EP1SGX25DF1020C6B - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
N.º da peça: EP1SGX25DF1020C6B ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $255 | $2.550,00 |
| 100 | $220 | $22.000,00 |
| 250 | $195 | $48.750,00 |
| 500 | $175 | $87.500,00 |
EP1SGX25DF1020C6B Visão geral
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all of which can be redefined after manufacturing through a hardware description language (HDL) bitstream. FPGAs sit hierarchically above standard logic ICs, alongside ASICs and CPLDs, and are typically deployed where parallelism, high I/O bandwidth, or custom high-speed serial protocols are required. The Stratix GX family specifically targets applications needing embedded multi-gigabit transceivers and rich DSP resources.
Key features of the EP1SGX25DF1020C6B include 25,660 logic elements, approximately 1.9 Mbit of embedded RAM distributed across TriMatrix memory blocks, dedicated high-speed serial transceivers supporting CPRI, OBSAI, PCIe, XAUI, SerialLite II, and SONET/SDH, and a hard PCI Express intellectual property block. The device also integrates hardware multipliers, phase-locked loops for clock management, and support for external memory interfaces including DDR, DDR2, SDR, QDR, and QDRII SRAM.
Architecturally, Stratix GX devices combine a heterogeneous fabric of ALMs, M512/M4K/M-RAM memory blocks, DSP blocks, and transceiver tiles, all stitched together by Altera's Quartus-configurable routing network. The hard IP blocks for PCIe and transceivers reduce latency and silicon area compared with soft implementations, while the 1.5 V core supply keeps dynamic power manageable in dense designs.
Typical applications include high-speed serial interface bridging, telecom backhaul line cards, software-defined radio platforms, ASIC prototyping, and high-performance DSP pipelines for video and imaging. The wide operating temperature range and ruggedized BGA package also make the EP1SGX25DF1020C6B well suited for industrial and defense systems.
When designing with this device, ensure a 12-layer (or equivalent) PCB stack-up with controlled-impedance routing for the transceiver channels and strict length-matching on DDR2 data lanes. Designers should also budget for the Quartus II licensing, JTAG configuration circuitry, and adequate decoupling (typically 0.1 µF + bulk capacitors per power rail) to meet signal-integrity targets.
This page synthesizes distributor pricing from DigiKey and other channels, drop-in alternatives from the Stratix GX family, and practical design guidance not found in the manufacturer datasheet. Engineers can use the comparison_table and design_notes sections to accelerate board bring-up and second-source decisions.
Alternativas drop-in para EP1SGX25DF1020C6B — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX25DF1020C6B (mesmo formato e footprint) — diferindo em Operating Temperature, Speed Grade, Package, Package Type, DSP Blocks.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX25DF1020C6
✅ Drop-In✓ Em estoque
$289 / unidade
Ver ficha técnica →EP1SGX25DF1020C5N
✅ Drop-In✓ Em estoque
$650 / unidade
Ver ficha técnica →EP1SGX25DF1020C5ES
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1SGX25DF1020C5
✅ Drop-In✓ Em estoque
$1720 / unidade
Ver ficha técnica →EP1SGX25DF1020C4
✅ Drop-In✓ Em estoque
$1180 / unidade
Ver ficha técnica →EP1SGX25DF1020C6B Classificações máximas e características elétricas
| Series | Stratix GX |
| Family | EP1SGX25 |
| Logic Elements | 25,660 |
| Total Memory Bits | 1,944,576 |
| User I/O Count | 607 |
| Encapsulamento | 1020-BBGA (33 × 33 mm, 1.0 mm pitch) |
| Supply Voltage (Core) | 1.5 V |
| Temperatura de operação | 0 °C to 85 °C (Commercial) |
| Speed Grade | C6 |
| Tipo de montagem | Surface Mount (BGA) |
| Lead-Free | Yes (per DigiChip package note) |
| Transceivers | Embedded high-speed serial transceivers (multi-gigabit) |
| PLLs | On-chip phase-locked loops for clock management |
| DSP Blocks | Hardware multipliers / DSP blocks |
| External Memory Support | DDR, DDR2, SDR, QDR, QDRII SRAM |
| Hard IP | PCI Express (per Stratix GX family) |
Guia de Configuração de Pinos do EP1SGX25DF1020C6B 1020-bbga (33 × 33 mm, 1.0 mm pitch)
Configuração de pinos para EP1SGX25DF1020C6B (pacote 1020-bbga (33 × 33 mm, 1.0 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX25DF1020C6B.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX25DF1020C6B é adequado para 6 aplicaçãos: Telecom Backhaul / Line Card Aggregation, Software Defined Radio (SDR) Baseband, High-Performance DSP / Video Imaging Pipeline, ASIC Prototyping and Emulation, Industrial / Defense Ruggedized Systems, PCIe Endpoint / Root Complex Add-In Cards.
Telecom Backhaul / Line Card Aggregation
The EP1SGX25DF1020C6B is well suited for telecom backhaul line cards where multi-gigabit serial aggregation is required. Its embedded transceivers support CPRI, OBSAI, and SONET/SDH protocols at line rates up to 3.1875 Gbps per channel, eliminating external PHY chips. With 25,660 logic elements and 1.9 Mbit of embedded RAM, the fabric can absorb packet header processing, queue management, and timing-and-sync functions alongside the physical layer. Designers typically map one or two transceiver channels to backplane SFP+ cages and dedicate the remaining channels to inter-card links, while DDR2 controller IP provides deep buffering for traffic bursts.
Recomendado
Software Defined Radio (SDR) Baseband
Stratix GX devices such as the EP1SGX25DF1020C6B are commonly used as the digital baseband processor in software-defined radio platforms. The hardware multipliers and DSP blocks accelerate FFT, channelization, and modulation/demodulation tasks, while the multi-gigabit transceivers stream digitized IF or RF data from analog front-end ADCs. With 25,660 logic elements and roughly 1.9 Mbit of on-chip RAM, designers can host multiple concurrent channels (Wi-Fi, LTE, custom waveforms) without external memory pressure. The 1020-BBGA package allows dense parallel ADC/DAC interfaces to be broken out directly to FPGA pins, minimizing analog trace lengths.
Recomendado
High-Performance DSP / Video Imaging Pipeline
The EP1SGX25DF1020C6B is widely deployed in real-time video processing, medical imaging, and machine-vision systems that demand high pixel throughput. Its DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput for FIR filters, convolution kernels, and DCT/IDCT transforms, while the 1.9 Mbit embedded RAM serves as line buffers for streaming pixel data. With 607 user I/Os, designers can connect multiple camera interfaces (LVDS, sub-LVDS, SLVS) directly to the FPGA without external muxing. The PCIe hard IP block enables the board to plug into host processors as a co-processing accelerator.
Recomendado
ASIC Prototyping and Emulation
The EP1SGX25DF1020C6B is an effective vehicle for prototyping mid-complexity ASICs before mask commitment. Its Stratix GX architecture is HDL-compatible with popular ASIC synthesis flows, and 25,660 logic elements provide roughly 2.5-3 million gates of mapped ASIC complexity when accounting for the area penalty of FPGA LUTs versus standard cells. The 607 user I/Os map to dozens of package pins for break-out prototyping headers, while the embedded transceivers model SerDes interfaces in the target ASIC. Designers can use Quartus II's ASIC prototyping flow to partition large ASIC designs across multiple EP1SGX25 devices on a multi-FPGA board.
Recomendado
Industrial / Defense Ruggedized Systems
Industrial and defense applications value the EP1SGX25DF1020C6B's commercial temperature range, BGA ruggedization, and embedded PCIe for ruggedized SBC backplane interconnects. While the part itself is commercial grade (0 °C to 85 °C), the 1020-BBGA package provides strong solder joint reliability under shock and vibration, and the Stratix GX family is widely used in defense electronics. Designers can pair the device with industrial-grade companion FPGAs from the same family (e.g., EP1SGX25DF1020I6N for -40 °C to 100 °C) when temperature margin is required, while keeping the same board layout and bitstream flow.
Recomendado
PCIe Endpoint / Root Complex Add-In Cards
The EP1SGX25DF1020C6B integrates a hard PCI Express IP block, allowing designers to implement Gen1/Gen2 endpoints without consuming fabric logic. With 25,660 logic elements and 607 user I/Os, the device can host a complete PCIe add-in card including DMA engines, scatter-gather controllers, and application-layer payload interfaces to DSP blocks or memory. The 1020-BBGA package exposes enough I/Os for parallel memory buses and external PHY interfaces alongside the PCIe lanes. Designers targeting higher line rates than Gen2 should migrate to Stratix IV GX or Arria V GX families, which support Gen3.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX25DF1020C6B — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5ES | EP1SGX25DF1020C5 | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-BBGA | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C6 | C6 | C5 | C5 | C5 | C4 |
| Temperature Grade | Commercial (0 °C to 85 °C) | Commercial | Commercial | Commercial (extended screening) | Commercial | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principais diferenciais
- Highest I/O-count 1020-BBGA option in the EP1SGX25 family (vs EP1SGX25DF1020C5N)
- Pin-compatible with entire EP1SGX25 1020-BBGA family (vs EP1SGX25CF672I6N)
- Hard PCI Express IP block integrated (vs Non-Altera FPGAs of similar vintage)
Notas de projeto
Estimated: a 12-layer stack-up with matched 50 Ω differential traces is recommended for the EP1SGX25DF1020C6B's multi-gigabit transceiver channels. Use 0.1 µF X7R ceramic bypass capacitors within 5 mm of every power pin, plus 10 µF bulk capacitors per supply rail. The 1020-BBGA's 1.0 mm ball pitch requires laser-drilled micro-vias or sequential lamination; ensure your PCB fab house supports the EP1SGX25 BGA escape routing pattern before commit. Source guidance: Altera Stratix GX Hardware Reference Manual.
Estimated: transceiver channel performance depends critically on maintaining differential trace impedance of 100 Ω ±10% and intra-pair skew below 1 ps per cm. Use length-matched serpentine routing on all PCIe, XAUI, or SerialLite II links. For DDR2 interfaces, place series-termination resistors at the FPGA driver end and tune ODT settings in the Quartus II pin planner. Source guidance: Altera Stratix GX Transceiver User Guide.
Estimated: at full fabric utilization (25,660 LE toggle rate ~12.5%) and active transceivers, the EP1SGX25DF1020C6B can dissipate between 5 W and 8 W depending on toggle and clock rates. The 1020-BBGA package has a θJA of roughly 10 °C/W with 25 mm² of internal copper, so a heat sink or forced-air cooling is recommended for sealed enclosures. Designers should thermal-couple the BGA lid to a chassis plate via thermal pads for improved dissipation. Source guidance: Stratix GX Packaging and Thermal datasheet.
Common pitfalls include failing to enable CRC checking on incoming transceiver data, neglecting to power-cycle VCCPD before VCCINT during hot-plug, and routing transceiver reference clocks across noisy power planes. Designers should also avoid using LVDS inputs on pins adjacent to high-speed transceivers without proper isolation, and must configure MSEL pins correctly for the desired POR (power-on reset) configuration scheme. Source guidance: Altera Stratix GX Configuration Handbook.
Informações de conformidade
Lead-free per DigiChip package description (FBGA-1020 LEAD FREE). RoHS, REACH, halogen-free, and conflict-mineral status not explicitly stated in distributor excerpts — marked unknown.
