EP1SGX25FF1020I6N - Stratix GX FPGA, 25K LE, 607 I/O | Altera
MPN: EP1SGX25FF1020I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $215 | $10,750.00 |
| 100 | $185 | $18,500.00 |
| 500 | $160 | $80,000.00 |
| 1,000 | $145 | $145,000.00 |
Drop-in alternatives for EP1SGX25FF1020I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25FF1020I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2050 / Unit
View Datasheet →EP1SGX25FF1020I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$98.5 / Unit
View Datasheet →EP1SGX25FF1020C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$160 / Unit
View Datasheet →EP1SGX25FF1020C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$62.5 / Unit
View Datasheet →EP1SGX25FF1020C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1580 / Unit
View Datasheet →EP1SGX25DF1020I6N
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP1SGX25DF1020I5N
✅ Drop-In✓ In Stock
$985 / Unit
View Datasheet →EP1SGX25DF1020I7N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1SGX25FF1020I6N Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel) |
| Series | Stratix GX |
| Family | Stratix GX FPGA |
| Logic Elements (LE) | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 607 |
| Supply Voltage - Core | 1.425 V to 1.575 V |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Mounting Type | Surface Mount |
| Package / Case | 1020-BBGA, FCBGA |
| Supplier Device Package | 1020-FBGA (33x33) |
| Speed Grade | 6 |
| Process Node | 0.13 µm |
| Embedded Transceivers | Stratix GX multi-gigabit transceivers (MGTs) |
EP1SGX25FF1020I6N 1020-fbga (33x33) Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020I6N (1020-fbga (33x33) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020I6N is suitable for 6 applications: High-Speed Serial Interface Bridging, Telecom Line-Card Datapath Processing, Broadcast Video Processing Engines, Military / Aerospace Signal Processing, Storage Area Network (SAN) Controllers, ASIC Prototyping Platforms.
High-Speed Serial Interface Bridging
The EP1SGX25FF1020I6N's hardened Stratix GX multi-gigabit transceivers (MGTs) support serial rates from 622 Mbps up to 3.125 Gbps per channel, making it ideal for bridging protocols such as PCI Express Gen1 (2.5 Gbps), XAUI (3.125 Gbps), Serial RapidIO, and Gigabit Ethernet. The 25,660 logic elements provide ample datapath processing to implement MAC, PCS, and protocol state machines alongside the physical layer. With 607 user I/O and multiple I/O banks, the FPGA can simultaneously drive multiple parallel interfaces (LVDS, LVTTL) while the MGTs handle serial links.
Recommended
Telecom Line-Card Datapath Processing
The EP1SGX25FF1020I6N delivers 25K logic elements and 1.86 Mbit of TriMatrix embedded RAM, supporting telecom line-card functions such as packet classification, traffic shaping, and QoS scheduling. Its industrial temperature range (-40 °C to +100 °C) enables deployment in outdoor and uncontrolled thermal environments typical of central-office racks. The DSP multiplier blocks (up to 224 18×18-bit multipliers) accelerate FEC, encryption, and DSP front-end processing for wireless base stations.
Recommended
Broadcast Video Processing Engines
With 607 user I/O and substantial embedded RAM, the EP1SGX25FF1020I6N excels in broadcast video processing where multiple parallel video streams (SDI, DVB-ASI, HDMI) must be muxed, scaled, and processed in real time. The TriMatrix block RAM supports line buffers and frame buffers for video format conversion, while the DSP blocks accelerate chroma keying, scaling filters, and deinterlacing. The 1.5 V core and 1020-FBGA package are typical of high-end video-processing boards.
Recommended
Military / Aerospace Signal Processing
The industrial temperature grade of the EP1SGX25FF1020I6N (-40 °C to +100 °C) and Altera's heritage in defense/aerospace programs make this FPGA suitable for radar signal processing, electronic warfare subsystems, and avionics datalinks. Its hardened transceivers support ruggedized serial datalinks while the 25K logic capacity handles beamforming, FFT preprocessing, and I/Q demodulation. Conformal coating and BGA under-fill are recommended for shock/vibration environments.
Recommended
Storage Area Network (SAN) Controllers
The EP1SGX25FF1020I6N's embedded multi-gigabit transceivers combined with 25K logic elements provide the foundation for Fibre Channel and SAS/SATA storage controllers. The device's protocol-rich I/O can simultaneously drive 4 Gbps Fibre Channel links, multiple SATA ports, and management interfaces. Its embedded RAM supports command queuing, scatter-gather DMA descriptors, and parity-check buffering at line-rate.
Recommended
ASIC Prototyping Platforms
Engineers use the EP1SGX25FF1020I6N on ASIC prototyping platforms because its 25K logic elements, hard transceivers, and high I/O count closely emulate complex ASIC designs before tape-out. Multiple FPGAs can be bridged via the MGTs to partition large ASIC designs across chips. Quartus II's incremental compilation and LogicLock regions enable ASIC-style design partitioning, accelerating prototype bring-up and pre-silicon software development.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020I5N | EP1SGX25FF1020I7N | EP1SGX25FF1020C6N | EP1SGX25DF1020I6N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Logic Elements | 25,660 | 25,660 - same die | 25,660 - same die | 25,660 - same die | 25,660 - same die |
| Speed Grade | 6 | 5 (slower) | 7 (faster) | 6 | 6 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Industrial |
| User I/O Count | 607 | 607 | 607 | 607 | 607 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Embedded Transceivers | Yes (Stratix GX MGTs) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Speed grade 6 offers balanced timing margin for industrial applications (vs EP1SGX25FF1020I5N)
- Industrial temperature grade supports -40C to +100C operation (vs EP1SGX25FF1020C6N)
- FF variant designation with hardened Stratix GX transceivers (vs EP1SGX25DF1020I6N)
Design Notes
The EP1SGX25FF1020I6N requires multiple independent supply rails: VCCINT (1.425-1.575 V core), VCCIO (per-bank, 1.2 V to 3.3 V), VCCA_PLL (1.5 V analog, filtered), and VCCAUX (2.5 V or 3.3 V auxiliary). Implement a controlled power-on sequence (VCCINT first, then VCCIO, then VCCAUX) using a sequencing controller such as the LTC2923 or TI UCD90124 to prevent latch-up. Bulk decoupling of 22 µF polymer + 1 µF ceramic + 0.1 µF ceramic per supply pin is recommended.
The industrial-grade EP1SGX25FF1020I6N is rated for case temperatures up to +100 °C. At 25K LE utilization with active MGTs, typical junction-to-ambient thermal resistance θJA for the 1020-FBGA package on a JEDEC 4-layer test board is approximately 12-15 °C/W. Estimated: at 5 W total power dissipation, junction temperature rise above ambient is 60-75 °C, leaving 25-40 °C margin at 100 °C case. For sealed enclosures, derate by 30% or add a heatsink with thermal interface material.
The 1020-FBGA 33×33 mm package uses 1.0 mm pitch solder balls. PCB design must follow JEDEC MS-034 for flip-chip BGA land pattern and solder mask defined (SMD) pads are recommended over non-solder mask defined (NSMD) for higher assembly yield. Use microvia-in-pad technology (0.1 mm laser vias) under center balls for breakout routing. Maintain differential pair length matching within 5 mils for MGT serial links and route each differential pair on a single layer with reference ground planes on adjacent layers.
Do not use the JTAG pins (TCK, TMS, TDI, TDO) as general-purpose I/O after configuration - they revert to JTAG mode whenever nCONFIG goes low, causing in-system reprogramming issues. Do not apply 3.3 V to a 2.5 V or 1.8 V VCCIO bank without level-shifting buffers. Verify all I/O bank voltages before connecting peripheral devices, and never mix 5 V tolerant and non-5 V tolerant I/O standards on the same bank.
Isolate MGT transceiver analog power and grounds from digital I/O regions using a split-plane or guarded layout. Place MGT decoupling capacitors as close to their respective VCCMGT and GND pins as possible (≤100 mils). For 3.125 Gbps signals, maintain 50 Ω single-ended or 100 Ω differential controlled impedance with 6-8 mil trace width on standard FR-4 stack-ups, and avoid 90-degree bends - use 45-degree or curved traces only.
Compliance Information
RoHS/REACH compliance not confirmed from the provided search snippets; refer to original Altera product declaration. The device is industrial temperature grade but not AEC-Q100 qualified (FPGA, not a discrete automotive IC).
