EP1SGX25DF1020C7ES - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
부품 번호: EP1SGX25DF1020C7ES ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2350 | $235,000.00 |
| 500 | $2120 | $1,060,000.00 |
| 1,000 | $1950 | $1,950,000.00 |
EP1SGX25DF1020C7ES 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. Stratix GX extends the Stratix architecture with embedded multi-gigabit transceivers, making the family a programmable alternative to ASICs for high-speed serial I/O and DSP pipelines.
Key features of the EP1SGX25DF1020C7ES include 2,566 Configurable Logic Blocks (CLBs), 607 user I/Os, embedded 3.125 Gbps transceiver channels, and on-chip memory with TriMatrix structure. Per the manufacturer datasheet, the device integrates dedicated serializer/deserializer (SERDES) blocks for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, eliminating external PHY ICs in many designs.
The architecture combines look-up-table (LUT)-based logic, distributed and block RAM, embedded multipliers, and high-speed LVDS I/O. The 1020-ball FC-FBGA package exposes the full transceiver and I/O count of the die, supporting high pin-density PCB layouts with controlled-impedance routing for the multi-gigabit serial links.
Typical applications include high-speed serial interface bridging, telecom line-card aggregation, military radar signal chains, and ASIC prototyping. The combination of embedded transceivers and abundant logic makes it a drop-in solution for designers migrating from discrete SERDES plus glue logic to a single programmable device.
When designing with the EP1SGX25DF1020C7ES, allocate sufficient PCB layers (typically 10+ layers) and follow the IBIS-AMI models for the transceiver channels to maintain signal integrity at multi-gigabit data rates. Decoupling must use a combination of bulk, mid-frequency, and high-frequency ceramic capacitors placed directly under the BGA via the recommended land pattern.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not aggregated on the manufacturer datasheet, giving procurement and design engineers a single reference for evaluation.
드롭인 대체품: EP1SGX25DF1020C7ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF1020C7ES (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Package Type, Speed Grade, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C7
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →EP1SGX25DF1020C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25DF1020C6ES
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP1SGX25DF1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020C7ES 최대 정격 & 전기적 특성
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix GX |
| Device Family | Stratix GX FPGA |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| User I/Os | 607 |
| Total Terminals | 1020 |
| Package Type | FBGA-1020 (Flip-Chip Fine-pitch BGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Logic Family | CMOS |
| Maximum Internal Frequency | 4.385 GHz (4385.97 MHz) |
| Combinatorial Delay (max) | 9.48 ns |
| 동작 온도 | 0 C to 85 C (commercial) |
| Lead-Free / RoHS | Lead-Free |
| Embedded Transceivers | Yes (3.125 Gbps SERDES) |
| 실장 유형 | Surface Mount (BGA) |
| Datasheet Page Count (per alldatasheet) | 272 |
EP1SGX25DF1020C7ES 33 x 33 mm 핀 구성 가이드
EP1SGX25DF1020C7ES(33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF1020C7ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF1020C7ES 적합 용도: 6 애플리케이션s: Telecom Line-Card Aggregation, High-Speed Serial Interface Bridging, Military Radar Signal Processing, ASIC Prototyping, Medical Imaging Backend Processing, Industrial High-Speed Test Equipment.
Telecom Line-Card Aggregation
The EP1SGX25DF1020C7ES is well-suited to telecom line-card aggregation where multiple backplane serial links must be protocol-converted to a higher-speed uplink. Its 25,660 logic elements and 607 user I/Os accommodate multiple soft-core protocol bridges (such as SPI-4.2, UTOPIA, and POS-PHY) while the embedded 3.125 Gbps SERDES handles backplane and fabric interconnect without external PHYs. Place the device on a 10+ layer PCB with controlled-impedance differential pairs to meet multi-gigabit link budgets.
추천
High-Speed Serial Interface Bridging
For protocol-conversion bridging between RapidIO, PCI Express, Gigabit Ethernet, and SerialLite II, the EP1SGX25DF1020C7ES provides the necessary multi-gigabit transceivers and logic density in one device. The 1020-ball FC-FBGA package exposes all SERDES channels and supports up to four x4 PCIe Gen1 endpoints. Use the Altera MegaCore IP cores and run Quartus II fitter with SERDES timing constraints enabled to achieve timing closure on the wider serial interfaces.
추천
Military Radar Signal Processing
The EP1SGX25DF1020C7ES suits mid-density digital-array radar DSP chains where LVDS data ingest from A/D converters must be downconverted and filtered in FPGA fabric. With 25,660 logic elements and ample block RAM, it implements multiple parallel FIR filter banks and FFT engines while the high pin density accommodates wide LVDS bus widths. Combined with the embedded SERDES, the same FPGA can also drive the digital-to-RF upconversion chain, eliminating a separate signal-conditioning ASIC.
추천
ASIC Prototyping
The EP1SGX25DF1020C7ES works as an ASIC prototyping vehicle for designs targeting 130 nm or larger process nodes. Its 25,660 logic elements, 607 user I/Os, and embedded transceivers let it emulate multi-million-gate ASICs partitioned across one or two FPGAs. The Quartus II MultiPoint synthesis flow supports incremental compilation, enabling faster prototype bring-up for ASIC designs with multiple clock domains and complex SERDES interfaces.
추천
Medical Imaging Backend Processing
In MRI, CT, and ultrasound imaging back-ends, the EP1SGX25DF1020C7ES handles the high-bandwidth LVDS data ingest from sensor arrays and runs parallel DSP pipelines for image reconstruction. The 130 nm Stratix GX architecture offers predictable timing for medical-grade designs that require deterministic latency. Combined with appropriate IP cores, the same FPGA can implement DICOM-compliant preprocessing and lossy/lossless image compression stages at line rate.
추천
Industrial High-Speed Test Equipment
ATE (Automatic Test Equipment) and high-speed serial protocol analyzers benefit from the EP1SGX25DF1020C7ES's 3.125 Gbps SERDES channels and abundant logic for pattern generation, BERT (Bit Error Rate Tester) engines, and protocol analyzers. With 607 user I/Os and the 1020-ball FC-FBGA package, the FPGA can simultaneously drive DUT (Device Under Test) interfaces and capture multi-channel trace buffers for compliance test workstations.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF1020C7ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C7 | EP1SGX25DF1020C7N | EP1SGX25DF1020C6ES | EP1SGX25DF1020C6N | EP1SGX25DF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-1020 (33x33 mm) | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Speed Grade | C7 (fastest) | C7 | C7 | C6 (~15% slower) | C6 (~15% slower) | C5 (~25% slower) |
| Process / Sample Status | 130 nm, ES (Engineering Sample) | 130 nm, Production | 130 nm, Production lead-free | 130 nm, ES | 130 nm, Production lead-free | 130 nm, Production lead-free |
| Embedded Transceivers | Yes (3.125 Gbps SERDES) | Yes | Yes | Yes | Yes | Yes |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Stratix GX architecture with embedded multi-gigabit SERDES (vs EP1SGX25DF1020C6N)
- Engineering Sample status for early prototype validation (vs EP1SGX25DF1020C7)
- Largest package option exposing full I/O and SERDES count (vs EP1SGX25CF672C7)
설계 노트
The 33 x 33 mm FBGA-1020 package with 1.0 mm ball pitch requires a 10+ layer PCB. Implement a stackup with dedicated ground and power planes adjacent to the BGA fan-out region to control impedance for the multi-gigabit SERDES lanes. Use laser-drilled or micro-vias in the BGA break-out area to route inner balls, and follow the Altera Stratix GX board design guidelines for via-in-pad or dog-bone fan-out.
Use a combination of bulk electrolytic/tantalum capacitors (typically 100-470 uF), mid-frequency ceramics (1-10 uF), and high-frequency 0.1 uF/1 nF ceramic capacitors placed directly under the BGA. The Stratix GX requires separate VCCINT (1.5 V core), VCCIO (I/O bank voltage), VCCP (PCI clamp), and VCCA (PLL analog) supplies; each rail must be independently filtered. Decoupling inductance should be minimized by placing capacitors as close as possible to the BGA balls via short, wide traces.
The 3.125 Gbps SERDES channels require controlled 100-ohm differential impedance routing with intra-pair skew below 5 milps and length-matching per transmitter-receiver pair. Reference the IBIS-AMI models in the Quartus II library for channel simulation. Avoid routing SERDES lanes across plane splits; keep ground continuity beneath every differential pair to maintain return-path integrity.
Estimated: the Stratix GX at 100% logic utilization and high toggle rate can dissipate 5-10 W, requiring a thermal management strategy. With only 130 nm silicon and the FC-FBGA package, attach a heatsink with thermal interface material or use sufficient copper pours and forced-air cooling. Monitor junction temperature via the on-die temperature-sensing diode and the Quartus II PowerPlay thermal analyzer.
Do not use ES (Engineering Sample) parts in production builds without explicit qualification from Intel. ES units may have looser parametric tolerances and reduced reliability compared to production parts. Also, ensure the Quartus II software version supports the Stratix GX family; Quartus II versions 9.0 to 13.0 support this device, while newer Quartus Prime versions have dropped support for legacy families.
규정 준수 정보
Lead-free FBGA-1020 package per chipdig.com and alldatasheet.com listings. AEC-Q100 not applicable (FPGA, not automotive-grade qualification). REACH, halogen-free, and conflict-minerals status not explicitly listed in verified web data - set to unknown.
