EP1SGX25DF1020C7ES - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
MPN: EP1SGX25DF1020C7ES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2350 | $235,000.00 |
| 500 | $2120 | $1,060,000.00 |
| 1,000 | $1950 | $1,950,000.00 |
Drop-in alternatives for EP1SGX25DF1020C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP1SGX25DF1020C6N
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View Datasheet →EP1SGX25DF1020C7ES Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix GX |
| Device Family | Stratix GX FPGA |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| User I/Os | 607 |
| Total Terminals | 1020 |
| Package Type | FBGA-1020 (Flip-Chip Fine-pitch BGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Logic Family | CMOS |
| Maximum Internal Frequency | 4.385 GHz (4385.97 MHz) |
| Combinatorial Delay (max) | 9.48 ns |
| Operating Temperature | 0 C to 85 C (commercial) |
| Lead-Free / RoHS | Lead-Free |
| Embedded Transceivers | Yes (3.125 Gbps SERDES) |
| Mounting Type | Surface Mount (BGA) |
| Datasheet Page Count (per alldatasheet) | 272 |
EP1SGX25DF1020C7ES 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C7ES (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C7ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C7ES is suitable for 6 applications: Telecom Line-Card Aggregation, High-Speed Serial Interface Bridging, Military Radar Signal Processing, ASIC Prototyping, Medical Imaging Backend Processing, Industrial High-Speed Test Equipment.
Telecom Line-Card Aggregation
The EP1SGX25DF1020C7ES is well-suited to telecom line-card aggregation where multiple backplane serial links must be protocol-converted to a higher-speed uplink. Its 25,660 logic elements and 607 user I/Os accommodate multiple soft-core protocol bridges (such as SPI-4.2, UTOPIA, and POS-PHY) while the embedded 3.125 Gbps SERDES handles backplane and fabric interconnect without external PHYs. Place the device on a 10+ layer PCB with controlled-impedance differential pairs to meet multi-gigabit link budgets.
Recommended
High-Speed Serial Interface Bridging
For protocol-conversion bridging between RapidIO, PCI Express, Gigabit Ethernet, and SerialLite II, the EP1SGX25DF1020C7ES provides the necessary multi-gigabit transceivers and logic density in one device. The 1020-ball FC-FBGA package exposes all SERDES channels and supports up to four x4 PCIe Gen1 endpoints. Use the Altera MegaCore IP cores and run Quartus II fitter with SERDES timing constraints enabled to achieve timing closure on the wider serial interfaces.
Recommended
Military Radar Signal Processing
The EP1SGX25DF1020C7ES suits mid-density digital-array radar DSP chains where LVDS data ingest from A/D converters must be downconverted and filtered in FPGA fabric. With 25,660 logic elements and ample block RAM, it implements multiple parallel FIR filter banks and FFT engines while the high pin density accommodates wide LVDS bus widths. Combined with the embedded SERDES, the same FPGA can also drive the digital-to-RF upconversion chain, eliminating a separate signal-conditioning ASIC.
Recommended
ASIC Prototyping
The EP1SGX25DF1020C7ES works as an ASIC prototyping vehicle for designs targeting 130 nm or larger process nodes. Its 25,660 logic elements, 607 user I/Os, and embedded transceivers let it emulate multi-million-gate ASICs partitioned across one or two FPGAs. The Quartus II MultiPoint synthesis flow supports incremental compilation, enabling faster prototype bring-up for ASIC designs with multiple clock domains and complex SERDES interfaces.
Recommended
Medical Imaging Backend Processing
In MRI, CT, and ultrasound imaging back-ends, the EP1SGX25DF1020C7ES handles the high-bandwidth LVDS data ingest from sensor arrays and runs parallel DSP pipelines for image reconstruction. The 130 nm Stratix GX architecture offers predictable timing for medical-grade designs that require deterministic latency. Combined with appropriate IP cores, the same FPGA can implement DICOM-compliant preprocessing and lossy/lossless image compression stages at line rate.
Recommended
Industrial High-Speed Test Equipment
ATE (Automatic Test Equipment) and high-speed serial protocol analyzers benefit from the EP1SGX25DF1020C7ES's 3.125 Gbps SERDES channels and abundant logic for pattern generation, BERT (Bit Error Rate Tester) engines, and protocol analyzers. With 607 user I/Os and the 1020-ball FC-FBGA package, the FPGA can simultaneously drive DUT (Device Under Test) interfaces and capture multi-channel trace buffers for compliance test workstations.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C7 | EP1SGX25DF1020C7N | EP1SGX25DF1020C6ES | EP1SGX25DF1020C6N | EP1SGX25DF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-1020 (33x33 mm) | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Speed Grade | C7 (fastest) | C7 | C7 | C6 (~15% slower) | C6 (~15% slower) | C5 (~25% slower) |
| Process / Sample Status | 130 nm, ES (Engineering Sample) | 130 nm, Production | 130 nm, Production lead-free | 130 nm, ES | 130 nm, Production lead-free | 130 nm, Production lead-free |
| Embedded Transceivers | Yes (3.125 Gbps SERDES) | Yes | Yes | Yes | Yes | Yes |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Stratix GX architecture with embedded multi-gigabit SERDES (vs EP1SGX25DF1020C6N)
- Engineering Sample status for early prototype validation (vs EP1SGX25DF1020C7)
- Largest package option exposing full I/O and SERDES count (vs EP1SGX25CF672C7)
Design Notes
The 33 x 33 mm FBGA-1020 package with 1.0 mm ball pitch requires a 10+ layer PCB. Implement a stackup with dedicated ground and power planes adjacent to the BGA fan-out region to control impedance for the multi-gigabit SERDES lanes. Use laser-drilled or micro-vias in the BGA break-out area to route inner balls, and follow the Altera Stratix GX board design guidelines for via-in-pad or dog-bone fan-out.
Use a combination of bulk electrolytic/tantalum capacitors (typically 100-470 uF), mid-frequency ceramics (1-10 uF), and high-frequency 0.1 uF/1 nF ceramic capacitors placed directly under the BGA. The Stratix GX requires separate VCCINT (1.5 V core), VCCIO (I/O bank voltage), VCCP (PCI clamp), and VCCA (PLL analog) supplies; each rail must be independently filtered. Decoupling inductance should be minimized by placing capacitors as close as possible to the BGA balls via short, wide traces.
The 3.125 Gbps SERDES channels require controlled 100-ohm differential impedance routing with intra-pair skew below 5 milps and length-matching per transmitter-receiver pair. Reference the IBIS-AMI models in the Quartus II library for channel simulation. Avoid routing SERDES lanes across plane splits; keep ground continuity beneath every differential pair to maintain return-path integrity.
Estimated: the Stratix GX at 100% logic utilization and high toggle rate can dissipate 5-10 W, requiring a thermal management strategy. With only 130 nm silicon and the FC-FBGA package, attach a heatsink with thermal interface material or use sufficient copper pours and forced-air cooling. Monitor junction temperature via the on-die temperature-sensing diode and the Quartus II PowerPlay thermal analyzer.
Do not use ES (Engineering Sample) parts in production builds without explicit qualification from Intel. ES units may have looser parametric tolerances and reduced reliability compared to production parts. Also, ensure the Quartus II software version supports the Stratix GX family; Quartus II versions 9.0 to 13.0 support this device, while newer Quartus Prime versions have dropped support for legacy families.
Compliance Information
Lead-free FBGA-1020 package per chipdig.com and alldatasheet.com listings. AEC-Q100 not applicable (FPGA, not automotive-grade qualification). REACH, halogen-free, and conflict-minerals status not explicitly listed in verified web data - set to unknown.
