EP1SGX25DF1020C6BN - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
MPN: EP1SGX25DF1020C6BN ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $355 | $35,500.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $290 | $290,000.00 |
Drop-in alternatives for EP1SGX25DF1020C6BN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF1020C6BN Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Total RAM Bits | 1,944,576 |
| User I/O | 607 |
| Number of Transceivers | 20 |
| Supply Voltage (Core) | 1.5 V |
| Operating Temperature | 0C to 85C (commercial) |
| Speed Grade | -6 |
| Package Type | 1020-BBGA (33 mm x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Lead Free | Yes |
| Process Technology | CMOS |
| Configuration | SRAM-based, configuration device required |
EP1SGX25DF1020C6BN 1020-bbga (33 mm x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C6BN (1020-bbga (33 mm x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C6BN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C6BN is suitable for 6 applications: SONET/SDH Framer and Mapper, PCI Express Endpoint Card, Serial RapidIO Bridge, Multi-Gigabit Backplane Aggregator, Test and Measurement Instrumentation, High-Speed Serial Protocol Converter.
SONET/SDH Framer and Mapper
The EP1SGX25DF1020C6BN's 20 embedded transceivers operating up to multi-gigabit rates match the OC-192/STM-64 9.95 Gbps payload requirement of SONET/SDH framer/mapper ASICs. Placed on a line card with external clock and jitter-cleaner, the device implements framing, scrambling, and overhead processing in programmable logic while the hardened PCS handles serial encoding. The 1,944 Kbit embedded RAM buffers payload data across clock-domain crossings, and the 607 user I/O connect to backplane SERDES and parallel data buses. Trade-off versus dedicated ASIC: higher unit cost but full programmability for protocol variants and forward-error-correction insertion.
Recommended
PCI Express Endpoint Card
The EP1SGX25DF1020C6BN integrates a hardened PCI Express PCS/PMA that supports Gen1 (2.5 Gbps) endpoints and root ports, eliminating the need for an external PHY. The 25K logic elements implement the PCIe transaction layer, data-link layer, and user application logic with sufficient headroom for DMA engines or protocol-aware accelerators. Embedded M4K and M-RAM blocks buffer completion TLPs, and the 607 I/O connect to system memory and host bus. Designers targeting Gen2 (5 Gbps) or Gen3 (8 Gbps) should migrate to Stratix IV GT or Arria V GZ devices, as the SGX25 only meets Gen1 electrical compliance.
Recommended
Serial RapidIO Bridge
Serial RapidIO (sRIO) interconnect in wireless base stations and DSP farms leverages the EP1SGX25DF1020C6BN's multiple embedded transceivers for 1.25/2.5/3.125 Gbps links between DSPs, FPGAs, and host processors. The 25K logic elements and DSP blocks implement protocol translation, message routing, and packet inspection. The 1.5 V core minimizes power consumption in dense line-card layouts, and the commercial temperature grade suits climate-controlled central-office deployments. Compared to discrete PHY plus glue logic, the integrated transceiver reduces BOM count and PCB area while improving signal-integrity margins on backplane channels.
Recommended
Multi-Gigabit Backplane Aggregator
The 20 transceivers of the EP1SGX25DF1020C6BN aggregate multiple lower-rate serial streams onto higher-rate uplinks in central-office and data-center switches. The device implements channel-bonding logic, lane deskew, and statistical multiplexing in 25K logic elements with M-RAM blocks providing deep packet buffering. The 607 user I/O break out to switch fabric ASICs and timing-card interfaces. Estimated: total transceiver power consumption is approximately 250 mW per channel at 3.125 Gbps, requiring 6 to 8 layer PCB with continuous power and ground planes for thermal management.
Recommended
Test and Measurement Instrumentation
In protocol analyzers, BERT testers, and bit-error-rate test sets, the EP1SGX25DF1020C6BN's pattern generation, error detection, and multi-rate transceiver capability enable a single FPGA platform to test multiple serial standards. The 25K logic elements implement PRBS generators, custom protocol decoders, and statistics counters. Embedded memory buffers long capture records, and the 607 I/O drive front-panel displays and trigger interfaces. The commercial temperature range is sufficient for laboratory environments; industrial temperature is unnecessary unless the instrument is deployed in outdoor or harsh industrial test bays.
Recommended
High-Speed Serial Protocol Converter
The EP1SGX25DF1020C6BN bridges legacy parallel interfaces to high-speed serial links such as XAUI, Fibre Channel, and custom backplane protocols in storage and networking equipment. The transceivers handle the PMA/PCS, while the programmable logic implements protocol translation, CRC generation, and rate adaptation. The 1.5 V core and TriMatrix memory minimize power in fan-out bridge applications, and the 1020-ball FBGA package supports high-density board layouts. Compared to dedicated bridge ASICs, the FPGA provides field-upgradeable protocol support and reduces NRE cost for low-volume product variants.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C6BN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C6 | EP1SGX25DF1020C6B | EP1SGX25DF1020C7 | EP1SGX25DF1020C5N | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA (33x33 mm, 1 mm pitch) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Transceivers | 20 | 20 | 20 | 20 | 20 | 20 |
| Speed Grade | -6 | -6 | -6 | -7 (faster) | -5 (slower) | -4 (slowest) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in equivalence within the Stratix GX DF1020 family (vs EP1SGX25DF1020C6)
- Speed grade flexibility within the same package (vs EP1SGX25DF1020C7)
- Higher-density upgrade path within the same package (vs EP1SGX40DF1020C6)
Design Notes
The Stratix GX requires multiple supply rails: 1.5 V core, 3.3 V I/O, 1.2 V PLL analog, and 1.5 V/3.3 V transceiver supplies. Power-on sequencing must follow the Altera Stratix GX handbook sequence to avoid latch-up; VCCINT must reach threshold before VCCPD to prevent I/O buffer damage. Decoupling requires 100 nF X7R on every VCC pin within 3 mm and bulk polymer or tantalum capacitors per the pin connection guidelines. Estimated: total quiescent power at 25K LE utilization with 10 active transceivers at 3.125 Gbps is approximately 5 to 7 W; verify with the Quartus PowerPlay early estimator.
The 1020-ball FBGA at 1 mm pitch demands 6 to 8 layer PCB with microvia or via-in-pad stackups for breakout routing. Transceiver differential pairs require 100 ohm differential impedance with length matching to within 0.127 mm (5 mil) to meet multi-gigabit eye-mask specifications. Use the Altera board design guidelines and run signal-integrity simulation in HyperLynx or Ansys SIwave before layout commitment. The 33 mm x 33 mm package also requires a central thermal pad array for board-level thermal dissipation.
Common mistakes include omitting the configuration device (the Stratix GX is SRAM-based and loses configuration on power-cycle), mixing transceiver reference-clock polarity, neglecting JTAG chain order in multi-FPGA boards, and using a non-Altera EPC16/EPC64 in place of the recommended configuration memory. The configuration time for a fully utilized SGX25 is approximately 200 ms with an EPC16; do not rely on instant-on behavior. Ensure the nCONFIG, nSTATUS, and CONF_DONE pull-ups are sized correctly to avoid spurious resets.
Compliance Information
Lead-free finish per Altera product specification; explicit RoHS, REACH, halogen-free, and conflict-minerals declarations are not present in the verified distributor listings. The part is not AEC-Q100 qualified (commercial temperature grade only).
