EP1SGX25FF1020I6N - Stratix GX FPGA, 25K LE, 607 I/O | Altera EP1SGX25FF1020I6N da Altera - componente eletrônico
Altera

EP1SGX25FF1020I6N - Stratix GX FPGA, 25K LE, 607 I/O | Altera

N.º da peça: EP1SGX25FF1020I6N ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
1.425 V to 1.575 V Vdss 1020-BBGA, FCBGA Package 6 Speed
A partir de $145 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-07
Preços por volume
Qtd. Preço unitário Total
1 $285 $285,00
10 $245 $2.450,00
50 $215 $10.750,00
100 $185 $18.500,00
500 $160 $80.000,00
1.000 $145 $145.000,00
ℹ️ Todos os preços estão em USD
Ver datasheet (PDF) Ver alternativas

EP1SGX25FF1020I6N Visão geral

The Altera (Intel) EP1SGX25FF1020I6N is a Stratix GX family Field-Programmable Gate Array delivering 25,660 logic elements, 1,944,576 bits of embedded RAM, and 607 user I/O pins in a 1020-ball FC-BGA package. It is a high-end transceiver-equipped FPGA targeting high-speed serial I/O designs and operates from a 1.425V to 1.575V core supply, fabricated on a 0.13 µm process node optimized for low-jitter gigabit serial links.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (software-defined, lower throughput). They are programmable in the field, allowing engineers to implement custom digital logic, parallel datapaths, and high-speed interfaces without fabricating a custom silicon device. In the broader taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor -> integrated circuit.

Key specifications of the EP1SGX25FF1020I6N include 2,566 LABs/CLBs, dedicated high-speed transceivers (GX family designation), embedded multiplier blocks for DSP, and 1,944,576 bits of total RAM. The device supports up to 607 user I/O across multiple I/O banks supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Industrial temperature grade (-40 °C to +100 °C case) is denoted by the "I" speed-grade suffix, and the "6" speed grade balances timing margin against Fmax performance.

Architecturally, Stratix GX FPGAs integrate hardened multi-gigabit transceivers (MGTs) capable of serial rates from 622 Mbps up to 3.125 Gbps per channel, suitable for PCIe, Gigabit Ethernet, Serial RapidIO, and custom serial protocols. The TriMatrix memory architecture provides three block RAM sizes (512, 4 Kb, and 512 Kb MRAM) and the DSP blocks deliver up to 224 18×18-bit multipliers. The 33×33 mm FC-BGA package uses flip-chip solder-bump connections to the PCB for high-pin-count, high-frequency signal integrity.

Typical applications include high-speed serial interface bridging (PCIe Gen1, XAUI, Serial RapidIO), telecom line-card datapath processing, broadcast video processing engines, and military/aerospace signal processing subsystems where the industrial temperature grade is required. The combination of transceiver channels and substantial logic density also suits storage area network (SAN) controllers and ASIC prototyping platforms.

When designing with this FPGA, careful power-rail sequencing and decoupling are critical because the core, PLL, and transceiver supplies each require independent filtering. Use the Quartus II design suite (the Altera-supported toolchain for this family) and ensure JTAG programming access is routed to a stable header for in-system updates.

This page synthesizes distributor pricing, drop-in Altera/Intel pin-compatible variants, and practical design notes not found in the manufacturer datasheet alone.

Alternativas drop-in para EP1SGX25FF1020I6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP1SGX25FF1020I6N (mesmo formato e footprint) — diferindo em Speed Grade, Operating Temperature, Package, RoHS Status, Mounting Type.

Intel
Operating Temperature: 0 °C to 85 °C (industrial)
RoHS Status: Compliant (per distributor data)
Comparar com EP1SGX25FF1020I6N →
Intel
Operating Temperature: 0 °C to +85 °C (industrial)
Package: 1020-ball FC-FBGA, 33 mm × 33 mm, 1.0 mm pitch
RoHS Status: Compliant
Comparar com EP1SGX25FF1020I6N →
Intel
Mounting Type: Surface Mount
Comparar com EP1SGX25FF1020I6N →
Intel
Speed Grade: C5 (approx. 500 MHz internal clock)
Operating Temperature: 0 °C to 85 °C (commercial)
Comparar com EP1SGX25FF1020I6N →
Intel
Speed Grade: C6
Operating Temperature: 0 °C to 85 °C (commercial)
Package: 1020-ball FC-FBGA, 33 x 33 mm, 1 mm pitch
Comparar com EP1SGX25FF1020I6N →
Intel
Speed Grade: 7 (commercial)
Operating Temperature: 0 C to 85 C (TJ, commercial)
Package: 1020-BBGA, FC-FBGA (33 x 33 mm, 1 mm pitch)
Comparar com EP1SGX25FF1020I6N →
Altera
Speed Grade: 5
Package: FBGA-1020 (33 x 33 mm, 1.00 mm pitch)
RoHS Status: Compliant (per digchip)
Comparar com EP1SGX25FF1020I6N →
Altera
Speed Grade: 7 (highest production grade)
Package: FC-FBGA-1020 (Flip-Chip Fine-pitch BGA)
Mounting Type: Surface Mount (FC-FBGA)
Comparar com EP1SGX25FF1020I6N →
Intel
Mounting Type: Surface Mount (BGA)
Comparar com EP1SGX25FF1020I6N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP1SGX25FF1020I5N

✅ Drop-In ⚠️ Especificações não verificadas
Altera
📦 1020-FBGA (33x33)
Stratix GX · EP1SGX25 · 25,660 · 2,566 · 130 nm CMOS · 1.5 V · Industrial (I)

✓ Em estoque

$2050 / unidade

Ver ficha técnica →

EP1SGX25FF1020I7N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 1020-FBGA (33x33)
Stratix GX · CMOS · 25,660 · 2,566 · 130 nm · 1.5 V · 1020 · Ball

✓ Em estoque

$98.5 / unidade

Ver ficha técnica →

EP1SGX25FF1020C6N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 1020-FBGA (33x33)
Stratix GX · Stratix · 25 660 · 2566 · 607 · 1020-ball FC-FBGA, 33 x 33 mm, 1 mm pitch · 1.5 V · CMOS

✓ Em estoque

$160 / unidade

Ver ficha técnica →

EP1SGX25FF1020C7N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 1020-FBGA (33x33)
Stratix GX · Stratix · 25,660 · 2,566 · 1,944,576 · 607 · 1.5 V (1.425 V to 1.575 V)

✓ Em estoque

$62.5 / unidade

Ver ficha técnica →

EP1SGX25FF1020C5N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 1020-FBGA (33x33)
Stratix GX · Stratix GX (Stratix I GX) · Intel (formerly Altera) · 25,660 · 2,566 · 607 · 130 nm CMOS · 1.5 V

✓ Em estoque

$1580 / unidade

Ver ficha técnica →

EP1SGX25DF1020I6N

✅ Drop-In
Intel
📦 1020-FBGA (33x33)
Stratix GX · EP1SGX25 · 25,660 · 2,566 · 607 · 130 nm CMOS · 1.425 V to 1.575 V (1.5 V nominal)

✓ Em estoque

$165 / unidade

Ver ficha técnica →

EP1SGX25DF1020I5N

✅ Drop-In
Intel
📦 1020-FBGA (33x33)
Stratix GX (FPGA) · 130 nm CMOS · 25,660 · 1.5 V · 0 °C to 85 °C (industrial) · FC-FBGA (Flip-Chip FineLine BGA) · 1,020 · 33 × 33 mm, 1.0 mm pitch

✓ Em estoque

$985 / unidade

Ver ficha técnica →

EP1SGX25DF1020I7N

✅ Drop-In
Intel
📦 1020-FBGA (33x33)
Stratix GX · EP1SGX25 · 25,660 · 2,566 · 4385.97 MHz · 130 nm · 1.5 V · 1020

✓ Em estoque

Consulte o preço

Ver ficha técnica →

EP1SGX25FF1020I6N Classificações máximas e características elétricas

Manufacturer Altera (Intel)
Series Stratix GX
Family Stratix GX FPGA
Logic Elements (LE) 25,660
Number of LABs/CLBs 2,566
Total RAM Bits 1,944,576
User I/O Count 607
Supply Voltage - Core 1.425 V to 1.575 V
Temperatura de operação -40 °C to +100 °C (Industrial)
Tipo de montagem Surface Mount
Encapsulamento / Caixa 1020-BBGA, FCBGA
Supplier Device Package 1020-FBGA (33x33)
Speed Grade 6
Process Node 0.13 µm
Embedded Transceivers Stratix GX multi-gigabit transceivers (MGTs)

Guia de Configuração de Pinos do EP1SGX25FF1020I6N 1020-fbga (33x33)

Configuração de pinos para EP1SGX25FF1020I6N (pacote 1020-fbga (33x33)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 1020-fbga (33x33) para EP1SGX25FF1020I6N

Nenhum dado detalhado de pinagem disponível para EP1SGX25FF1020I6N.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

EP1SGX25FF1020I6N é adequado para 6 aplicaçãos: High-Speed Serial Interface Bridging, Telecom Line-Card Datapath Processing, Broadcast Video Processing Engines, Military / Aerospace Signal Processing, Storage Area Network (SAN) Controllers, ASIC Prototyping Platforms.

🌐

High-Speed Serial Interface Bridging

The EP1SGX25FF1020I6N's hardened Stratix GX multi-gigabit transceivers (MGTs) support serial rates from 622 Mbps up to 3.125 Gbps per channel, making it ideal for bridging protocols such as PCI Express Gen1 (2.5 Gbps), XAUI (3.125 Gbps), Serial RapidIO, and Gigabit Ethernet. The 25,660 logic elements provide ample datapath processing to implement MAC, PCS, and protocol state machines alongside the physical layer. With 607 user I/O and multiple I/O banks, the FPGA can simultaneously drive multiple parallel interfaces (LVDS, LVTTL) while the MGTs handle serial links.

Recomendado

EP1SGX25DF1020I6N · Intel EP1SGX25FF1020C6N · Intel
🌐

Telecom Line-Card Datapath Processing

The EP1SGX25FF1020I6N delivers 25K logic elements and 1.86 Mbit of TriMatrix embedded RAM, supporting telecom line-card functions such as packet classification, traffic shaping, and QoS scheduling. Its industrial temperature range (-40 °C to +100 °C) enables deployment in outdoor and uncontrolled thermal environments typical of central-office racks. The DSP multiplier blocks (up to 224 18×18-bit multipliers) accelerate FEC, encryption, and DSP front-end processing for wireless base stations.

Recomendado

EP1SGX25FF1020I5N · Altera EP1SGX25FF1020I7N · Intel
📺

Broadcast Video Processing Engines

With 607 user I/O and substantial embedded RAM, the EP1SGX25FF1020I6N excels in broadcast video processing where multiple parallel video streams (SDI, DVB-ASI, HDMI) must be muxed, scaled, and processed in real time. The TriMatrix block RAM supports line buffers and frame buffers for video format conversion, while the DSP blocks accelerate chroma keying, scaling filters, and deinterlacing. The 1.5 V core and 1020-FBGA package are typical of high-end video-processing boards.

Recomendado

EP1SGX25DF1020C6N · Intel EP1SGX25CF672C6 · Intel
✈️

Military / Aerospace Signal Processing

The industrial temperature grade of the EP1SGX25FF1020I6N (-40 °C to +100 °C) and Altera's heritage in defense/aerospace programs make this FPGA suitable for radar signal processing, electronic warfare subsystems, and avionics datalinks. Its hardened transceivers support ruggedized serial datalinks while the 25K logic capacity handles beamforming, FFT preprocessing, and I/Q demodulation. Conformal coating and BGA under-fill are recommended for shock/vibration environments.

Recomendado

EP1SGX25FF1020I7N · Intel EP1SGX25DF672I6N · Intel
🖥️

Storage Area Network (SAN) Controllers

The EP1SGX25FF1020I6N's embedded multi-gigabit transceivers combined with 25K logic elements provide the foundation for Fibre Channel and SAS/SATA storage controllers. The device's protocol-rich I/O can simultaneously drive 4 Gbps Fibre Channel links, multiple SATA ports, and management interfaces. Its embedded RAM supports command queuing, scatter-gather DMA descriptors, and parity-check buffering at line-rate.

Recomendado

EP1SGX25FF1020C5N · Intel EP1SGX25DF1020I6N · Intel
🧩

ASIC Prototyping Platforms

Engineers use the EP1SGX25FF1020I6N on ASIC prototyping platforms because its 25K logic elements, hard transceivers, and high I/O count closely emulate complex ASIC designs before tape-out. Multiple FPGAs can be bridged via the MGTs to partition large ASIC designs across chips. Quartus II's incremental compilation and LogicLock regions enable ASIC-style design partitioning, accelerating prototype bring-up and pre-silicon software development.

Recomendado

EP1SGX25FF1020I5N · Altera EP1SGX25FF1020I7N · Intel

Resumo dos produtos recomendados

EP1SGX25DF1020I6N Intel Usado em: High-Speed Serial Interface Bridging, Storage Area Network (SAN) Controllers EP1SGX25FF1020C6N Intel Usado em: High-Speed Serial Interface Bridging EP1SGX25FF1020I5N Altera Usado em: Telecom Line-Card Datapath Processing, ASIC Prototyping Platforms EP1SGX25FF1020I7N Intel Usado em: Telecom Line-Card Datapath Processing, Military / Aerospace Signal Processing, ASIC Prototyping Platforms EP1SGX25DF1020C6N Intel Usado em: Broadcast Video Processing Engines EP1SGX25CF672C6 Intel Usado em: Broadcast Video Processing Engines EP1SGX25DF672I6N Intel Usado em: Military / Aerospace Signal Processing EP1SGX25FF1020C5N Intel Usado em: Storage Area Network (SAN) Controllers
What is the logic element count of the EP1SGX25FF1020I6N?
The EP1SGX25FF1020I6N contains 25,660 logic elements (LEs) organized into 2,566 LABs/CLBs. According to the Stratix GX Device Family Data Sheet (Section I, Altera Corporation), this places it in the mid-density tier of the Stratix GX family, offering substantial logic capacity combined with embedded multi-gigabit transceivers for high-speed serial I/O designs.
Is the EP1SGX25FF1020I6N still in production?
No, the EP1SGX25FF1020I6N is obsolete and no longer manufactured by Altera/Intel. Distributors such as Rochester Electronics carry remaining stock and franchise inventory. For new designs, consider Stratix IV GX (EP4SGX) or Cyclone IV GX families as modern equivalents, or use the same Altera/Intel part for legacy system maintenance.
What is the package of the EP1SGX25FF1020I6N?
The EP1SGX25FF1020I6N comes in a 1020-ball FineLine BGA (FC-BGA) measuring 33×33 mm. The package uses flip-chip solder-bump technology for high pin count and superior electrical performance at multi-gigahertz frequencies. The 1020-BBGA designation specifies the case outline per JEDEC registration.
Where can I download the EP1SGX25FF1020I6N datasheet PDF?
The official datasheet for EP1SGX25FF1020I6N is the Stratix GX Device Family Data Sheet (Section I) published by Altera Corporation. It can be downloaded from Alldatasheet (272 pages) or accessed via Octopart's datasheet portal linked to the Altera document repository. Always refer to Section I for device specifications and Section II for electrical and timing characteristics.
What is the difference between EP1SGX25FF1020I6N and EP1SGX25DF1020I6N?
Both are Stratix GX family FPGAs with the same 25K logic-element density, but the EP1SGX25FF1020I6N has the 1020-FBGA 33×33 mm package while the EP1SGX25DF1020I6N typically comes in a 1020-pin FBGA variant. The two are pin-compatible on the same board only if the package code suffix matches; verify mechanical drawings before substituting in PCB layouts.
What is the operating voltage of EP1SGX25FF1020I6N?
The EP1SGX25FF1020I6N operates with a core supply voltage of 1.425 V to 1.575 V (typical 1.5 V). According to the Altera datasheet, the device also requires separate PLL analog supplies (typically 1.5 V filtered) and I/O bank supplies (1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on I/O standard). Proper power sequencing between these rails is required at power-up.
How much embedded memory does EP1SGX25FF1020I6N have?
The EP1SGX25FF1020I6N contains 1,944,576 bits (approximately 1.86 Mbit) of total embedded RAM, distributed across TriMatrix memory blocks in three sizes (M512, M4K, M-RAM). This memory can be configured as dual-port RAM, FIFO buffers, or shift registers to support datapath buffering in DSP and packet-processing applications.
What is the price of EP1SGX25FF1020I6N?
As of 2026-09-07, the EP1SGX25FF1020I6N is listed at approximately $285 per unit at qty-1 from authorized distributors (DigiKey, Arrow, Rochester Electronics). Higher-volume pricing drops to roughly $145 per unit at qty-1000. Because the part is obsolete, pricing is highly volatile and depends on remaining franchise stock.
Is the EP1SGX25FF1020I6N in stock?
Stock availability for the obsolete EP1SGX25FF1020I6N is limited to remaining distributor franchise inventory. Rochester Electronics and a few authorized Altera distributors typically hold small quantities. For volume requirements, contact Rochester Electronics directly or consider migrating to a modern Stratix IV/10-series equivalent.
What is the lead time for EP1SGX25FF1020I6N orders?
Lead time for the obsolete EP1SGX25FF1020I6N varies by distributor and quantity. As of 2026-09-07, small-quantity orders (≤100 units) typically ship within 2-4 weeks from in-stock franchise inventory, while larger orders may require 8-12 weeks or longer due to limited production remaining. Always confirm lead time with the distributor before placing volume orders.
What is the best drop-in replacement for EP1SGX25FF1020I6N?
The best drop-in replacement for the EP1SGX25FF1020I6N (industrial temperature, speed grade 6) is the EP1SGX25FF1020I5N (same package, slower speed grade) or EP1SGX25FF1020I7N (same package, faster speed grade) from Altera/Intel. For modern migration, the Stratix IV GX EP4SGX230KF40I3N is the recommended replacement in a different package, requiring PCB rework.
What is the difference between EP1SGX25 and EP1S25 Stratix FPGAs?
The EP1SGX25 is a member of the Stratix GX family which adds embedded multi-gigabit transceivers (MGTs), while the EP1S25 belongs to the base Stratix family without hardened transceivers. Both share 25K logic-element density but the GX variant is preferred for designs with high-speed serial I/O. They are not pin-compatible because the transceiver pins are mapped differently.
Can the EP1SGX25FF1020I6N be replaced by a Xilinx FPGA?
No drop-in cross-brand Xilinx equivalent exists for the EP1SGX25FF1020I6N because the 1020-FBGA pinout is Altera-specific. A Xilinx Virtex-II Pro or Virtex-4 FX device with comparable logic and transceiver count would require a full PCB redesign, firmware porting from Quartus II to ISE/Vivado, and verification of all timing constraints.
Is the EP1SGX25FF1020I6N suitable for PCIe Gen1 designs?
Yes, the EP1SGX25FF1020I6N supports PCIe Gen1 (2.5 Gbps) through its embedded Stratix GX MGTs and the Altera PCIe hard IP core. The device has sufficient transceiver channels and logic density for endpoint or root-complex implementations. Quartus II includes a complete PCIe development kit with reference designs for this device.
What design software supports EP1SGX25FF1020I6N?
The EP1SGX25FF1020I6N is supported by Altera Quartus II Design Software (versions 9.0 and later, up to Quartus II v13.1 which was the last version to officially support Stratix GX). For legacy maintenance, the older Quartus II Service Packs remain available from Intel's FPGA software archive. Synthesis tools include Synplify and Precision RTL Plus.

Dados de referência de engenharia para EP1SGX25FF1020I6N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP1SGX25FF1020I6N when designing new Stratix GX-based systems requiring industrial temperature operation and a balanced speed-grade 6 Fmax. For cost-driven designs in controlled environments, downgrade to the commercial-temperature EP1SGX25FF1020C6N to save 15-20% on unit cost. For higher performance where the fastest Fmax matters, use the EP1SGX25FF1020I7N. For lower-power or cost-sensitive prototypes, the EP1SGX25FF1020I5N (speed grade 5) provides the same logic and transceiver resources at slower timing. Because all listed variants share the 1020-FBGA (33x33) footprint, PCB layout reuse is straightforward across the family - only the FPGA programming file changes for each speed/temperature code.

Comparação com alternativas

Parâmetro Este produto EP1SGX25FF1020I5N EP1SGX25FF1020I7N EP1SGX25FF1020C6N EP1SGX25DF1020I6N
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 1020-FBGA (33x33) 1020-FBGA (33x33) - same 1020-FBGA (33x33) - same 1020-FBGA (33x33) - same 1020-FBGA (33x33) - same
Logic Elements 25,660 25,660 - same die 25,660 - same die 25,660 - same die 25,660 - same die
Speed Grade 6 5 (slower) 7 (faster) 6 6
Temperature Grade Industrial (-40C to +100C) Industrial Industrial Commercial (0C to +85C) Industrial
User I/O Count 607 607 607 607 607
Total RAM Bits 1,944,576 1,944,576 1,944,576 1,944,576 1,944,576
Embedded Transceivers Yes (Stratix GX MGTs) Yes (same) Yes (same) Yes (same) Yes (same)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

Principais diferenciais

  • Speed grade 6 offers balanced timing margin for industrial applications (vs EP1SGX25FF1020I5N)
  • Industrial temperature grade supports -40C to +100C operation (vs EP1SGX25FF1020C6N)
  • FF variant designation with hardened Stratix GX transceivers (vs EP1SGX25DF1020I6N)

Notas de projeto

The EP1SGX25FF1020I6N requires multiple independent supply rails: VCCINT (1.425-1.575 V core), VCCIO (per-bank, 1.2 V to 3.3 V), VCCA_PLL (1.5 V analog, filtered), and VCCAUX (2.5 V or 3.3 V auxiliary). Implement a controlled power-on sequence (VCCINT first, then VCCIO, then VCCAUX) using a sequencing controller such as the LTC2923 or TI UCD90124 to prevent latch-up. Bulk decoupling of 22 µF polymer + 1 µF ceramic + 0.1 µF ceramic per supply pin is recommended.

The industrial-grade EP1SGX25FF1020I6N is rated for case temperatures up to +100 °C. At 25K LE utilization with active MGTs, typical junction-to-ambient thermal resistance θJA for the 1020-FBGA package on a JEDEC 4-layer test board is approximately 12-15 °C/W. Estimated: at 5 W total power dissipation, junction temperature rise above ambient is 60-75 °C, leaving 25-40 °C margin at 100 °C case. For sealed enclosures, derate by 30% or add a heatsink with thermal interface material.

The 1020-FBGA 33×33 mm package uses 1.0 mm pitch solder balls. PCB design must follow JEDEC MS-034 for flip-chip BGA land pattern and solder mask defined (SMD) pads are recommended over non-solder mask defined (NSMD) for higher assembly yield. Use microvia-in-pad technology (0.1 mm laser vias) under center balls for breakout routing. Maintain differential pair length matching within 5 mils for MGT serial links and route each differential pair on a single layer with reference ground planes on adjacent layers.

Do not use the JTAG pins (TCK, TMS, TDI, TDO) as general-purpose I/O after configuration - they revert to JTAG mode whenever nCONFIG goes low, causing in-system reprogramming issues. Do not apply 3.3 V to a 2.5 V or 1.8 V VCCIO bank without level-shifting buffers. Verify all I/O bank voltages before connecting peripheral devices, and never mix 5 V tolerant and non-5 V tolerant I/O standards on the same bank.

Isolate MGT transceiver analog power and grounds from digital I/O regions using a split-plane or guarded layout. Place MGT decoupling capacitors as close to their respective VCCMGT and GND pins as possible (≤100 mils). For 3.125 Gbps signals, maintain 50 Ω single-ended or 100 Ω differential controlled impedance with 6-8 mil trace width on standard FR-4 stack-ups, and avoid 90-degree bends - use 45-degree or curved traces only.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

RoHS/REACH compliance not confirmed from the provided search snippets; refer to original Altera product declaration. The device is industrial temperature grade but not AEC-Q100 qualified (FPGA, not a discrete automotive IC).

Dados verificados em: 2026-09-07 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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