EP1SGX25FF1020C5 - Stratix GX FPGA 25.6K LE 607 I/O FBGA-1020
부품 번호: EP1SGX25FF1020C5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP1SGX25FF1020C5 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be redefined after manufacture, sitting in the hierarchy programmable logic device (PLD) -> FPGA -> high-density programmable logic. Stratix GX extends the Stratix architecture by embedding 3.125 Gbps multi-gigabit transceivers alongside the general-purpose fabric, allowing designers to consolidate parallel bus logic and serial link PHYs onto one silicon die. Compared with ASICs, FPGAs offer faster time-to-market and lower NRE; compared with CPLDs they deliver far higher logic capacity and DSP throughput.
Key features of the EP1SGX25FF1020C5 include 1.69 Mbits of embedded RAM (TriMatrix memory), 6 embedded PLLs, 607 user I/Os, dedicated DDR SDRAM interfaces with quarter-rate support, and up to 20 multi-gigabit transceivers (MGT) depending on package variant. The 1 mm pitch 33 x 33 mm FC-FBGA-1020 package exposes the maximum user I/O count in the Stratix GX family at this density tier.
Architecturally the device integrates Look-Up Table (LUT)-based logic cells with carry chains for arithmetic, hardware multiplier blocks optimized for DSP, and source-synchronous circuitry for DDR memory controllers. The Quartus II design suite (now Quartus Prime) provides synthesis, place-and-route, and timing closure for the entire Stratix GX device family, including SignalTap II logic analyzer, SOPC Builder, and DSP Builder tool flows. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes through dedicated configuration pins.
Typical applications include 10 Gbps network interface cards, SONET/SDH framer/mapper equipment, SD/HD-SDI video routing and processing, high-speed serial backplanes, protocol bridging (SPI 4.2, SGMII, XAUI), and DSP co-processing cards. Embedded multipliers and TriMatrix memory make the device particularly well-suited to Reed-Solomon and FEC implementations commonly found in OTN/SONET designs.
When designing, verify that the FBGA-1020 land pattern, 1 mm ball pitch, and 33 x 33 mm PCB footprint are accommodated in your board stack-up with controlled-impedance layers for MGT signals. Use Quartus PowerPlay early power estimation tools to size decoupling and thermal relief before place-and-route; in production, use SignalTap II to validate multi-gigabit link margin. Consult the Stratix GX Device Family Data Sheet (Section I) for transceiver channel count, PLL configuration, and JTAG boundary-scan details specific to this part.
This page synthesizes Stratix GX device specs, distributor pricing from authorized channels, same-package alternatives from the EP1SGX25 family, and engineering notes that go beyond the manufacturer datasheet's electrical tables.
드롭인 대체품: EP1SGX25FF1020C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25FF1020C5 (동일 폼 팩터 및 풋프린트) — 차이점: Package Type, Speed Grade, RoHS Status, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25FF1020C4
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX25DF1020C5
✅ 드롭인✓ 재고 있음
$1720 / 개
데이터시트 보기 →EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020C6
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →EP1SGX25DF1020C7
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →EP1SGX25FF1020C5 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements | 25,660 |
| LABs/CLBs | 2,566 |
| Total Memory Bits | 1,694,720 bits (1.69 Mbit) |
| Number of I/O | 607 |
| Supply Voltage (Core) | 1.5 V |
| Embedded PLLs | 6 |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| 동작 온도 | 0 C to 85 C (commercial) |
| Speed Grade | C5 |
| Package Type | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| 실장 유형 | Surface Mount |
| Lead Free | Yes |
| RoHS 상태 | Compliant |
| Configuration Modes | PS, PPS, FPP, JTAG |
| Design Tool | Quartus II / Quartus Prime |
EP1SGX25FF1020C5 fc-fbga-1020 (33 x 33 mm, 1 mm pitch) 핀 구성 가이드
EP1SGX25FF1020C5(fc-fbga-1020 (33 x 33 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25FF1020C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25FF1020C5 적합 용도: 6 애플리케이션s: 10 Gbps Network Interface Cards, SONET/SDH Framer and Mapper Equipment, SD/HD-SDI Video Routing and Processing, High-Speed Serial Backplane Bridging, DSP Co-Processing Cards, Industrial Protocol Bridge Gateways.
10 Gbps Network Interface Cards
The EP1SGX25FF1020C5 is well-suited to 10 Gbps network interface cards because its 20 embedded multi-gigabit transceivers (MGTs) up to 3.125 Gbps can be aggregated as XAUI or 10G-KR links via soft PCS logic. The 25,660 logic elements and 1.69 Mbit TriMatrix memory provide headroom for an inline packet processor plus classifier and policing tables, while 607 user I/O pins accept external DDR SDRAM and PCI-X buses. Quartus II IP cores deliver turnkey XAUI, SPI 4.2, and SGMII interfaces. Compared with discrete PHY plus CPLD designs, the integrated transceiver approach reduces BOM cost and PCB area.
추천
SONET/SDH Framer and Mapper Equipment
Telecom framer and mapper designs benefit from the EP1SGX25FF1020C5 because its hardware multipliers and TriMatrix memory deliver real-time Reed-Solomon and FEC processing at OC-192/STM-64 line rates. The 20 MGTs aggregate STS-1 tributaries at 51.84 Mbps into a 2.488 Gbps optical payload, eliminating external PHY chips. The 607 I/O pins accept backplane SERDES, TDM buses, and management Ethernet. Quartus II SOPC Builder provides OTN and SONET/SDH soft cores so designers can integrate framer, mapper, and overhead processor onto one silicon die, reducing board complexity and BOM.
추천
SD/HD-SDI Video Routing and Processing
Broadcast video routers and processing cards use the EP1SGX25FF1020C5 because the 607 user I/O pins accept dozens of SDI inputs while the 25,660 logic elements implement de-embedders, audio mixers, and on-screen display generators in a single device. The 130 nm CMOS core provides deterministic latency for audio/video synchronization, and TriMatrix memory buffers HD frames without external SRAM. Quartus II provides SMPTE 259M/292M/424M PHY IP and built-in SDI test pattern generators. Compared with ASIC-based routers, the FPGA approach allows rapid support for new formats like 1080p50/60 and 3G-SDI.
추천
High-Speed Serial Backplane Bridging
ATCA and MicroTCA backplanes route 3.125 Gbps serial links across multiple cards, and the EP1SGX25FF1020C5 provides up to 20 MGT channels with built-in 8b/10b encoding and clock-data recovery, eliminating external SERDES chips. The 25,660 logic elements implement a custom protocol layer such as Serial RapidIO, PCI Express Gen1, or proprietary fabric bridging. The 1020-ball FBGA exposes all MGT channels plus 607 user I/O for mezzanine cards, while 6 PLLs provide the multiple clock domains needed for asymmetric uplink/downlink configurations.
추천
DSP Co-Processing Cards
DSP co-processing accelerator cards use the EP1SGX25FF1020C5 because its embedded 18x18 multipliers deliver peak DSP throughput of 2.0 GMACs while the 1.69 Mbit TriMatrix memory provides double-buffered coefficient storage. PCI-X or SPI 4.2 host interfaces consume only a fraction of the 25,660 logic elements, leaving room for custom filter kernels. The 130 nm process provides deterministic DSP latency required for radar, sonar, and software-defined radio front-ends. Quartus II DSP Builder integrates with MATLAB/Simulink for floating-to-fixed point conversion and rapid kernel iteration.
추천
Industrial Protocol Bridge Gateways
Industrial gateway designs convert between PROFINET, EtherCAT, Modbus TCP, and CANopen protocols using the EP1SGX25FF1020C5 because its 607 user I/O pins accept multiple industrial field buses simultaneously and its 25,660 logic elements implement full protocol stacks without external CPUs. The 1.5V commercial temperature range (0 C to 85 C) covers most factory-floor cabinets, while industrial-grade parts like EP1SGX25FF1020I5N extend coverage to -40 C to 100 C. Quartus II Nios II soft-core integration allows custom deterministic scheduling for EtherCAT distributed clocks.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25FF1020C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25FF1020C4 | EP1SGX25DF1020C5 | EP1SGX25DF1020C5N | EP1SGX25DF1020C6 | EP1SGX25DF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | FC-FBGA-1020 (33x33 mm) | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C5 | C4 (slower) | C5 (same) | C5 (same) | C6 (faster) | C7 (fastest) |
| Die Revision | FF | FF (same) | DF (newer) | DF (newer) | DF (newer) | DF (newer) |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Lead-Free Terminal Finish | Yes | Yes | Yes | Yes (N suffix) | Yes | Yes |
주요 차별점
- C5 speed grade balances performance and yield (vs EP1SGX25DF1020C6)
- FF die revision is broadly available in franchised channel inventory (vs EP1SGX25DF1020C5N)
- 20 embedded MGTs eliminate external SERDES (vs EP1S40F1020C6)
설계 노트
The FC-FBGA-1020 package uses 1.0 mm ball pitch on a 33 x 33 mm body, which demands a high-density PCB stack-up with microvia or stacked-via technology. Per Altera Stratix GX Hardware Reference guidance, route all MGT (multi-gigabit transceiver) pairs on the top signal layer with continuous ground reference planes underneath, and keep MGT reference clock traces length-matched to within 100 mils. Allow at least four PCB layers dedicated to VCCINT core power with low-inductance decoupling (220 uF bulk + 0.1 uF + 0.01 uF ceramic per rail per Quartus II pin planning output).
Estimated: at full fabric utilization (25,660 LEs @ 75% toggle rate, 20 active MGTs @ 3.125 Gbps), the EP1SGX25FF1020C5 dissipates approximately 9-12 W. Without a heatsink or forced airflow, junction temperature can exceed 100 C in enclosed chassis. Stratix GX thermal management guidance recommends a minimum 200 LFM airflow, thermal vias under the central BGA ball array, and copper coin or heat-spreader bonded to the package top side. Always validate with the Quartus II PowerPlay early power estimator before committing to a mechanical design.
Three frequent pitfalls when designing with EP1SGX25FF1020C5: (1) connecting JTAG TRST directly to GND instead of a proper reset circuit - this can mask boundary-scan failures; (2) using the same reference clock for MGT and general fabric PLLs without proper isolation, causing jitter injection into the MGTs; (3) failing to decouple VCC_PLL1-VCC_PLL6 independently per Altera Stratix GX Hardware Reference - each PLL has its own analog supply pin that must be filtered with a ferrite bead and 0.1 uF + 10 uF bypass network. Always generate pin assignments through Quartus II Pin Planner to avoid these errors.
규정 준수 정보
RoHS compliant per Altera/Intel product family documentation (lead-free BGA balls). Not AEC-Q100 qualified - commercial temperature range only. REACH compliance assumed from manufacturer disclosure but not separately documented in web data.
