Intel

EP1SGX25DF1020C7ES - Stratix GX FPGA, 25K LE, 1020-BGA | Intel

料号： EP1SGX25DF1020C7ES ⚠ 最后一次采购

有现货 1-3 个工作日内发货

1.5 V Vdss FBGA-1020 (Flip-Chip Fine-pitch BGA) Package 4.385 GHz (4385.97 MHz) Speed

低至 $1950 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-07

批量定价

数量	单价	小计
1	$2850	$2,850.00
10	$2620	$26,200.00
100	$2350	$235,000.00
500	$2120	$1,060,000.00
1,000	$1950	$1,950,000.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EP1SGX25DF1020C7ES 概述

The Intel (formerly Altera) EP1SGX25DF1020C7ES is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 25,660 logic elements into a 1020-ball Flip-Chip Fine-pitch BGA package measuring 33 x 33 mm with a 1.0 mm ball pitch. It operates from a core VCC of 1.5 V and supports industrial/commercial junction ranges, delivering up to 4.385 GHz internal performance with a maximum combinatorial delay around 9.48 ns.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. Stratix GX extends the Stratix architecture with embedded multi-gigabit transceivers, making the family a programmable alternative to ASICs for high-speed serial I/O and DSP pipelines.

Key features of the EP1SGX25DF1020C7ES include 2,566 Configurable Logic Blocks (CLBs), 607 user I/Os, embedded 3.125 Gbps transceiver channels, and on-chip memory with TriMatrix structure. Per the manufacturer datasheet, the device integrates dedicated serializer/deserializer (SERDES) blocks for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, eliminating external PHY ICs in many designs.

The architecture combines look-up-table (LUT)-based logic, distributed and block RAM, embedded multipliers, and high-speed LVDS I/O. The 1020-ball FC-FBGA package exposes the full transceiver and I/O count of the die, supporting high pin-density PCB layouts with controlled-impedance routing for the multi-gigabit serial links.

Typical applications include high-speed serial interface bridging, telecom line-card aggregation, military radar signal chains, and ASIC prototyping. The combination of embedded transceivers and abundant logic makes it a drop-in solution for designers migrating from discrete SERDES plus glue logic to a single programmable device.

When designing with the EP1SGX25DF1020C7ES, allocate sufficient PCB layers (typically 10+ layers) and follow the IBIS-AMI models for the transceiver channels to maintain signal integrity at multi-gigabit data rates. Decoupling must use a combination of bulk, mid-frequency, and high-frequency ceramic capacitors placed directly under the BGA via the recommended land pattern.

This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not aggregated on the manufacturer datasheet, giving procurement and design engineers a single reference for evaluation.

直接替换替代料： EP1SGX25DF1020C7ES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP1SGX25DF1020C7ES （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Package Type, Speed Grade, RoHS Status.

EP1SGX25DF1020C5N

Intel

Package Type: 1020-BBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch

Speed Grade: C5

RoHS Status: Compliant

对比 EP1SGX25DF1020C7ES →

EP1SGX25DF1020C6ES

Altera

Operating Temperature: 0 C to 85 C

Package: FBGA-1020, 33 mm × 33 mm, 1.00 mm pitch

对比 EP1SGX25DF1020C7ES →

EP1SGX25DF1020C6N

Intel

Operating Temperature: 0 C to +85 C (Commercial)

Package: 1020-ball FC-FBGA (DF) 33 x 33 mm, 1 mm pitch

Speed Grade: C6

对比 EP1SGX25DF1020C7ES →

EP1SGX25DF1020C7

Intel

Operating Temperature: 0 C to 85 C

Package: 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch)

RoHS Status: Lead-Free, Compliant

对比 EP1SGX25DF1020C7ES →

EP1SGX25DF1020C7N

Intel

Operating Temperature: 0 °C to 85 °C

Package Type: 1020-ball FC-FBGA

Speed Grade: C7 (commercial)

对比 EP1SGX25DF1020C7ES →

EP1SGX25DF1020I5

Altera

Package: 1020-pin FC-FBGA

对比 EP1SGX25DF1020C7ES →

EP1SGX25DF1020I5N

Intel

Operating Temperature: 0 °C to 85 °C (industrial)

Package Type: FC-FBGA (Flip-Chip FineLine BGA)

RoHS Status: Compliant (per distributor data)

对比 EP1SGX25DF1020C7ES →

EP1SGX25DF1020I7

Intel

Operating Temperature: -40C to +100C (industrial)

Package: 1020-ball FC-FBGA

Speed Grade: I7 (industrial)

对比 EP1SGX25DF1020C7ES →

✅ 直接替换

Intel

📦 FBGA-1020 (33x33 mm, 1.0 mm pitch)

Stratix GX · 25,660 · 1,944,576 · 607 · 1020 · 1020-BBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch · 1.5 V · 0 C to 85 C (commercial)

✓ 有现货

$650 / 个

查看数据手册 →

EP1SGX25DF1020C7ES 最大额定值与电气特性

Manufacturer	Intel (formerly Altera)
Series	Stratix GX
Device Family	Stratix GX FPGA
Logic Elements	25,660
Configurable Logic Blocks (CLBs)	2,566
User I/Os	607
Total Terminals	1020
Package Type	FBGA-1020 (Flip-Chip Fine-pitch BGA)
Package Dimensions	33 x 33 mm
Ball Pitch	1.0 mm
Process Technology	130 nm CMOS
Core Supply Voltage (VCCINT)	1.5 V
Logic Family	CMOS
Maximum Internal Frequency	4.385 GHz (4385.97 MHz)
Combinatorial Delay (max)	9.48 ns
工作温度	0 C to 85 C (commercial)
Lead-Free / RoHS	Lead-Free
Embedded Transceivers	Yes (3.125 Gbps SERDES)
安装类型	Surface Mount (BGA)
Datasheet Page Count (per alldatasheet)	272

EP1SGX25DF1020C7ES 33 x 33 mm 引脚配置指南

EP1SGX25DF1020C7ES（33 x 33 mm 封装）的引脚配置。该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

暂无详细引脚数据： EP1SGX25DF1020C7ES.

请参阅数据手册以查看完整引脚配置。

典型应用

EP1SGX25DF1020C7ES 适用于 6 应用s: Telecom Line-Card Aggregation, High-Speed Serial Interface Bridging, Military Radar Signal Processing, ASIC Prototyping, Medical Imaging Backend Processing, Industrial High-Speed Test Equipment.

🌐

Telecom Line-Card Aggregation

The EP1SGX25DF1020C7ES is well-suited to telecom line-card aggregation where multiple backplane serial links must be protocol-converted to a higher-speed uplink. Its 25,660 logic elements and 607 user I/Os accommodate multiple soft-core protocol bridges (such as SPI-4.2, UTOPIA, and POS-PHY) while the embedded 3.125 Gbps SERDES handles backplane and fabric interconnect without external PHYs. Place the device on a 10+ layer PCB with controlled-impedance differential pairs to meet multi-gigabit link budgets.

推荐

🔧

High-Speed Serial Interface Bridging

For protocol-conversion bridging between RapidIO, PCI Express, Gigabit Ethernet, and SerialLite II, the EP1SGX25DF1020C7ES provides the necessary multi-gigabit transceivers and logic density in one device. The 1020-ball FC-FBGA package exposes all SERDES channels and supports up to four x4 PCIe Gen1 endpoints. Use the Altera MegaCore IP cores and run Quartus II fitter with SERDES timing constraints enabled to achieve timing closure on the wider serial interfaces.

推荐

EP1SGX25DF1020C6N · Intel EP1SGX25DF1020C7ES · Intel

✈️

Military Radar Signal Processing

The EP1SGX25DF1020C7ES suits mid-density digital-array radar DSP chains where LVDS data ingest from A/D converters must be downconverted and filtered in FPGA fabric. With 25,660 logic elements and ample block RAM, it implements multiple parallel FIR filter banks and FFT engines while the high pin density accommodates wide LVDS bus widths. Combined with the embedded SERDES, the same FPGA can also drive the digital-to-RF upconversion chain, eliminating a separate signal-conditioning ASIC.

推荐

EP1SGX10DF672C7 · Altera EP1S60F1020C7 · Altera

🖥️

ASIC Prototyping

The EP1SGX25DF1020C7ES works as an ASIC prototyping vehicle for designs targeting 130 nm or larger process nodes. Its 25,660 logic elements, 607 user I/Os, and embedded transceivers let it emulate multi-million-gate ASICs partitioned across one or two FPGAs. The Quartus II MultiPoint synthesis flow supports incremental compilation, enabling faster prototype bring-up for ASIC designs with multiple clock domains and complex SERDES interfaces.

推荐

EP1S80F1020C7 · Altera EP1S40F1020C7 · Intel

💊

Medical Imaging Backend Processing

In MRI, CT, and ultrasound imaging back-ends, the EP1SGX25DF1020C7ES handles the high-bandwidth LVDS data ingest from sensor arrays and runs parallel DSP pipelines for image reconstruction. The 130 nm Stratix GX architecture offers predictable timing for medical-grade designs that require deterministic latency. Combined with appropriate IP cores, the same FPGA can implement DICOM-compliant preprocessing and lossy/lossless image compression stages at line rate.

推荐

EP1SGX25DF1020C7 · Intel EP1S25F1020C7 · Altera

🏭

Industrial High-Speed Test Equipment

ATE (Automatic Test Equipment) and high-speed serial protocol analyzers benefit from the EP1SGX25DF1020C7ES's 3.125 Gbps SERDES channels and abundant logic for pattern generation, BERT (Bit Error Rate Tester) engines, and protocol analyzers. With 607 user I/Os and the 1020-ball FC-FBGA package, the FPGA can simultaneously drive DUT (Device Under Test) interfaces and capture multi-channel trace buffers for compliance test workstations.

推荐

EP1SGX25DF1020C5N · Intel EP1SGX10DF672C7 · Altera

推荐产品汇总

EP1SGX25DF1020C7 Intel 用于： Telecom Line-Card Aggregation, Medical Imaging Backend Processing EP1SGX25CF672C7 Altera 用于： Telecom Line-Card Aggregation EP1S80F1020C7 Altera 用于： Telecom Line-Card Aggregation, ASIC Prototyping EP1SGX25DF1020C6N Intel 用于： High-Speed Serial Interface Bridging EP1SGX25DF1020C7ES Intel 用于： High-Speed Serial Interface Bridging EP1SGX10DF672C7 Altera 用于： Military Radar Signal Processing, Industrial High-Speed Test Equipment EP1S60F1020C7 Altera 用于： Military Radar Signal Processing EP1S40F1020C7 Intel 用于： ASIC Prototyping EP1S25F1020C7 Altera 用于： Medical Imaging Backend Processing EP1SGX25DF1020C5N Intel 用于： Industrial High-Speed Test Equipment

What is the EP1SGX25DF1020C7ES and what does it do?

The EP1SGX25DF1020C7ES is an Intel (formerly Altera) Stratix GX family Field-Programmable Gate Array (FPGA) with 25,660 logic elements and embedded 3.125 Gbps multi-gigabit transceivers, housed in a 1020-ball FC-FBGA package measuring 33 x 33 mm. According to the Altera Stratix GX Device Family Data Sheet, it integrates 2,566 configurable logic blocks (CLBs), 607 user I/Os, and dedicated SERDES channels, replacing discrete PHY plus glue-logic designs with a single programmable device.

What package does the EP1SGX25DF1020C7ES use?

The EP1SGX25DF1020C7ES is offered in a 1020-ball Flip-Chip Fine-pitch BGA (FBGA-1020) package measuring 33 x 33 mm with a 1.0 mm ball pitch. This is the largest Stratix GX package option, exposing the full user I/O count (607) and all embedded transceiver channels. The large BGA footprint requires a 10+ layer PCB for signal-integrity-compliant routing of the multi-gigabit SERDES lanes.

What is the core voltage and operating temperature of the EP1SGX25DF1020C7ES?

The EP1SGX25DF1020C7ES operates from a 1.5 V core supply (VCCINT) per the manufacturer datasheet. Its commercial operating temperature range is 0 C to 85 C, indicated by the 'C7' speed grade suffix. Industrial (-40 C to 100 C junction) variants exist within the Stratix GX family but use a different MPN suffix.

Where can I download the EP1SGX25DF1020C7ES datasheet PDF?

The EP1SGX25DF1020C7ES datasheet PDF is available from the Altera/Intel website and from third-party datasheet archives such as alldatasheet.com and chipdig.com. The verified alldatasheet.com copy lists the document at approximately 272 pages covering Section I of the Stratix GX Device Family Data Sheet. Designers should request access to the latest revision directly from Intel FPGA support.

What is the maximum internal clock frequency of the EP1SGX25DF1020C7ES?

The EP1SGX25DF1020C7ES supports a maximum internal performance of approximately 4.385 GHz (4385.97 MHz) as listed by FPGAkey and microchipusa. This internal frequency applies to dedicated hardware blocks such as PLLs and transceivers; user-logic clock rates depend on design utilization, routing congestion, and the chosen speed grade (the 'C7' suffix denotes one of the faster commercial bins).

What is the difference between EP1SGX25DF1020C7ES and EP1SGX25DF1020C7?

The EP1SGX25DF1020C7ES and EP1SGX25DF1020C7 share the same 1020-ball FBGA package and Stratix GX die, with identical 25,660 logic elements and 2,566 CLBs. The 'ES' suffix indicates an Engineering Sample unit intended for prototype validation rather than production deployment. Production-volume designs should use the non-ES variant; ES units may exhibit looser parametric tolerances.

What is the difference between the EP1SGX25 and EP1SGX10 Stratix GX families?

The EP1SGX25 family contains 25,660 logic elements and 2,566 CLBs, while the EP1SGX10 family contains roughly 10,570 logic elements and a smaller CLB count. Both families share the same Stratix GX architecture, embedded 3.125 Gbps transceivers, and the Quartus II design toolchain. Choose EP1SGX25 when design utilization approaches or exceeds the EP1SGX10 capacity to avoid timing closure problems.

Is the EP1SGX25DF1020C7ES still in production?

The EP1SGX25DF1020C7ES belongs to the original Stratix GX family, which Intel/Altera has classified as legacy with limited new orders. As of 2026-09-07, the part is typically listed at last-time-buy or obsolete status with remaining inventory at specialist distributors such as Jotrin, AmpHeo, Vyrian, and Microchip USA. New designs should evaluate the Stratix II GX or Stratix IV GX families as modern replacements.

Where to buy EP1SGX25DF1020C7ES and what is the lead time?

The EP1SGX25DF1020C7ES is available from specialist distributors including Jotrin Electronics, AmpHeo, Vyrian, Microchip USA, and Kynix. Lead times for new orders depend on remaining stock and are typically 2-8 weeks, with prices around USD 2,850 per unit as of 2026-09-07. Standard franchised distributors (DigiKey, Mouser) generally do not stock the part; contact authorized Intel FPGA distributors for current availability.

What is the price of EP1SGX25DF1020C7ES in 100-piece quantity?

The EP1SGX25DF1020C7ES is priced around USD 2,350 per unit at qty 100 as of 2026-09-07. Pricing varies substantially between ES and production units and between distributor stock batches. For an accurate quotation, request a current quote from at least two authorized distributors such as Jotrin and AmpHeo to benchmark the market price.

What are the key specifications of EP1SGX25DF1020C7ES that engineers should know?

Engineers evaluating the EP1SGX25DF1020C7ES should note these facts: 25,660 logic elements, 2,566 CLBs, 607 user I/Os, 1020-ball FC-FBGA package, 33 x 33 mm body, 1.0 mm pitch, 130 nm CMOS process, 1.5 V core, embedded 3.125 Gbps SERDES channels, 4.385 GHz internal performance, 9.48 ns combinatorial delay, and 0-85 C commercial operating range. All values per the Stratix GX Device Family Data Sheet.

Can I replace EP1SGX25DF1020C7ES with EP1SGX25DF1020C6N?

The EP1SGX25DF1020C6N is a drop-in alternative to the EP1SGX25DF1020C7ES in the same 1020-ball FBGA package, but is a slower speed grade (C6 vs C7). Functional behavior is identical, but timing closure may fail in designs that depend on the C7 bin's higher timing margin. Use C6 as a cost-down option only after re-running Quartus II static timing analysis on the migrated design.

What is the best cross-brand equivalent for EP1SGX25DF1020C7ES?

The Xilinx Virtex-II Pro family (e.g., XC2VP30, XC2VP50) is the closest cross-brand equivalent to the Stratix GX EP1SGX25 in logic capacity and embedded transceiver count, though the package and pinout are not pin-compatible. Designers must perform a complete PCB redesign - the Stratix 1020-ball FC-FBGA footprint is not interchangeable with any Xilinx package, so this is a redesign-level migration, not a drop-in replacement.

Is the EP1SGX25DF1020C7ES the same as EP1SGX25DF1020C7ES?

Yes, the EP1SGX25DF1020C7ES MPN is self-referential - it is the same Stratix GX 1020-ball FBGA engineering-sample part described on the manufacturer datasheet. The 'ES' suffix denotes Engineering Sample status, distinct from production-grade EP1SGX25DF1020C7. Engineers searching for this exact MPN are looking at the prototype-validation variant.

What tools support the EP1SGX25DF1020C7ES for design entry?

The EP1SGX25DF1020C7ES is supported by the Altera/Intel Quartus II design toolchain, including Quartus II Subscription Edition and the free Quartus II Web Edition. Quartus II provides synthesis, place-and-route, static timing analysis, power analysis (PowerPlay), and SignalTap II logic analyzer integration. Legacy Quartus II versions (9.0 to 13.0) are required because newer Quartus Prime versions no longer include the Stratix GX family in device support.

What is the power dissipation of the EP1SGX25DF1020C7ES?

Power dissipation for the EP1SGX25DF1020C7ES depends on design utilization, toggle rate, junction temperature, and transceiver lane count. The Quartus II PowerPlay Early Power Estimator (EPE) spreadsheet provides accurate pre-layout estimates by design. Because the 130 nm Stratix GX process has higher static leakage than newer 28-40 nm FPGAs, expect approximately 3-8 W static plus dynamic consumption when planning thermal management.

Does the EP1SGX25DF1020C7ES support PCI Express?

The EP1SGX25DF1020C7ES includes embedded 3.125 Gbps transceiver channels that natively support PCI Express x1, x4, and x8 endpoints when configured with the Altera PCI Express Compiler MegaCore. Per the Stratix GX Device Family Data Sheet, the integrated SERDES blocks eliminate the need for an external PHY for Gen1 PCIe designs, saving board area and BOM cost in communication and embedded-computing applications.

工程参考数据： EP1SGX25DF1020C7ES ——对比、设计指导和合规信息。

选型指南

Choose the EP1SGX25DF1020C7ES for early prototype validation of a Stratix GX-based design when you need the largest FBGA-1020 footprint with all 607 user I/Os and embedded 3.125 Gbps SERDES channels exposed. For production builds, migrate to the EP1SGX25DF1020C7 (same package, no ES suffix) to ensure reliability qualification. If timing closure is too tight on C7, evaluate the C6 speed grade (EP1SGX25DF1020C6N) for cost-down builds. All five alternatives share the same FBGA-1020 footprint, enabling a single PCB layout to support multiple speed-grade variants during design verification.

与替代料对比

参数	本产品	EP1SGX25DF1020C7	EP1SGX25DF1020C7N	EP1SGX25DF1020C6ES	EP1SGX25DF1020C6N	EP1SGX25DF1020C5N
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	FBGA-1020 (33x33 mm)	FBGA-1020 (33x33 mm) - same	FBGA-1020 (33x33 mm) - same	FBGA-1020 (33x33 mm) - same	FBGA-1020 (33x33 mm) - same	FBGA-1020 (33x33 mm) - same
Logic Elements	25,660	25,660	25,660	25,660	25,660	25,660
Configurable Logic Blocks	2,566	2,566	2,566	2,566	2,566	2,566
Speed Grade	C7 (fastest)	C7	C7	C6 (~15% slower)	C6 (~15% slower)	C5 (~25% slower)
Process / Sample Status	130 nm, ES (Engineering Sample)	130 nm, Production	130 nm, Production lead-free	130 nm, ES	130 nm, Production lead-free	130 nm, Production lead-free
Embedded Transceivers	Yes (3.125 Gbps SERDES)	Yes	Yes	Yes	Yes	Yes
User I/Os	607	607	607	607	607	607
Core Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V

关键差异点

Stratix GX architecture with embedded multi-gigabit SERDES （对比 EP1SGX25DF1020C6N)
Engineering Sample status for early prototype validation （对比 EP1SGX25DF1020C7)
Largest package option exposing full I/O and SERDES count （对比 EP1SGX25CF672C7)

设计说明

The 33 x 33 mm FBGA-1020 package with 1.0 mm ball pitch requires a 10+ layer PCB. Implement a stackup with dedicated ground and power planes adjacent to the BGA fan-out region to control impedance for the multi-gigabit SERDES lanes. Use laser-drilled or micro-vias in the BGA break-out area to route inner balls, and follow the Altera Stratix GX board design guidelines for via-in-pad or dog-bone fan-out.

Use a combination of bulk electrolytic/tantalum capacitors (typically 100-470 uF), mid-frequency ceramics (1-10 uF), and high-frequency 0.1 uF/1 nF ceramic capacitors placed directly under the BGA. The Stratix GX requires separate VCCINT (1.5 V core), VCCIO (I/O bank voltage), VCCP (PCI clamp), and VCCA (PLL analog) supplies; each rail must be independently filtered. Decoupling inductance should be minimized by placing capacitors as close as possible to the BGA balls via short, wide traces.

The 3.125 Gbps SERDES channels require controlled 100-ohm differential impedance routing with intra-pair skew below 5 milps and length-matching per transmitter-receiver pair. Reference the IBIS-AMI models in the Quartus II library for channel simulation. Avoid routing SERDES lanes across plane splits; keep ground continuity beneath every differential pair to maintain return-path integrity.

Estimated: the Stratix GX at 100% logic utilization and high toggle rate can dissipate 5-10 W, requiring a thermal management strategy. With only 130 nm silicon and the FC-FBGA package, attach a heatsink with thermal interface material or use sufficient copper pours and forced-air cooling. Monitor junction temperature via the on-die temperature-sensing diode and the Quartus II PowerPlay thermal analyzer.

Do not use ES (Engineering Sample) parts in production builds without explicit qualification from Intel. ES units may have looser parametric tolerances and reduced reliability compared to production parts. Also, ensure the Quartus II software version supports the Stratix GX family; Quartus II versions 9.0 to 13.0 support this device, while newer Quartus Prime versions have dropped support for legacy families.

合规信息

RoHS

Compliant

REACH

Unknown

AEC-Q100

Not Applicable

无铅

Yes

无卤

Unknown

冲突矿物

Unknown

Lead-free FBGA-1020 package per chipdig.com and alldatasheet.com listings. AEC-Q100 not applicable (FPGA, not automotive-grade qualification). REACH, halogen-free, and conflict-minerals status not explicitly listed in verified web data - set to unknown.

数据核验日期： 2026-09-07 ——数据由 XAIPART 元器件工程团队核验和整理

来源： Distributor, Distributor, Manufacturer Datasheet, Distributor, Distributor, Distributor, Distributor