EP1SGX25DF1020C6L - 25K LE Stratix GX FPGA, 1020-BGA | Intel
N.º da peça: EP1SGX25DF1020C6L ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1745 | $17.450,00 |
| 100 | $1640 | $164.000,00 |
| 250 | $1550 | $387.500,00 |
| 500 | $1485 | $742.500,00 |
EP1SGX25DF1020C6L Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LABs/CLBs), routing fabric, and dedicated hard IP that the designer can interconnect after manufacture to realize arbitrary digital functions. FPGAs sit between fixed-function ASICs and software-defined processors in the compute hierarchy, and the Stratix GX family specifically targets high-speed serial I/O, embedded processing, and parallel DSP. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Synonyms include "field programmable gate array", "programmable logic device (PLD)", and "logic array".
Key features of the EP1SGX25DF1020C6L include 2,566 LABs/CLBs for fine-grained logic distribution, embedded multiplier blocks and DSP support, dedicated PLL clock-management blocks, 1.5 V core supply with separate VCCIO banks, and full JTAG boundary-scan / IEEE 1149.1 support. The "6" speed grade (-6) places this part in the mid-band of Stratix GX speed grades, balancing Fmax against power consumption. The "L" suffix indicates a lead-free, RoHS-compliant package finish.
Architecturally, the Stratix GX device combines a TriMatrix memory hierarchy (MRAM blocks of varied widths), a MultiTrack interconnect, and 20 SERDES channels with embedded 8B/10B encoding, byte serializer/deserializer, and pattern-detection logic. The 130 nm process node places this part in the legacy/established FPGA category; long-term production planning should be confirmed with Intel FPGA's product longevity program before committing to new designs.
Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO, PCI Express endpoint 1.0/2.0), telecom line cards, high-speed protocol bridging, DSP co-processing in software-defined radio (SDR), and custom network processor front-ends. The 1020-ball BGA also makes it suitable for high-density compute accelerator boards where ample logic and memory bandwidth are required.
When designing with this part, allocate generous PCB real-estate for the 33 x 33 mm BGA; the 1.0 mm ball pitch requires HDI PCB fabrication with microvias and tight DRC rules. Provide clean, low-noise power rails (1.5 V core plus dedicated VCCIO banks) and follow Intel's Stratix GX hardware-design guidelines for high-speed serial channel signal integrity.
This page synthesizes distributor pricing, drop-in same-package variants, and design considerations not found on the standalone manufacturer datasheet.
Alternativas drop-in para EP1SGX25DF1020C6L — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX25DF1020C6L (mesmo formato e footprint) — diferindo em Operating Temperature, Speed Grade, Package Type, Package, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX25DF1020C6ESL
✅ Drop-In✓ Em estoque
$1095 / unidade
Ver ficha técnica →EP1SGX25DF1020C6ES
✅ Drop-In✓ Em estoque
$285 / unidade
Ver ficha técnica →EP1SGX25DF1020C6BN
✅ Drop-In✓ Em estoque
$290 / unidade
Ver ficha técnica →EP1SGX25DF1020C6B
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP1SGX25DF1020C6
✅ Drop-In✓ Em estoque
$289 / unidade
Ver ficha técnica →EP1SGX25DF1020C5N
✅ Drop-In✓ Em estoque
$650 / unidade
Ver ficha técnica →EP1SGX25DF1020C5ES
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1SGX25DF1020C6L Classificações máximas e características elétricas
| Family | Stratix GX |
| Logic Elements | 25,660 |
| LABs / CLBs | 2,566 |
| User I/O Pins | 607 |
| Embedded RAM | 1,944,576 bits |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | 130 nm CMOS |
| Number of Transceivers | Up to 20 channels |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps |
| Encapsulamento | 1020-ball FC-FBGA, 33 x 33 mm, 1.0 mm pitch |
| Tipo de montagem | Surface Mount |
| Operating Temperature (Junction) | 0 C to 85 C |
| Speed Grade | -6 (mid-band) |
| Lead-Free / RoHS | Yes (L suffix = lead-free) |
| Logic Family | CMOS |
Guia de Configuração de Pinos do EP1SGX25DF1020C6L 1020-ball fc-fbga, 33 x 33 mm, 1.0 mm pitch
Configuração de pinos para EP1SGX25DF1020C6L (pacote 1020-ball fc-fbga, 33 x 33 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX25DF1020C6L.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX25DF1020C6L é adequado para 6 aplicaçãos: Gigabit Ethernet Backplane / XAUI Switch, Software-Defined Radio (SDR) Baseband Processing, PCI Express Endpoint / Add-In Card, Telecom Line Card Aggregation, High-Speed Protocol Bridging / Serial RapidIO, Custom Network Processor Front-End.
Gigabit Ethernet Backplane / XAUI Switch
The EP1SGX25DF1020C6L's 20 transceivers at up to 3.1875 Gbps make it ideal for 4-lane XAUI (3.125 Gbps per lane) and multi-port gigabit Ethernet backplane switching. With 25,660 logic elements the device implements MAC framing, PCS, and link-partner state machines. The 1,944,576 bits of embedded RAM buffer packets efficiently, while 607 user I/O pins carry GMII/RGMII sideband signals to PHY and switch ASICs.
Recomendado
Software-Defined Radio (SDR) Baseband Processing
Stratix GX DSP blocks and 20 multi-gigabit transceivers suit the EP1SGX25DF1020C6L for SDR baseband processors that digitize wideband IF signals. At 25,660 logic elements it runs FFT/iFFT, channelization, and modulation/demodulation in firmware, while transceivers interface to ADC/DAC JESD204B-style links or LVDS data buses. The 1.5 V core and 130 nm process keep the device within practical SDR chassis thermal envelopes.
Recomendado
PCI Express Endpoint / Add-In Card
The EP1SGX25DF1020C6L implements PCI Express x4 endpoints using its 3.1875 Gbps transceivers (PCIe 1.0/2.0 line rate). With 25,660 logic elements the device realizes the PCIe transaction layer, data link layer, and application logic on a single die, eliminating external bridge chips. The 1020-ball BGA provides 607 user I/O for local bus expansion, memory interfaces, and DMA control.
Recomendado
Telecom Line Card Aggregation
The EP1SGX25DF1020C6L aggregates multiple telecom framer/PHY links in central-office line cards, providing traffic management, QoS scheduling, and protocol conversion. 20 transceivers terminate 4-5 SFP/SFP+ optical modules simultaneously, while 25,660 logic elements implement forwarding tables and congestion-control algorithms. The 1,944,576 bits of RAM hold route lookups and packet descriptors.
Recomendado
High-Speed Protocol Bridging / Serial RapidIO
Multi-protocol bridging between Serial RapidIO, Aurora, custom LVDS, and gigabit serial is a classic Stratix GX use case for the EP1SGX25DF1020C6L. With 20 transceivers supporting 500 Mbps-3.1875 Gbps and 25,660 logic elements, the device translates packets between standards, encapsulates payloads, and recovers clock domains. The 1020-ball BGA supports ample I/O for parallel local-bus interfaces to companion ASICs.
Recomendado
Custom Network Processor Front-End
The EP1SGX25DF1020C6L serves as a programmable front-end for network processors, parsing packet headers, classifying flows, and pre-allocating buffer descriptors before they reach the NPU. At 25,660 logic elements the device handles multi-gigabit line-rate parsing, while 20 transceivers provide flexible 1G/2.5G link aggregation. Embedded RAM (1,944,576 bits) caches flow tables and TCAM lookups in real time.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX25DF1020C6L — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX25DF1020C6ESL | EP1SGX25DF1020C6ES | EP1SGX25DF1020C6BN | EP1SGX25DF1020C6B | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5ES |
|---|---|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | -6 (mid) | -6 | -6 | -6 | -6 | -6 | -5 (faster) | -5 (faster) |
| User I/O Pins | 607 | 607 | 607 | 607 | 607 | 607 | 607 | 607 |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| Lead-Free (RoHS) | Yes (L suffix) | Yes | Yes | Yes | Yes | No (leaded) | Yes | Yes |
| Transceiver Count | Up to 20 channels | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Approx. Unit Price (qty 1, as of 2026-09-07) | $1,850 USD | Similar / varies by listing | Similar / varies by listing | Similar / varies by listing | Similar / varies by listing | Similar / varies by listing | Higher (faster grade) | Higher (faster grade) |
Principais diferenciais
- Same-package alternative with engineering-sample/alternate finish (vs EP1SGX25DF1020C6ES)
- Drop-in upgrade to faster speed grade (-5 vs -6) (vs EP1SGX25DF1020C5N)
- Bitstream-identical alternative for inventory continuity (vs EP1SGX25DF1020C6ESL)
- Lead-free finish vs. leaded (non-RoHS) variant (vs EP1SGX25DF1020C6)
Notas de projeto
Estimated: the 1020-ball BGA uses a 1.0 mm ball pitch on a 33 x 33 mm body. Routing this package requires HDI PCB fabrication with microvias-in-pad, 4-6 routing layers minimum, and laser-drilled vias. Plan at least 8 PCB layers for break-out: power planes, ground planes, signal layers, and dedicated high-speed serial layers. Allocate at least 6 square inches of continuous copper under the BGA thermal land for heat spreading. The Stratix GX datasheet hardware-design guidelines specify power-rail decoupling within 100 mils of every VCC pin.
The Stratix GX device requires multiple supply domains: 1.5 V core (VCCINT), VCCIO bank voltages (1.5 V/1.8 V/2.5 V/3.3 V selectable per bank), PLL analog supplies (VCCA_PLL, VCCD_PLL), and high-speed serial transceiver supplies (VCCA_TX, VCCA_RX at typically 2.5 V or 3.3 V). Use a multi-rail power-supply solution such as a multi-output PMIC or discrete LDO + switching converters, with each rail independently filtered. Per the Stratix GX power-design guide, decouple each rail with bulk + ceramic + ferrite combinations to manage switching transients when transceivers enable.
The 20 multi-gigabit transceivers at 3.1875 Gbps require controlled-impedance differential routing (typically 100 ohm differential, with AC-coupling capacitors on TX outputs). Estimated: route serial pairs with intra-pair skew below 1 ps per inch, and keep serial pairs at least 5x the dielectric thickness away from other signals. The Stratix GX hardware-design guidelines recommend reference-plane continuity under every serial pair, with ground stitching vias every 200 mils along the trace. Compliance with XAUI, PCIe, and Serial RapidIO specifications requires careful channel-loss budgeting, with insertion loss below 6 dB at the Nyquist frequency.
Estimated: a fully populated EP1SGX25DF1020C6L with 20 active transceivers at 3.1875 Gbps and 70-80% logic toggle rate dissipates approximately 8-12 W. Combined with the 1020-ball BGA's thermal resistance of approximately 0.4 C/W junction-to-case, the case-to-ambient thermal path becomes critical. A heat spreader or low-profile heatsink bonded to the BGA thermal land is recommended; without it, junction temperature can exceed 100 C in still air. The Stratix GX thermal-management document specifies airflow of 200 LFM minimum for high-utilization designs.
Common design pitfalls with the EP1SGX25DF1020C6L include: (1) failing to provide all VCCINT/VCCIO/VCCA decoupling capacitors within the manufacturer's placement guidelines, leading to power-rail ringing; (2) incorrectly biasing unused transceiver channels - leave TX pairs AC-terminated and RX inputs pulled to common-mode voltage per the pin-connection guidelines; (3) assuming the EP1SGX25DF1020C6L and EP1SGX25DF1020C6 are identical - they share the same die but the L suffix denotes lead-free finish (and possibly different solder-bump alloy), and leaded parts may not be acceptable for RoHS markets. Always generate fresh configuration bitstreams when migrating between speed grades (-5 vs -6 vs -7) since timing models differ.
Informações de conformidade
RoHS compliant per the "L" suffix in the part number. Lead-free (Pb-free) finish confirmed. Halogen-free status not explicitly stated in available data; set to unknown. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC.
