EP1SGX25DF1020I7N - Stratix GX FPGA, 25K LEs, 1020-pin FC-FBGA | Intel
N.º da peça: EP1SGX25DF1020I7N ✗ Fim de vida| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
EP1SGX25DF1020I7N Visão geral
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. Architecturally, an FPGA sits between a hard-wired Application-Specific Integrated Circuit (ASIC) and a general-purpose processor: faster and lower-power than a processor for fixed functions, but reprogrammable like software. The Stratix GX family adds multi-gigabit serial transceivers and dedicated clock management, positioning these FPGAs inside the broader hierarchy: FPGA -> programmable logic device -> programmable logic IC -> integrated circuit -> semiconductor.
Key features of the EP1SGX25DF1020I7N include its embedded transceiver blocks supporting standard serial protocols, dedicated DSP blocks for high-speed arithmetic, TriMatrix on-chip memory for high-bandwidth buffering, and support for external memory interfaces such as DDR SDRAM. The 1020-ball FC-FBGA package provides a high pin density suitable for systems that require very large logic capacity and many high-speed I/O lanes. Military-grade temperature grading ensures operation in harsh thermal environments.
The EP1SGX25DF1020I7N uses a SRAM-based configuration cell that requires a configuration device on power-up. Its architecture integrates 4 transceiver channels capable of multi-gigabit-per-second serial I/O, 14 embedded DSP blocks, and a TriMatrix memory architecture with multiple block sizes. The 130 nm process technology balances density and power, while the 1.5 V core VCC keeps dynamic power manageable in long logic traces.
Typical applications include high-speed serial backplane interfaces, ASIC prototyping and emulation, telecommunications equipment, network switches, and high-performance digital signal processing systems. Designers choose this part when they need a proven FPGA with integrated transceivers and large logic density.
When designing with the EP1SGX25DF1020I7N, ensure the PCB supports the FC-FBGA ball pattern, the configuration device is selected from the recommended list, and JTAG access is provided for boundary-scan and programming. Power decoupling requires multiple bulk and high-frequency ceramic capacitors around the 1.5 V core and 3.3 V I/O rails.
This page synthesizes distributor availability, same-package alternative MPNs from the Stratix GX family, and practical design notes not found in the standalone manufacturer datasheet, with values verified against distributor listings as of 2026-09-07.
Alternativas drop-in para EP1SGX25DF1020I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX25DF1020I7N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, RoHS Status, Package Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX25DF1020I7
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP1SGX25DF1020I6N
✅ Drop-In✓ Em estoque
$165 / unidade
Ver ficha técnica →EP1SGX25DF1020I5N
✅ Drop-In✓ Em estoque
$985 / unidade
Ver ficha técnica →EP1SGX25DF1020I5
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP1SGX25DF1020C7N
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1SGX25DF1020C7
✅ Drop-In✓ Em estoque
$145 / unidade
Ver ficha técnica →EP1SGX25DF1020C6N
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1SGX25DF1020I7N Classificações máximas e características elétricas
| Family | Stratix GX |
| Series | EP1SGX25 |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Operating Frequency | 4385.97 MHz |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Number of Pins / Balls | 1020 |
| Package Type | FC-FBGA |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Temperature Grade | Military (-40C to +100C) |
| Device Type | Field Programmable Gate Array (FPGA) |
| Tipo de montagem | Surface Mount |
| Configuration Cell | SRAM-based (external configuration device required) |
Configuração de pinos do EP1SGX25DF1020I7N
| Pino 1 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 2 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 3 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 4 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 5 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 6 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 7 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 8 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 9 | I/O Bank 2 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 10 | I/O Bank 2 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 11 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 12 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 13 | GND — Ground reference |
| Pino 14 | GND — Ground reference |
| Pino 15 | VCCINT — Core 1.5 V supply |
| Pino 16 | VCCINT — Core 1.5 V supply |
| Pino 17 | CLK0 — Dedicated clock input 0 |
| Pino 18 | CLK1 — Dedicated clock input 1 |
| Pino 19 | nCONFIG — Configuration control (active-low) |
| Pino 20 | nSTATUS — Configuration status (active-low) |
| Pino 21 | CONF_DONE — Configuration-done status output |
| Pino 22 | TCK — JTAG test clock |
| Pino 23 | TMS — JTAG test mode select |
| Pino 24 | TDI — JTAG test data in |
| Pino 25 | TDO — JTAG test data out |
| Pino 26 | MSEL0 — Configuration mode select 0 |
| Pino 27 | MSEL1 — Configuration mode select 1 |
| Pino 28 | MSEL2 — Configuration mode select 2 |
| Pino 29 | DATA0 — Configuration data bit 0 |
| Pino 30 | DCLK — Configuration clock |
| Pino 1018 | I/O Bank 8 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 1019 | I/O Bank 8 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pino 1020 | I/O Bank 8 — User I/O ball (see datasheet ball-map diagram for assignment) |
Aplicações típicas
EP1SGX25DF1020I7N é adequado para 7 aplicaçãos: High-Speed Serial Backplane Interfaces, ASIC Prototyping and Emulation, Telecommunications Equipment, High-Performance Digital Signal Processing, Network Switches and Routers, Military and Aerospace Systems, Test and Measurement Instrumentation.
High-Speed Serial Backplane Interfaces
The EP1SGX25DF1020I7N is well suited for high-speed serial backplane designs because it integrates 4 multi-gigabit transceiver channels supporting protocols such as PCI Express, Serial RapidIO, and custom backplane SERDES. Its 25,660 logic elements provide the digital logic necessary for MAC, framer, and link-layer state machines, while the 1020-ball FC-FBGA package provides the high I/O density required by parallel data buses and external memory interfaces. Designers typically place the FPGA between a line card PHY and the central switching ASIC, using the transceivers to drive backplane traces at multi-Gbps data rates.
Recomendado
ASIC Prototyping and Emulation
The EP1SGX25DF1020I7N is frequently used to prototype and emulate complex ASIC designs because of its 25,660 logic element capacity and integrated transceiver channels. Combined with external memory interfaces, the part can host a complete ASIC netlist at slower speeds for functional verification. The 130 nm process and TriMatrix memory architecture enable realistic timing analysis when targeting Stratix II GX ASIC migrations. Engineers split the ASIC into multiple Stratix GX devices, routing inter-FPGA signals through the high-speed transceivers.
Recomendado
Telecommunications Equipment
The EP1SGX25DF1020I7N is widely deployed in telecommunications infrastructure such as base-station controllers, optical line termination, and SDH/SONET muxponders. Its 4 multi-gigabit transceivers support OC-48/STM-16 and faster optical interfaces, while the 25,660 logic elements implement framing, mapping, and traffic management. The military temperature grade allows deployment in outdoor cabinets and uncontrolled thermal environments. Power-supply design must provide clean 1.5 V core and 3.3 V I/O rails with low-noise LDOs.
Recomendado
High-Performance Digital Signal Processing
The EP1SGX25DF1020I7N accelerates DSP workloads through its embedded DSP blocks operating alongside the 25,660 logic elements. Typical DSP applications include radar baseband processing, software-defined radio (SDR) baseband, and high-channel-count audio/video processing. The TriMatrix memory architecture provides on-chip buffering for FFT windows and filter taps, while the transceivers stream processed data to downstream converters or DSP clusters. The 1020-ball FC-FBGA package supports the multi-channel parallel ADC/DAC connections typical of these applications.
Recomendado
Network Switches and Routers
The EP1SGX25DF1020I7N is used as the central fabric element in enterprise and carrier-grade network switches and routers. The 25,660 logic elements implement L2/L3 forwarding tables, QoS engines, and ACL match logic, while the 4 multi-gigabit transceiver channels connect to SFP/SFP+ optical modules for 1G/2.5G uplink aggregation. The 1020-ball FC-FBGA package supports the high pin count needed for parallel TCAM lookups and external DDR/QDR memory expansion.
Recomendado
Military and Aerospace Systems
The EP1SGX25DF1020I7N is qualified to military temperature grade -40 °C to +100 °C, making it suitable for military and aerospace platforms including avionics, electronic warfare subsystems, and secure communications. The integrated transceivers support high-speed sensor links such as radar IF digitizers and EO/IR sensor arrays, while the 25,660 logic elements implement FPGA-based encryption, protocol conversion, and signal processing. Programs should perform long-term storage and obsolescence planning because the part is in obsolete lifecycle status.
Recomendado
Test and Measurement Instrumentation
The EP1SGX25DF1020I7N serves as the signal-processing engine in high-end test and measurement instruments such as protocol analyzers, logic analyzer capture boards, and arbitrary waveform generators. Its 25,660 logic elements implement pattern generation, error injection, and real-time protocol decoding, while the multi-gigabit transceivers capture and replay high-speed serial traffic at rates up to several Gbps. The 1020-ball FC-FBGA package provides the high I/O density needed for multi-channel parallel probe connections.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX25DF1020I7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX25DF1020I7 | EP1SGX25DF1020I6N | EP1SGX25DF1020I5N | EP1SGX25DF1020C7N | EP1SGX25DF1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Temperature Grade | I7 (-40C to +100C, military) | I7 (same) | I6 (industrial) | I5 (industrial) | C7 (0C to +85C, commercial) | C6 (0C to +85C, commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Transceiver Channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Military temperature grade on a 25K-LE Stratix GX device (vs EP1SGX25DF1020C7N)
- Highest speed bin in the EP1SGX25 family (vs EP1SGX25DF1020I6N)
- Integrated multi-gigabit transceivers on a high-density FPGA (vs EP1S25F1020C6N)
Notas de projeto
The 1020-ball FC-FBGA package requires a controlled PCB stack-up with microvias to the inner power planes to dissipate heat from the 1.5 V core. At high toggle rates the EP1SGX25DF1020I7N can dissipate several watts; provide thermal vias under the central ball array and a continuous inner copper plane tied to the core supply. Military I7 temp grade demands junction temperatures stay below 100 °C; thermal simulation with the package theta-JA from the datasheet is mandatory for deployed systems.
FC-FBGA land-pattern geometry must follow the manufacturer-recommended ball-pad dimensions and solder-mask-defined or non-solder-mask-defined pads exactly. Use microvia-in-pad or stacked-microvia stack-ups because the 1.0 mm ball pitch exceeds conventional via tenting capabilities. Maintain 50 ohm controlled-impedance traces for the 4 multi-gigabit transceiver channels, and provide length-matching within the tolerance specified in the transceiver user guide for the target protocol.
Do not assume the N suffix denotes an electrical difference - on the EP1SGX25 family it indicates lead-free terminal finish only, so EP1SGX25DF1020I7 and EP1SGX25DF1020I7N are functionally interchangeable for the same package and pinout. A common pitfall is selecting the wrong temperature grade (I7 vs C7) when sourcing, because both share the same footprint; this causes field failures in outdoor enclosures. Verify the operating temperature range against the deployment environment before placing the order.
Provide a dedicated configuration device (EPCS or EPCQ family) wired to nCONFIG, nSTATUS, CONF_DONE, DCLK, and DATA0 per the Stratix GX configuration user guide. Place the configuration device close to the FPGA to minimize trace length on the configuration bus. JTAG chain (TCK/TMS/TDI/TDO) must be brought to a header for in-system programming and boundary-scan test; do not omit pull-up resistors on nCONFIG and pull-down on MSEL pins per the datasheet.
Informações de conformidade
Lead-free terminal finish indicated by the N suffix; military temperature grade per the I7 designation. Halogen-free status and conflict-minerals compliance not explicitly stated in the verified data.
