EP1SGX25FF1020C5 - Stratix GX FPGA 25.6K LE 607 I/O FBGA-1020
MPN: EP1SGX25FF1020C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
Drop-in alternatives for EP1SGX25FF1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25FF1020C4
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View Datasheet →EP1SGX25DF1020C5
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View Datasheet →EP1SGX25DF1020C5N
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View Datasheet →EP1SGX25DF1020C6
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View Datasheet →EP1SGX25FF1020C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements | 25,660 |
| LABs/CLBs | 2,566 |
| Total Memory Bits | 1,694,720 bits (1.69 Mbit) |
| Number of I/O | 607 |
| Supply Voltage (Core) | 1.5 V |
| Embedded PLLs | 6 |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| Operating Temperature | 0 C to 85 C (commercial) |
| Speed Grade | C5 |
| Package Type | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Lead Free | Yes |
| RoHS Status | Compliant |
| Configuration Modes | PS, PPS, FPP, JTAG |
| Design Tool | Quartus II / Quartus Prime |
EP1SGX25FF1020C5 fc-fbga-1020 (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020C5 (fc-fbga-1020 (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C5 is suitable for 6 applications: 10 Gbps Network Interface Cards, SONET/SDH Framer and Mapper Equipment, SD/HD-SDI Video Routing and Processing, High-Speed Serial Backplane Bridging, DSP Co-Processing Cards, Industrial Protocol Bridge Gateways.
10 Gbps Network Interface Cards
The EP1SGX25FF1020C5 is well-suited to 10 Gbps network interface cards because its 20 embedded multi-gigabit transceivers (MGTs) up to 3.125 Gbps can be aggregated as XAUI or 10G-KR links via soft PCS logic. The 25,660 logic elements and 1.69 Mbit TriMatrix memory provide headroom for an inline packet processor plus classifier and policing tables, while 607 user I/O pins accept external DDR SDRAM and PCI-X buses. Quartus II IP cores deliver turnkey XAUI, SPI 4.2, and SGMII interfaces. Compared with discrete PHY plus CPLD designs, the integrated transceiver approach reduces BOM cost and PCB area.
Recommended
SONET/SDH Framer and Mapper Equipment
Telecom framer and mapper designs benefit from the EP1SGX25FF1020C5 because its hardware multipliers and TriMatrix memory deliver real-time Reed-Solomon and FEC processing at OC-192/STM-64 line rates. The 20 MGTs aggregate STS-1 tributaries at 51.84 Mbps into a 2.488 Gbps optical payload, eliminating external PHY chips. The 607 I/O pins accept backplane SERDES, TDM buses, and management Ethernet. Quartus II SOPC Builder provides OTN and SONET/SDH soft cores so designers can integrate framer, mapper, and overhead processor onto one silicon die, reducing board complexity and BOM.
Recommended
SD/HD-SDI Video Routing and Processing
Broadcast video routers and processing cards use the EP1SGX25FF1020C5 because the 607 user I/O pins accept dozens of SDI inputs while the 25,660 logic elements implement de-embedders, audio mixers, and on-screen display generators in a single device. The 130 nm CMOS core provides deterministic latency for audio/video synchronization, and TriMatrix memory buffers HD frames without external SRAM. Quartus II provides SMPTE 259M/292M/424M PHY IP and built-in SDI test pattern generators. Compared with ASIC-based routers, the FPGA approach allows rapid support for new formats like 1080p50/60 and 3G-SDI.
Recommended
High-Speed Serial Backplane Bridging
ATCA and MicroTCA backplanes route 3.125 Gbps serial links across multiple cards, and the EP1SGX25FF1020C5 provides up to 20 MGT channels with built-in 8b/10b encoding and clock-data recovery, eliminating external SERDES chips. The 25,660 logic elements implement a custom protocol layer such as Serial RapidIO, PCI Express Gen1, or proprietary fabric bridging. The 1020-ball FBGA exposes all MGT channels plus 607 user I/O for mezzanine cards, while 6 PLLs provide the multiple clock domains needed for asymmetric uplink/downlink configurations.
Recommended
DSP Co-Processing Cards
DSP co-processing accelerator cards use the EP1SGX25FF1020C5 because its embedded 18x18 multipliers deliver peak DSP throughput of 2.0 GMACs while the 1.69 Mbit TriMatrix memory provides double-buffered coefficient storage. PCI-X or SPI 4.2 host interfaces consume only a fraction of the 25,660 logic elements, leaving room for custom filter kernels. The 130 nm process provides deterministic DSP latency required for radar, sonar, and software-defined radio front-ends. Quartus II DSP Builder integrates with MATLAB/Simulink for floating-to-fixed point conversion and rapid kernel iteration.
Recommended
Industrial Protocol Bridge Gateways
Industrial gateway designs convert between PROFINET, EtherCAT, Modbus TCP, and CANopen protocols using the EP1SGX25FF1020C5 because its 607 user I/O pins accept multiple industrial field buses simultaneously and its 25,660 logic elements implement full protocol stacks without external CPUs. The 1.5V commercial temperature range (0 C to 85 C) covers most factory-floor cabinets, while industrial-grade parts like EP1SGX25FF1020I5N extend coverage to -40 C to 100 C. Quartus II Nios II soft-core integration allows custom deterministic scheduling for EtherCAT distributed clocks.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C4 | EP1SGX25DF1020C5 | EP1SGX25DF1020C5N | EP1SGX25DF1020C6 | EP1SGX25DF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | FC-FBGA-1020 (33x33 mm) | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C5 | C4 (slower) | C5 (same) | C5 (same) | C6 (faster) | C7 (fastest) |
| Die Revision | FF | FF (same) | DF (newer) | DF (newer) | DF (newer) | DF (newer) |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Lead-Free Terminal Finish | Yes | Yes | Yes | Yes (N suffix) | Yes | Yes |
| Single-Unit Price (USD, as of 2026-09-07) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- C5 speed grade balances performance and yield (vs EP1SGX25DF1020C6)
- FF die revision is broadly available in franchised channel inventory (vs EP1SGX25DF1020C5N)
- 20 embedded MGTs eliminate external SERDES (vs EP1S40F1020C6)
Design Notes
The FC-FBGA-1020 package uses 1.0 mm ball pitch on a 33 x 33 mm body, which demands a high-density PCB stack-up with microvia or stacked-via technology. Per Altera Stratix GX Hardware Reference guidance, route all MGT (multi-gigabit transceiver) pairs on the top signal layer with continuous ground reference planes underneath, and keep MGT reference clock traces length-matched to within 100 mils. Allow at least four PCB layers dedicated to VCCINT core power with low-inductance decoupling (220 uF bulk + 0.1 uF + 0.01 uF ceramic per rail per Quartus II pin planning output).
Estimated: at full fabric utilization (25,660 LEs @ 75% toggle rate, 20 active MGTs @ 3.125 Gbps), the EP1SGX25FF1020C5 dissipates approximately 9-12 W. Without a heatsink or forced airflow, junction temperature can exceed 100 C in enclosed chassis. Stratix GX thermal management guidance recommends a minimum 200 LFM airflow, thermal vias under the central BGA ball array, and copper coin or heat-spreader bonded to the package top side. Always validate with the Quartus II PowerPlay early power estimator before committing to a mechanical design.
Three frequent pitfalls when designing with EP1SGX25FF1020C5: (1) connecting JTAG TRST directly to GND instead of a proper reset circuit - this can mask boundary-scan failures; (2) using the same reference clock for MGT and general fabric PLLs without proper isolation, causing jitter injection into the MGTs; (3) failing to decouple VCC_PLL1-VCC_PLL6 independently per Altera Stratix GX Hardware Reference - each PLL has its own analog supply pin that must be filtered with a ferrite bead and 0.1 uF + 10 uF bypass network. Always generate pin assignments through Quartus II Pin Planner to avoid these errors.
Compliance Information
RoHS compliant per Altera/Intel product family documentation (lead-free BGA balls). Not AEC-Q100 qualified - commercial temperature range only. REACH compliance assumed from manufacturer disclosure but not separately documented in web data.
