane Aggregator, Test and Measurement Instrumentation, High-Speed Serial Protocol Converter.
SONET/SDH Framer and Mapper
The EP1SGX25DF1020C6BN's 20 embedded transceivers operating up to multi-gigabit rates match the OC-192/STM-64 9.95 Gbps payload requirement of SONET/SDH framer/mapper ASICs. Placed on a line card with external clock and jitter-cleaner, the device implements framing, scrambling, and overhead processing in programmable logic while the hardened PCS handles serial encoding. The 1,944 Kbit embedded RAM buffers payload data across clock-domain crossings, and the 607 user I/O connect to backplane SERDES and parallel data buses. Trade-off versus dedicated ASIC: higher unit cost but full programmability for protocol variants and forward-error-correction insertion.
Recomendado
PCI Express Endpoint Card
The EP1SGX25DF1020C6BN integrates a hardened PCI Express PCS/PMA that supports Gen1 (2.5 Gbps) endpoints and root ports, eliminating the need for an external PHY. The 25K logic elements implement the PCIe transaction layer, data-link layer, and user application logic with sufficient headroom for DMA engines or protocol-aware accelerators. Embedded M4K and M-RAM blocks buffer completion TLPs, and the 607 I/O connect to system memory and host bus. Designers targeting Gen2 (5 Gbps) or Gen3 (8 Gbps) should migrate to Stratix IV GT or Arria V GZ devices, as the SGX25 only meets Gen1 electrical compliance.
Recomendado
Serial RapidIO Bridge
Serial RapidIO (sRIO) interconnect in wireless base stations and DSP farms leverages the EP1SGX25DF1020C6BN's multiple embedded transceivers for 1.25/2.5/3.125 Gbps links between DSPs, FPGAs, and host processors. The 25K logic elements and DSP blocks implement protocol translation, message routing, and packet inspection. The 1.5 V core minimizes power consumption in dense line-card layouts, and the commercial temperature grade suits climate-controlled central-office deployments. Compared to discrete PHY plus glue logic, the integrated transceiver reduces BOM count and PCB area while improving signal-integrity margins on backplane channels.
Recomendado
Multi-Gigabit Backplane Aggregator
The 20 transceivers of the EP1SGX25DF1020C6BN aggregate multiple lower-rate serial streams onto higher-rate uplinks in central-office and data-center switches. The device implements channel-bonding logic, lane deskew, and statistical multiplexing in 25K logic elements with M-RAM blocks providing deep packet buffering. The 607 user I/O break out to switch fabric ASICs and timing-card interfaces. Estimated: total transceiver power consumption is approximately 250 mW per channel at 3.125 Gbps, requiring 6 to 8 layer PCB with continuous power and ground planes for thermal management.
Recomendado
Test and Measurement Instrumentation
In protocol analyzers, BERT testers, and bit-error-rate test sets, the EP1SGX25DF1020C6BN's pattern generation, error detection, and multi-rate transceiver capability enable a single FPGA platform to test multiple serial standards. The 25K logic elements implement PRBS generators, custom protocol decoders, and statistics counters. Embedded memory buffers long capture records, and the 607 I/O drive front-panel displays and trigger interfaces. The commercial temperature range is sufficient for laboratory environments; industrial temperature is unnecessary unless the instrument is deployed in outdoor or harsh industrial test bays.
Recomendado
High-Speed Serial Protocol Converter
The EP1SGX25DF1020C6BN bridges legacy parallel interfaces to high-speed serial links such as XAUI, Fibre Channel, and custom backplane protocols in storage and networking equipment. The transceivers handle the PMA/PCS, while the programmable logic implements protocol translation, CRC generation, and rate adaptation. The 1.5 V core and TriMatrix memory minimize power in fan-out bridge applications, and the 1020-ball FBGA package supports high-density board layouts. Compared to dedicated bridge ASICs, the FPGA provides field-upgradeable protocol support and reduces NRE cost for low-volume product variants.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX25DF1020C6BN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX25DF1020C6 | EP1SGX25DF1020C6B | EP1SGX25DF1020C7 | EP1SGX25DF1020C5N | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA (33x33 mm, 1 mm pitch) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Transceivers | 20 | 20 | 20 | 20 | 20 | 20 |
| Speed Grade | -6 | -6 | -6 | -7 (faster) | -5 (slower) | -4 (slowest) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Drop-in equivalence within the Stratix GX DF1020 family (vs EP1SGX25DF1020C6)
- Speed grade flexibility within the same package (vs EP1SGX25DF1020C7)
- Higher-density upgrade path within the same package (vs EP1SGX40DF1020C6)
Notas de projeto
The Stratix GX requires multiple supply rails: 1.5 V core, 3.3 V I/O, 1.2 V PLL analog, and 1.5 V/3.3 V transceiver supplies. Power-on sequencing must follow the Altera Stratix GX handbook sequence to avoid latch-up; VCCINT must reach threshold before VCCPD to prevent I/O buffer damage. Decoupling requires 100 nF X7R on every VCC pin within 3 mm and bulk polymer or tantalum capacitors per the pin connection guidelines. Estimated: total quiescent power at 25K LE utilization with 10 active transceivers at 3.125 Gbps is approximately 5 to 7 W; verify with the Quartus PowerPlay early estimator.
The 1020-ball FBGA at 1 mm pitch demands 6 to 8 layer PCB with microvia or via-in-pad stackups for breakout routing. Transceiver differential pairs require 100 ohm differential impedance with length matching to within 0.127 mm (5 mil) to meet multi-gigabit eye-mask specifications. Use the Altera board design guidelines and run signal-integrity simulation in HyperLynx or Ansys SIwave before layout commitment. The 33 mm x 33 mm package also requires a central thermal pad array for board-level thermal dissipation.
Common mistakes include omitting the configuration device (the Stratix GX is SRAM-based and loses configuration on power-cycle), mixing transceiver reference-clock polarity, neglecting JTAG chain order in multi-FPGA boards, and using a non-Altera EPC16/EPC64 in place of the recommended configuration memory. The configuration time for a fully utilized SGX25 is approximately 200 ms with an EPC16; do not rely on instant-on behavior. Ensure the nCONFIG, nSTATUS, and CONF_DONE pull-ups are sized correctly to avoid spurious resets.
Informações de conformidade
Lead-free finish per Altera product specification; explicit RoHS, REACH, halogen-free, and conflict-minerals declarations are not present in the verified distributor listings. The part is not AEC-Q100 qualified (commercial temperature grade only).
