EP1SGX25DF1020C7ES - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
N.º da peça: EP1SGX25DF1020C7ES ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2620 | $26.200,00 |
| 100 | $2350 | $235.000,00 |
| 500 | $2120 | $1.060.000,00 |
| 1.000 | $1950 | $1.950.000,00 |
EP1SGX25DF1020C7ES Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. Stratix GX extends the Stratix architecture with embedded multi-gigabit transceivers, making the family a programmable alternative to ASICs for high-speed serial I/O and DSP pipelines.
Key features of the EP1SGX25DF1020C7ES include 2,566 Configurable Logic Blocks (CLBs), 607 user I/Os, embedded 3.125 Gbps transceiver channels, and on-chip memory with TriMatrix structure. Per the manufacturer datasheet, the device integrates dedicated serializer/deserializer (SERDES) blocks for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, eliminating external PHY ICs in many designs.
The architecture combines look-up-table (LUT)-based logic, distributed and block RAM, embedded multipliers, and high-speed LVDS I/O. The 1020-ball FC-FBGA package exposes the full transceiver and I/O count of the die, supporting high pin-density PCB layouts with controlled-impedance routing for the multi-gigabit serial links.
Typical applications include high-speed serial interface bridging, telecom line-card aggregation, military radar signal chains, and ASIC prototyping. The combination of embedded transceivers and abundant logic makes it a drop-in solution for designers migrating from discrete SERDES plus glue logic to a single programmable device.
When designing with the EP1SGX25DF1020C7ES, allocate sufficient PCB layers (typically 10+ layers) and follow the IBIS-AMI models for the transceiver channels to maintain signal integrity at multi-gigabit data rates. Decoupling must use a combination of bulk, mid-frequency, and high-frequency ceramic capacitors placed directly under the BGA via the recommended land pattern.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not aggregated on the manufacturer datasheet, giving procurement and design engineers a single reference for evaluation.
Alternativas drop-in para EP1SGX25DF1020C7ES — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX25DF1020C7ES (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Package Type, Speed Grade, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX25DF1020C7
✅ Drop-In✓ Em estoque
$145 / unidade
Ver ficha técnica →EP1SGX25DF1020C7N
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1SGX25DF1020C6ES
✅ Drop-In✓ Em estoque
$285 / unidade
Ver ficha técnica →EP1SGX25DF1020C6N
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1SGX25DF1020C5N
✅ Drop-In✓ Em estoque
$650 / unidade
Ver ficha técnica →EP1SGX25DF1020C7ES Classificações máximas e características elétricas
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix GX |
| Device Family | Stratix GX FPGA |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| User I/Os | 607 |
| Total Terminals | 1020 |
| Package Type | FBGA-1020 (Flip-Chip Fine-pitch BGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Logic Family | CMOS |
| Maximum Internal Frequency | 4.385 GHz (4385.97 MHz) |
| Combinatorial Delay (max) | 9.48 ns |
| Temperatura de operação | 0 C to 85 C (commercial) |
| Lead-Free / RoHS | Lead-Free |
| Embedded Transceivers | Yes (3.125 Gbps SERDES) |
| Tipo de montagem | Surface Mount (BGA) |
| Datasheet Page Count (per alldatasheet) | 272 |
Guia de Configuração de Pinos do EP1SGX25DF1020C7ES 33 x 33 mm
Configuração de pinos para EP1SGX25DF1020C7ES (pacote 33 x 33 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX25DF1020C7ES.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX25DF1020C7ES é adequado para 6 aplicaçãos: Telecom Line-Card Aggregation, High-Speed Serial Interface Bridging, Military Radar Signal Processing, ASIC Prototyping, Medical Imaging Backend Processing, Industrial High-Speed Test Equipment.
Telecom Line-Card Aggregation
The EP1SGX25DF1020C7ES is well-suited to telecom line-card aggregation where multiple backplane serial links must be protocol-converted to a higher-speed uplink. Its 25,660 logic elements and 607 user I/Os accommodate multiple soft-core protocol bridges (such as SPI-4.2, UTOPIA, and POS-PHY) while the embedded 3.125 Gbps SERDES handles backplane and fabric interconnect without external PHYs. Place the device on a 10+ layer PCB with controlled-impedance differential pairs to meet multi-gigabit link budgets.
Recomendado
High-Speed Serial Interface Bridging
For protocol-conversion bridging between RapidIO, PCI Express, Gigabit Ethernet, and SerialLite II, the EP1SGX25DF1020C7ES provides the necessary multi-gigabit transceivers and logic density in one device. The 1020-ball FC-FBGA package exposes all SERDES channels and supports up to four x4 PCIe Gen1 endpoints. Use the Altera MegaCore IP cores and run Quartus II fitter with SERDES timing constraints enabled to achieve timing closure on the wider serial interfaces.
Recomendado
Military Radar Signal Processing
The EP1SGX25DF1020C7ES suits mid-density digital-array radar DSP chains where LVDS data ingest from A/D converters must be downconverted and filtered in FPGA fabric. With 25,660 logic elements and ample block RAM, it implements multiple parallel FIR filter banks and FFT engines while the high pin density accommodates wide LVDS bus widths. Combined with the embedded SERDES, the same FPGA can also drive the digital-to-RF upconversion chain, eliminating a separate signal-conditioning ASIC.
Recomendado
ASIC Prototyping
The EP1SGX25DF1020C7ES works as an ASIC prototyping vehicle for designs targeting 130 nm or larger process nodes. Its 25,660 logic elements, 607 user I/Os, and embedded transceivers let it emulate multi-million-gate ASICs partitioned across one or two FPGAs. The Quartus II MultiPoint synthesis flow supports incremental compilation, enabling faster prototype bring-up for ASIC designs with multiple clock domains and complex SERDES interfaces.
Recomendado
Medical Imaging Backend Processing
In MRI, CT, and ultrasound imaging back-ends, the EP1SGX25DF1020C7ES handles the high-bandwidth LVDS data ingest from sensor arrays and runs parallel DSP pipelines for image reconstruction. The 130 nm Stratix GX architecture offers predictable timing for medical-grade designs that require deterministic latency. Combined with appropriate IP cores, the same FPGA can implement DICOM-compliant preprocessing and lossy/lossless image compression stages at line rate.
Recomendado
Industrial High-Speed Test Equipment
ATE (Automatic Test Equipment) and high-speed serial protocol analyzers benefit from the EP1SGX25DF1020C7ES's 3.125 Gbps SERDES channels and abundant logic for pattern generation, BERT (Bit Error Rate Tester) engines, and protocol analyzers. With 607 user I/Os and the 1020-ball FC-FBGA package, the FPGA can simultaneously drive DUT (Device Under Test) interfaces and capture multi-channel trace buffers for compliance test workstations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX25DF1020C7ES — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX25DF1020C7 | EP1SGX25DF1020C7N | EP1SGX25DF1020C6ES | EP1SGX25DF1020C6N | EP1SGX25DF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-1020 (33x33 mm) | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Speed Grade | C7 (fastest) | C7 | C7 | C6 (~15% slower) | C6 (~15% slower) | C5 (~25% slower) |
| Process / Sample Status | 130 nm, ES (Engineering Sample) | 130 nm, Production | 130 nm, Production lead-free | 130 nm, ES | 130 nm, Production lead-free | 130 nm, Production lead-free |
| Embedded Transceivers | Yes (3.125 Gbps SERDES) | Yes | Yes | Yes | Yes | Yes |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principais diferenciais
- Stratix GX architecture with embedded multi-gigabit SERDES (vs EP1SGX25DF1020C6N)
- Engineering Sample status for early prototype validation (vs EP1SGX25DF1020C7)
- Largest package option exposing full I/O and SERDES count (vs EP1SGX25CF672C7)
Notas de projeto
The 33 x 33 mm FBGA-1020 package with 1.0 mm ball pitch requires a 10+ layer PCB. Implement a stackup with dedicated ground and power planes adjacent to the BGA fan-out region to control impedance for the multi-gigabit SERDES lanes. Use laser-drilled or micro-vias in the BGA break-out area to route inner balls, and follow the Altera Stratix GX board design guidelines for via-in-pad or dog-bone fan-out.
Use a combination of bulk electrolytic/tantalum capacitors (typically 100-470 uF), mid-frequency ceramics (1-10 uF), and high-frequency 0.1 uF/1 nF ceramic capacitors placed directly under the BGA. The Stratix GX requires separate VCCINT (1.5 V core), VCCIO (I/O bank voltage), VCCP (PCI clamp), and VCCA (PLL analog) supplies; each rail must be independently filtered. Decoupling inductance should be minimized by placing capacitors as close as possible to the BGA balls via short, wide traces.
The 3.125 Gbps SERDES channels require controlled 100-ohm differential impedance routing with intra-pair skew below 5 milps and length-matching per transmitter-receiver pair. Reference the IBIS-AMI models in the Quartus II library for channel simulation. Avoid routing SERDES lanes across plane splits; keep ground continuity beneath every differential pair to maintain return-path integrity.
Estimated: the Stratix GX at 100% logic utilization and high toggle rate can dissipate 5-10 W, requiring a thermal management strategy. With only 130 nm silicon and the FC-FBGA package, attach a heatsink with thermal interface material or use sufficient copper pours and forced-air cooling. Monitor junction temperature via the on-die temperature-sensing diode and the Quartus II PowerPlay thermal analyzer.
Do not use ES (Engineering Sample) parts in production builds without explicit qualification from Intel. ES units may have looser parametric tolerances and reduced reliability compared to production parts. Also, ensure the Quartus II software version supports the Stratix GX family; Quartus II versions 9.0 to 13.0 support this device, while newer Quartus Prime versions have dropped support for legacy families.
Informações de conformidade
Lead-free FBGA-1020 package per chipdig.com and alldatasheet.com listings. AEC-Q100 not applicable (FPGA, not automotive-grade qualification). REACH, halogen-free, and conflict-minerals status not explicitly listed in verified web data - set to unknown.
