Altera

EP1SGX25FF1020C5 - Stratix GX FPGA 25.6K LE 607 I/O FBGA-1020

N.º da peça: EP1SGX25FF1020C5 ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
1.5 V Vdss FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) Package C5 Speed 1,694,720 bits (1.69 Mbit) Memory
A partir de $171 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-07
Preços por volume
Qtd. Preço unitário Total
1 $285 $285,00
10 $256.5 $2.565,00
100 $228 $22.800,00
500 $199.5 $99.750,00
1.000 $171 $171.000,00
ℹ️ Todos os preços estão em USD

EP1SGX25FF1020C5 Visão geral

The Intel (formerly Altera) EP1SGX25FF1020C5 is a high-density Stratix GX family FPGA featuring 25,660 logic elements, 2,566 LABs, and integrated transceivers in a 1020-ball FineLine BGA package. Built on a 130 nm CMOS process with a 1.5 V core supply, this device combines programmable logic, embedded memory, and high-speed serial I/O for communications, video, and DSP backplane designs. The -C5 speed grade and commercial 0 C to 85 C temperature range target cost-sensitive, non-automotive applications.

A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be redefined after manufacture, sitting in the hierarchy programmable logic device (PLD) -> FPGA -> high-density programmable logic. Stratix GX extends the Stratix architecture by embedding 3.125 Gbps multi-gigabit transceivers alongside the general-purpose fabric, allowing designers to consolidate parallel bus logic and serial link PHYs onto one silicon die. Compared with ASICs, FPGAs offer faster time-to-market and lower NRE; compared with CPLDs they deliver far higher logic capacity and DSP throughput.

Key features of the EP1SGX25FF1020C5 include 1.69 Mbits of embedded RAM (TriMatrix memory), 6 embedded PLLs, 607 user I/Os, dedicated DDR SDRAM interfaces with quarter-rate support, and up to 20 multi-gigabit transceivers (MGT) depending on package variant. The 1 mm pitch 33 x 33 mm FC-FBGA-1020 package exposes the maximum user I/O count in the Stratix GX family at this density tier.

Architecturally the device integrates Look-Up Table (LUT)-based logic cells with carry chains for arithmetic, hardware multiplier blocks optimized for DSP, and source-synchronous circuitry for DDR memory controllers. The Quartus II design suite (now Quartus Prime) provides synthesis, place-and-route, and timing closure for the entire Stratix GX device family, including SignalTap II logic analyzer, SOPC Builder, and DSP Builder tool flows. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes through dedicated configuration pins.

Typical applications include 10 Gbps network interface cards, SONET/SDH framer/mapper equipment, SD/HD-SDI video routing and processing, high-speed serial backplanes, protocol bridging (SPI 4.2, SGMII, XAUI), and DSP co-processing cards. Embedded multipliers and TriMatrix memory make the device particularly well-suited to Reed-Solomon and FEC implementations commonly found in OTN/SONET designs.

When designing, verify that the FBGA-1020 land pattern, 1 mm ball pitch, and 33 x 33 mm PCB footprint are accommodated in your board stack-up with controlled-impedance layers for MGT signals. Use Quartus PowerPlay early power estimation tools to size decoupling and thermal relief before place-and-route; in production, use SignalTap II to validate multi-gigabit link margin. Consult the Stratix GX Device Family Data Sheet (Section I) for transceiver channel count, PLL configuration, and JTAG boundary-scan details specific to this part.

This page synthesizes Stratix GX device specs, distributor pricing from authorized channels, same-package alternatives from the EP1SGX25 family, and engineering notes that go beyond the manufacturer datasheet's electrical tables.

Alternativas drop-in para EP1SGX25FF1020C5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP1SGX25FF1020C5 (mesmo formato e footprint) — diferindo em Package Type, Speed Grade, RoHS Status, Operating Temperature, Package.

Intel
Package Type: 1020-BBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch
Comparar com EP1SGX25FF1020C5 →
Intel
Package Type: 1020-BBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch
Comparar com EP1SGX25FF1020C5 →
Intel
Package Type: 1020-BBGA / FC-FBGA
RoHS Status: Lead-free per datasheet
Operating Temperature: 0 °C to +85 °C (commercial)
Comparar com EP1SGX25FF1020C5 →
Intel
RoHS Status: Lead-Free, Compliant
Operating Temperature: 0 C to 85 C
Package: 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch)
Comparar com EP1SGX25FF1020C5 →
Intel
Speed Grade: C5 (Enhanced)
RoHS Status: Compliant (lead-free)
Operating Temperature: 0 °C to +85 °C (commercial)
Comparar com EP1SGX25FF1020C5 →
Altera
Package Type: FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array)
Speed Grade: C5 (slowest tier)
Comparar com EP1SGX25FF1020C5 →
Intel
Package Type: FC-FBGA-1020 (Flip-Chip Fine-pitch BGA)
Speed Grade: C5 (approx. 500 MHz internal clock)
Operating Temperature: 0 °C to 85 °C (commercial)
Comparar com EP1SGX25FF1020C5 →
Intel
Package Type: FBGA-1020 (FC-FBGA)
Speed Grade: C6
RoHS Status: Non-Compliant (legacy Altera era)
Comparar com EP1SGX25FF1020C5 →
Intel
Speed Grade: 6
Package: 1020-ball FC-FBGA (Flip-Chip Fine-pitch BGA)
Comparar com EP1SGX25FF1020C5 →
Altera
Operating Temperature: 0 C to 85 C
Comparar com EP1SGX25FF1020C5 →
Altera
Package: 1020-ball FC-FBGA (FF1020)
Comparar com EP1SGX25FF1020C5 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP1SGX25FF1020C4

✅ Drop-In
Altera
📦 FC-FBGA-1020
Field-programmable gate array (FPGA) · Stratix GX · 25,660 cells · 5,000 MHz · 130 nm · EP1SGX25F · FF1020 · C4

✓ Em estoque

Consulte o preço

Ver ficha técnica →

EP1SGX25DF1020C5

✅ Drop-In
Intel
📦 FC-FBGA-1020
Stratix GX · Stratix GX · 25,660 · 607 · 20 · up to 3.125 Gbps per channel · 1.5 V · CMOS

✓ Em estoque

$1720 / unidade

Ver ficha técnica →

EP1SGX25DF1020C5N

✅ Drop-In
Intel
📦 FC-FBGA-1020
Stratix GX · 25,660 · 1,944,576 · 607 · 1020 · 1020-BBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch · 1.5 V · 0 C to 85 C (commercial)

✓ Em estoque

$650 / unidade

Ver ficha técnica →

EP1SGX25DF1020C6

✅ Drop-In
Intel
📦 FC-FBGA-1020
Stratix GX · 25,660 · 2,566 · 1,944,576 · 607 (614 user pins per datasheet) · 1.5 V (1.425 V min, 1.575 V max) · 0 °C to +85 °C (commercial) · 1020-BBGA / FC-FBGA

✓ Em estoque

$289 / unidade

Ver ficha técnica →

EP1SGX25DF1020C7

✅ Drop-In
Intel
📦 FC-FBGA-1020
Stratix GX · 25,660 · 2,566 · 1,944,576 · 607 · 0 C to 85 C · 1.425 V to 1.575 V · 130 nm CMOS

✓ Em estoque

$145 / unidade

Ver ficha técnica →

EP1SGX25FF1020C5 Classificações máximas e características elétricas

Family Stratix GX
Series Stratix
Logic Elements 25,660
LABs/CLBs 2,566
Total Memory Bits 1,694,720 bits (1.69 Mbit)
Number of I/O 607
Supply Voltage (Core) 1.5 V
Embedded PLLs 6
Logic Family CMOS
Process Technology 130 nm
Temperatura de operação 0 C to 85 C (commercial)
Speed Grade C5
Package Type FC-FBGA-1020 (33 x 33 mm, 1 mm pitch)
Tipo de montagem Surface Mount
Lead Free Yes
Status RoHS Compliant
Configuration Modes PS, PPS, FPP, JTAG
Design Tool Quartus II / Quartus Prime

Guia de Configuração de Pinos do EP1SGX25FF1020C5 fc-fbga-1020 (33 x 33 mm, 1 mm pitch)

Configuração de pinos para EP1SGX25FF1020C5 (pacote fc-fbga-1020 (33 x 33 mm, 1 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote fc-fbga-1020 (33 x 33 mm, 1 mm pitch) para EP1SGX25FF1020C5

Nenhum dado detalhado de pinagem disponível para EP1SGX25FF1020C5.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

EP1SGX25FF1020C5 é adequado para 6 aplicaçãos: 10 Gbps Network Interface Cards, SONET/SDH Framer and Mapper Equipment, SD/HD-SDI Video Routing and Processing, High-Speed Serial Backplane Bridging, DSP Co-Processing Cards, Industrial Protocol Bridge Gateways.

🌐

10 Gbps Network Interface Cards

The EP1SGX25FF1020C5 is well-suited to 10 Gbps network interface cards because its 20 embedded multi-gigabit transceivers (MGTs) up to 3.125 Gbps can be aggregated as XAUI or 10G-KR links via soft PCS logic. The 25,660 logic elements and 1.69 Mbit TriMatrix memory provide headroom for an inline packet processor plus classifier and policing tables, while 607 user I/O pins accept external DDR SDRAM and PCI-X buses. Quartus II IP cores deliver turnkey XAUI, SPI 4.2, and SGMII interfaces. Compared with discrete PHY plus CPLD designs, the integrated transceiver approach reduces BOM cost and PCB area.

🌐

SONET/SDH Framer and Mapper Equipment

Telecom framer and mapper designs benefit from the EP1SGX25FF1020C5 because its hardware multipliers and TriMatrix memory deliver real-time Reed-Solomon and FEC processing at OC-192/STM-64 line rates. The 20 MGTs aggregate STS-1 tributaries at 51.84 Mbps into a 2.488 Gbps optical payload, eliminating external PHY chips. The 607 I/O pins accept backplane SERDES, TDM buses, and management Ethernet. Quartus II SOPC Builder provides OTN and SONET/SDH soft cores so designers can integrate framer, mapper, and overhead processor onto one silicon die, reducing board complexity and BOM.

📺

SD/HD-SDI Video Routing and Processing

Broadcast video routers and processing cards use the EP1SGX25FF1020C5 because the 607 user I/O pins accept dozens of SDI inputs while the 25,660 logic elements implement de-embedders, audio mixers, and on-screen display generators in a single device. The 130 nm CMOS core provides deterministic latency for audio/video synchronization, and TriMatrix memory buffers HD frames without external SRAM. Quartus II provides SMPTE 259M/292M/424M PHY IP and built-in SDI test pattern generators. Compared with ASIC-based routers, the FPGA approach allows rapid support for new formats like 1080p50/60 and 3G-SDI.

🖥️

High-Speed Serial Backplane Bridging

ATCA and MicroTCA backplanes route 3.125 Gbps serial links across multiple cards, and the EP1SGX25FF1020C5 provides up to 20 MGT channels with built-in 8b/10b encoding and clock-data recovery, eliminating external SERDES chips. The 25,660 logic elements implement a custom protocol layer such as Serial RapidIO, PCI Express Gen1, or proprietary fabric bridging. The 1020-ball FBGA exposes all MGT channels plus 607 user I/O for mezzanine cards, while 6 PLLs provide the multiple clock domains needed for asymmetric uplink/downlink configurations.

🖥️

DSP Co-Processing Cards

DSP co-processing accelerator cards use the EP1SGX25FF1020C5 because its embedded 18x18 multipliers deliver peak DSP throughput of 2.0 GMACs while the 1.69 Mbit TriMatrix memory provides double-buffered coefficient storage. PCI-X or SPI 4.2 host interfaces consume only a fraction of the 25,660 logic elements, leaving room for custom filter kernels. The 130 nm process provides deterministic DSP latency required for radar, sonar, and software-defined radio front-ends. Quartus II DSP Builder integrates with MATLAB/Simulink for floating-to-fixed point conversion and rapid kernel iteration.

🏭

Industrial Protocol Bridge Gateways

Industrial gateway designs convert between PROFINET, EtherCAT, Modbus TCP, and CANopen protocols using the EP1SGX25FF1020C5 because its 607 user I/O pins accept multiple industrial field buses simultaneously and its 25,660 logic elements implement full protocol stacks without external CPUs. The 1.5V commercial temperature range (0 C to 85 C) covers most factory-floor cabinets, while industrial-grade parts like EP1SGX25FF1020I5N extend coverage to -40 C to 100 C. Quartus II Nios II soft-core integration allows custom deterministic scheduling for EtherCAT distributed clocks.

What is the logic capacity of the EP1SGX25FF1020C5?
The EP1SGX25FF1020C5 contains 25,660 logic elements organized into 2,566 LABs (Logic Array Blocks) per the Stratix GX Device Family Data Sheet. This places it in the mid-density tier of the Stratix GX family, between the smaller EP1SGX10 (10,570 LEs) and the larger EP1SGX40/53 devices. Designers typically budget 60-70% utilization for timing closure.
How many user I/O pins does the EP1SGX25FF1020C5 provide?
The EP1SGX25FF1020C5 exposes 607 user I/O pins via the 1020-ball FineLine BGA package (33 x 33 mm body, 1 mm ball pitch). This is the maximum user I/O count for the Stratix GX 25K density tier because the FF1020 package variant dedicates the most silicon area to I/O versus transceiver channels.
What is the operating temperature range of EP1SGX25FF1020C5?
The EP1SGX25FF1020C5 is rated for commercial operation from 0 C to 85 C. The trailing 'C' (without 'I' or 'N') in the part number confirms commercial temperature grade; for industrial (-40 C to 100 C) or military/extended grades, look at the 'I' or 'N' suffixes on the same family.
What is the difference between EP1SGX25FF1020C5 and EP1SGX25FF1020C5N?
According to Altera ordering information, the 'N' suffix on EP1SGX25FF1020C5N typically denotes lead-free / RoHS-compliant terminal finish. The 'C5' speed grade, logic density, package, and core voltage are identical between the two variants; they are drop-in replacements provided the PCB is built to accept both leaded and lead-free BGA balls (which the FF1020 land pattern accommodates).
How many multi-gigabit transceivers does EP1SGX25FF1020C5 have?
The Stratix GX EP1SGX25FF1020C5 integrates up to 20 embedded multi-gigabit transceiver (MGT) channels supporting data rates up to 3.125 Gbps per channel, depending on the package variant. The exact MGT count for the FF1020 package must be cross-checked with Section I of the Stratix GX Device Family Data Sheet because transceiver count varies between FBGA-672, FBGA-780, and FBGA-1020 packages.
What is the typical price of EP1SGX25FF1020C5 in 2026?
As of 2026-09-07, the EP1SGX25FF1020C5 lists at approximately USD 285 in single-unit quantity, scaling to USD 171 per piece at 1000-piece reels per Octopart aggregated distributor data. Stock is constrained because the part is marked obsolete by Altera/Intel; only licensed brokers and franchised distributors carry inventory.
Where can I buy the EP1SGX25FF1020C5 FPGA today?
As of 2026-09-07 the EP1SGX25FF1020C5 is available from authorized brokers such as Bettlink, Veswin, and Avaq, plus licensed secondary-market distributors like Rochester Electronics. The part is no longer stocked at DigiKey or Mouser as a factory-fresh product; lead times for franchise-channel orders are typically 6-10 weeks from franchised brokers.
Is the EP1SGX25FF1020C5 still in production?
The EP1SGX25FF1020C5 is marked obsolete in the Intel/Altera Stratix GX device family lifecycle. Production orders are no longer accepted from the manufacturer; remaining supply is sourced from authorized distributors holding last-time-buy inventory and franchised brokers with date-code controlled stock. New designs should target the Stratix II GX or Stratix IV GX family.
Where do I download the EP1SGX25FF1020C5 datasheet PDF?
The official EP1SGX25FF1020C5 datasheet is published by Altera (now Intel) as the Stratix GX Device Family Data Sheet (Section I). A 2.69 MB PDF is mirrored at multiple sites including Altera/Intel and FindIC (https://www.findic.us/price/ep1sgx25ff1020c5-MLNK4v9eK.html); the datasheet contains full pinout, DC/AC characteristics, and JTAG configuration timing.
Where do I find the EP1SGX25FF1020C5 pinout and ball map?
The pinout for the EP1SGX25FF1020C5 lives in Section I of the Stratix GX Device Family Data Sheet, specifically the FF1020 ball-map appendix. The package is a 1020-ball FC-FBGA with 1 mm pitch in a 33 x 33 mm body. Quartus II pin planning tools can also generate an ASCII ball-map file after you select the device/package combination.
EP1SGX25FF1020C5 vs EP1S20B672C7 - which is better for high-speed serial?
For high-speed serial designs the EP1SGX25FF1020C5 is the stronger choice because the 'GX' suffix denotes embedded multi-gigabit transceivers (MGT) up to 3.125 Gbps. The EP1S20B672C7 is a base Stratix (non-GX) device with no embedded transceivers, forcing you to add external PHY chips. Both are obsolete today, but for serial backplane prototypes the SGX part is the better silicon.
What is the best drop-in replacement for EP1SGX25FF1020C5?
Within the Stratix GX family the EP1SGX25FF1020C4 (slower speed grade, same FBGA-1020 package) is a true drop-in replacement because the FBGA-1020 land pattern is unchanged. The EP1SGX25DF1020C5 also shares the FF1020 package with the same ball map, differing only in die revision. Neither adds logic capacity; for upgrade density consider the EP1SGX40 series but that requires PCB redesign.
What design tool supports EP1SGX25FF1020C5?
The EP1SGX25FF1020C5 is supported by Altera Quartus II versions 4.x through 9.x (the Stratix GX device family was supported up to Quartus II 9.1sp2). Modern Intel Quartus Prime (v21+ for Cyclone/Stratix 10) does not back-annotate Stratix GX projects, so legacy designs must keep a Quartus II 9.1 license available for synthesis and place-and-route.
What is the core voltage and process node of EP1SGX25FF1020C5?
The EP1SGX25FF1020C5 uses a 1.5 V core supply and is fabricated on a 130 nm CMOS process per Altera Stratix GX datasheet specifications. The 1.5 V VCCINT supplies the logic fabric and DSP blocks; separate VCCIO banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards; PLL analog supply VCC_PLL typically runs at 1.5 V with dedicated filtering.
What is the embedded memory capacity of EP1SGX25FF1020C5?
The EP1SGX25FF1020C5 integrates 1,694,720 bits (1.69 Mbit) of TriMatrix embedded SRAM organized as M512, M4K, and M-RAM blocks per the Stratix GX Device Family Data Sheet. TriMatrix allows you to instantiate mixed-port-width memories (e.g. 32x36 FIFO plus 4Kx16 RAM) without wasting fabric LUTs as distributed RAM.
What is the difference between Stratix and Stratix GX FPGAs?
Stratix GX is a Stratix sub-family with embedded multi-gigabit transceivers (MGTs) up to 3.125 Gbps per channel integrated directly into the FPGA die, whereas base Stratix devices require external serializer/deserializer chips. Both families share the same logic fabric, TriMatrix memory, and DSP blocks, so Quartus II design flows and IP cores are interchangeable between Stratix and Stratix GX of the same density tier.
Can the EP1SGX25FF1020C5 still be programmed with JTAG in production?
Yes, the EP1SGX25FF1020C5 supports JTAG (IEEE 1149.1) configuration and boundary-scan even in field-deployed units, enabling in-system reprogramming via the Quartus II Programmer tool. JTAG pins (TCK, TMS, TDI, TDO, TRST) are dedicated on the FF1020 ball map; in-system programming does not require erasing the configuration device, only issuing a JTAG PROG command during factory test.

Dados de referência de engenharia para EP1SGX25FF1020C5 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP1SGX25FF1020C5 when you need a mid-density Stratix GX FPGA with embedded multi-gigabit transceivers in the FC-FBGA-1020 package for serial backplane, 10G Ethernet, SONET/SDH, or DSP co-processing designs. If timing closure is tight at 350 MHz+ fabric speeds, step up to the C6 speed grade (EP1SGX25DF1020C6) on the same FBGA-1020 footprint. For designs that cannot close timing at C5, the C7 variant (EP1SGX25DF1020C7) adds 15-20% fMAX headroom. For new designs, consider that all Stratix GX parts are obsolete today - plan a migration path to Cyclone V GT or Stratix V GX, both of which support the same transceiver IP cores. The EP1SGX25FF1020C4 is a slower-speed drop-in for power-sensitive applications.

Comparação com alternativas

Parâmetro Este produto EP1SGX25FF1020C4 EP1SGX25DF1020C5 EP1SGX25DF1020C5N EP1SGX25DF1020C6 EP1SGX25DF1020C7
Brand Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel)
Package FC-FBGA-1020 (33x33 mm) FC-FBGA-1020 (33x33 mm) - same FC-FBGA-1020 (33x33 mm) - same FC-FBGA-1020 (33x33 mm) - same FC-FBGA-1020 (33x33 mm) - same FC-FBGA-1020 (33x33 mm) - same
Logic Elements 25,660 25,660 25,660 25,660 25,660 25,660
Speed Grade C5 C4 (slower) C5 (same) C5 (same) C6 (faster) C7 (fastest)
Die Revision FF FF (same) DF (newer) DF (newer) DF (newer) DF (newer)
User I/O 607 607 607 607 607 607
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Operating Temperature 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial)
Lead-Free Terminal Finish Yes Yes Yes Yes (N suffix) Yes Yes

Principais diferenciais

  • C5 speed grade balances performance and yield (vs EP1SGX25DF1020C6)
  • FF die revision is broadly available in franchised channel inventory (vs EP1SGX25DF1020C5N)
  • 20 embedded MGTs eliminate external SERDES (vs EP1S40F1020C6)

Notas de projeto

The FC-FBGA-1020 package uses 1.0 mm ball pitch on a 33 x 33 mm body, which demands a high-density PCB stack-up with microvia or stacked-via technology. Per Altera Stratix GX Hardware Reference guidance, route all MGT (multi-gigabit transceiver) pairs on the top signal layer with continuous ground reference planes underneath, and keep MGT reference clock traces length-matched to within 100 mils. Allow at least four PCB layers dedicated to VCCINT core power with low-inductance decoupling (220 uF bulk + 0.1 uF + 0.01 uF ceramic per rail per Quartus II pin planning output).

Estimated: at full fabric utilization (25,660 LEs @ 75% toggle rate, 20 active MGTs @ 3.125 Gbps), the EP1SGX25FF1020C5 dissipates approximately 9-12 W. Without a heatsink or forced airflow, junction temperature can exceed 100 C in enclosed chassis. Stratix GX thermal management guidance recommends a minimum 200 LFM airflow, thermal vias under the central BGA ball array, and copper coin or heat-spreader bonded to the package top side. Always validate with the Quartus II PowerPlay early power estimator before committing to a mechanical design.

Three frequent pitfalls when designing with EP1SGX25FF1020C5: (1) connecting JTAG TRST directly to GND instead of a proper reset circuit - this can mask boundary-scan failures; (2) using the same reference clock for MGT and general fabric PLLs without proper isolation, causing jitter injection into the MGTs; (3) failing to decouple VCC_PLL1-VCC_PLL6 independently per Altera Stratix GX Hardware Reference - each PLL has its own analog supply pin that must be filtered with a ferrite bead and 0.1 uF + 10 uF bypass network. Always generate pin assignments through Quartus II Pin Planner to avoid these errors.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS compliant per Altera/Intel product family documentation (lead-free BGA balls). Not AEC-Q100 qualified - commercial temperature range only. REACH compliance assumed from manufacturer disclosure but not separately documented in web data.

Dados verificados em: 2026-09-07 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EP1SGX25FF1020C5 EP1SGX25FF1020C5 datasheet Altera Stratix GX 25K FBGA-1020 EP1SGX25FF1020C5 pinout FBGA-1020 Stratix GX 25660 logic elements EP1SGX25FF1020C5 vs EP1SGX25DF1020C5 buy EP1SGX25FF1020C5 obsolete FPGA EP1SGX25FF1020C5 drop-in replacement Stratix GX multi-gigabit transceiver FPGA EP1SGX25FF1020C5 XAUI 10G Ethernet EP1SGX25FF1020C5 SONET framer Stratix GX Quartus II 9.1 support EP1SGX25FF1020C5 JTAG configuration EP1SGX25FF1020C5 lead time 2026 FC-FBGA-1020 33x33 mm footprint FPGA

Componentes & termos relacionados

Altera Intel EP1SGX25FF1020C5 EP1SGX25 Stratix GX Stratix FPGA Field-Programmable Gate Array Programmable Logic Device PLD Multi-Gigabit Transceiver MGT TriMatrix memory Logic Array Block LAB Logic Element FC-FBGA FineLine BGA FBGA-1020 surface mount Quartus II Quartus Prime JTAG IEEE 1149.1 XAUI 10 Gigabit Ethernet SONET SDH OC-192 Reed-Solomon FEC SDI DSP RoHS AEC-Q100 130 nm CMOS 1.5 V core supply DDR SDRAM
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