EP1SGX25DF1020C6BN - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
Teilenummer: EP1SGX25DF1020C6BN ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $355 | $35.500,00 |
| 500 | $320 | $160.000,00 |
| 1.000 | $290 | $290.000,00 |
EP1SGX25DF1020C6BN Übersicht
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to configure digital logic blocks and interconnect routing after manufacture. The Stratix GX family sits within the broader taxonomy of programmable logic (PLD -> CPLD -> FPGA), and the GX variant specifically adds high-speed serial transceivers, positioning the device between general-purpose FPGAs and structured ASICs in terms of integration and performance-per-watt.
Key features of the EP1SGX25DF1020C6BN include 20 full-duplex embedded transceiver channels supporting multiple serial protocols, 607 user I/O pins, dedicated DSP blocks for high-throughput signal processing, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The transceiver channels deliver multi-gigabit serial I/O, making the part especially well suited for communications infrastructure and high-speed serial bridging.
Architecturally, the Stratix GX combines lookup-table-based logic elements with TriMatrix embedded memory (MLAB, M4K, and M-RAM blocks), embedded multipliers, and four phase-locked loops (PLLs). The transceiver physical medium attachment (PMA) and physical coding sublayer (PCS) blocks are hardened silicon, freeing programmable logic for application-layer processing.
Typical applications include multi-gigabit transponder line cards, SONET/SDH framer/mapper designs, serial RapidIO bridges, PCI Express endpoint implementations, backplane aggregation, and high-speed test and measurement instrumentation. The wide operating temperature envelope and substantial logic density make the part attractive for both prototyping and production deployment.
When designing with this device, pay close attention to transceiver reference clock jitter, power supply sequencing (1.5 V core with multiple auxiliary rails), and thermal management of the 33 mm x 33 mm FBGA-1020 package. Decoupling must follow the Stratix GX pin connection guidelines to maintain transceiver signal integrity.
This page synthesizes distributor pricing, drop-in Altera/Intel Stratix GX alternatives, and practical design considerations not consolidated on a single manufacturer page.
Drop-in-Alternativen für EP1SGX25DF1020C6BN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25DF1020C6BN (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, DSP Blocks, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25DF1020C6
✅ Drop-In✓ Auf Lager
$289 / Stück
Datenblatt ansehen →EP1SGX25DF1020C6B
✅ Drop-In✓ Auf Lager
$175 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$145 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5N
✅ Drop-In✓ Auf Lager
$650 / Stück
Datenblatt ansehen →EP1SGX25DF1020C4
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1180 / Stück
Datenblatt ansehen →EP1SGX25DF1020C6BN Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Total RAM Bits | 1,944,576 |
| User I/O | 607 |
| Number of Transceivers | 20 |
| Supply Voltage (Core) | 1.5 V |
| Betriebstemperatur | 0C to 85C (commercial) |
| Speed Grade | -6 |
| Package Type | 1020-BBGA (33 mm x 33 mm, 1 mm pitch) |
| Montageart | Surface Mount |
| Lead Free | Yes |
| Process Technology | CMOS |
| Configuration | SRAM-based, configuration device required |
EP1SGX25DF1020C6BN 1020-bbga (33 mm x 33 mm, 1 mm pitch) Pinbelegungsleitfaden
Pinbelegung für EP1SGX25DF1020C6BN (1020-bbga (33 mm x 33 mm, 1 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25DF1020C6BN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25DF1020C6BN ist geeignet für 6 Anwendungs: SONET/SDH Framer and Mapper, PCI Express Endpoint Card, Serial RapidIO Bridge, Multi-Gigabit Backplane Aggregator, Test and Measurement Instrumentation, High-Speed Serial Protocol Converter.
SONET/SDH Framer and Mapper
The EP1SGX25DF1020C6BN's 20 embedded transceivers operating up to multi-gigabit rates match the OC-192/STM-64 9.95 Gbps payload requirement of SONET/SDH framer/mapper ASICs. Placed on a line card with external clock and jitter-cleaner, the device implements framing, scrambling, and overhead processing in programmable logic while the hardened PCS handles serial encoding. The 1,944 Kbit embedded RAM buffers payload data across clock-domain crossings, and the 607 user I/O connect to backplane SERDES and parallel data buses. Trade-off versus dedicated ASIC: higher unit cost but full programmability for protocol variants and forward-error-correction insertion.
Empfohlen
PCI Express Endpoint Card
The EP1SGX25DF1020C6BN integrates a hardened PCI Express PCS/PMA that supports Gen1 (2.5 Gbps) endpoints and root ports, eliminating the need for an external PHY. The 25K logic elements implement the PCIe transaction layer, data-link layer, and user application logic with sufficient headroom for DMA engines or protocol-aware accelerators. Embedded M4K and M-RAM blocks buffer completion TLPs, and the 607 I/O connect to system memory and host bus. Designers targeting Gen2 (5 Gbps) or Gen3 (8 Gbps) should migrate to Stratix IV GT or Arria V GZ devices, as the SGX25 only meets Gen1 electrical compliance.
Empfohlen
Serial RapidIO Bridge
Serial RapidIO (sRIO) interconnect in wireless base stations and DSP farms leverages the EP1SGX25DF1020C6BN's multiple embedded transceivers for 1.25/2.5/3.125 Gbps links between DSPs, FPGAs, and host processors. The 25K logic elements and DSP blocks implement protocol translation, message routing, and packet inspection. The 1.5 V core minimizes power consumption in dense line-card layouts, and the commercial temperature grade suits climate-controlled central-office deployments. Compared to discrete PHY plus glue logic, the integrated transceiver reduces BOM count and PCB area while improving signal-integrity margins on backplane channels.
Empfohlen
Multi-Gigabit Backplane Aggregator
The 20 transceivers of the EP1SGX25DF1020C6BN aggregate multiple lower-rate serial streams onto higher-rate uplinks in central-office and data-center switches. The device implements channel-bonding logic, lane deskew, and statistical multiplexing in 25K logic elements with M-RAM blocks providing deep packet buffering. The 607 user I/O break out to switch fabric ASICs and timing-card interfaces. Estimated: total transceiver power consumption is approximately 250 mW per channel at 3.125 Gbps, requiring 6 to 8 layer PCB with continuous power and ground planes for thermal management.
Empfohlen
Test and Measurement Instrumentation
In protocol analyzers, BERT testers, and bit-error-rate test sets, the EP1SGX25DF1020C6BN's pattern generation, error detection, and multi-rate transceiver capability enable a single FPGA platform to test multiple serial standards. The 25K logic elements implement PRBS generators, custom protocol decoders, and statistics counters. Embedded memory buffers long capture records, and the 607 I/O drive front-panel displays and trigger interfaces. The commercial temperature range is sufficient for laboratory environments; industrial temperature is unnecessary unless the instrument is deployed in outdoor or harsh industrial test bays.
Empfohlen
High-Speed Serial Protocol Converter
The EP1SGX25DF1020C6BN bridges legacy parallel interfaces to high-speed serial links such as XAUI, Fibre Channel, and custom backplane protocols in storage and networking equipment. The transceivers handle the PMA/PCS, while the programmable logic implements protocol translation, CRC generation, and rate adaptation. The 1.5 V core and TriMatrix memory minimize power in fan-out bridge applications, and the 1020-ball FBGA package supports high-density board layouts. Compared to dedicated bridge ASICs, the FPGA provides field-upgradeable protocol support and reduces NRE cost for low-volume product variants.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25DF1020C6BN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25DF1020C6 | EP1SGX25DF1020C6B | EP1SGX25DF1020C7 | EP1SGX25DF1020C5N | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA (33x33 mm, 1 mm pitch) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Transceivers | 20 | 20 | 20 | 20 | 20 | 20 |
| Speed Grade | -6 | -6 | -6 | -7 (faster) | -5 (slower) | -4 (slowest) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Drop-in equivalence within the Stratix GX DF1020 family (vs. EP1SGX25DF1020C6)
- Speed grade flexibility within the same package (vs. EP1SGX25DF1020C7)
- Higher-density upgrade path within the same package (vs. EP1SGX40DF1020C6)
Designhinweise
The Stratix GX requires multiple supply rails: 1.5 V core, 3.3 V I/O, 1.2 V PLL analog, and 1.5 V/3.3 V transceiver supplies. Power-on sequencing must follow the Altera Stratix GX handbook sequence to avoid latch-up; VCCINT must reach threshold before VCCPD to prevent I/O buffer damage. Decoupling requires 100 nF X7R on every VCC pin within 3 mm and bulk polymer or tantalum capacitors per the pin connection guidelines. Estimated: total quiescent power at 25K LE utilization with 10 active transceivers at 3.125 Gbps is approximately 5 to 7 W; verify with the Quartus PowerPlay early estimator.
The 1020-ball FBGA at 1 mm pitch demands 6 to 8 layer PCB with microvia or via-in-pad stackups for breakout routing. Transceiver differential pairs require 100 ohm differential impedance with length matching to within 0.127 mm (5 mil) to meet multi-gigabit eye-mask specifications. Use the Altera board design guidelines and run signal-integrity simulation in HyperLynx or Ansys SIwave before layout commitment. The 33 mm x 33 mm package also requires a central thermal pad array for board-level thermal dissipation.
Common mistakes include omitting the configuration device (the Stratix GX is SRAM-based and loses configuration on power-cycle), mixing transceiver reference-clock polarity, neglecting JTAG chain order in multi-FPGA boards, and using a non-Altera EPC16/EPC64 in place of the recommended configuration memory. The configuration time for a fully utilized SGX25 is approximately 200 ms with an EPC16; do not rely on instant-on behavior. Ensure the nCONFIG, nSTATUS, and CONF_DONE pull-ups are sized correctly to avoid spurious resets.
Compliance-Informationen
Lead-free finish per Altera product specification; explicit RoHS, REACH, halogen-free, and conflict-minerals declarations are not present in the verified distributor listings. The part is not AEC-Q100 qualified (commercial temperature grade only).
