EP2C8T144I8N - Cyclone II FPGA, 8K LEs, 144-TQFP | Intel
N.º da peça: EP2C8T144I8N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $27.86 | $27,86 |
| 10 | $25.5 | $255,00 |
| 100 | $22.8 | $2.280,00 |
| 500 | $19.95 | $9.975,00 |
| 1.000 | $17.5 | $17.500,00 |
EP2C8T144I8N Visão geral
An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be customized by the end user after manufacture using a hardware description language such as Verilog or VHDL. Within the broader semiconductor taxonomy, FPGAs sit at the top of the programmable-logic hierarchy above CPLDs (Complex Programmable Logic Devices) and below fixed-function ASICs (Application-Specific Integrated Circuits). The Cyclone II family specifically targets low-density, cost-sensitive applications where ASIC non-recurring engineering cost is not justified.
Key specifications include 36 embedded 18x18 multipliers supporting up to ~250 MHz DSP performance, two PLLs for clock management, configuration via active serial (AS), passive serial (PS), or JTAG, and an industrial temperature range of -40C to +100C. The 144-TQFP package exposes 85 user I/O pins and supports 1.2 V core operation with multi-voltage I/O banks at 1.5 V, 1.8 V, 2.5 V, or 3.3 V.
The Cyclone II architecture pairs 4-input look-up tables (LUTs) with embedded memory blocks to implement logic, DSP, and simple microcontroller functions on a single chip. The part is supported by the Quartus II design toolchain, which provides synthesis, place-and-route, timing analysis, and bitstream generation for configuration via a JTAG header or EPCS configuration flash.
Typical applications include industrial motor and motion control, video processing bridges, low-density communications glue logic, education and FPGA training platforms, and prototype ASIC replacement. Cyclone II devices were widely adopted in mid-2000s designs and remain useful for long-lifecycle industrial systems where re-qualification costs discourage migration to newer families.
When designing with this part, ensure the core decoupling network follows the Cyclone II handbook guidelines - typically 0.1 uF and 10 uF capacitors near every VCCINT/VCCIO pin pair. Configuration mode selection via MSEL pins must match the configuration device in use, and unused I/O pins should be set to tri-state with weak pull-up via Quartus device options to minimize in-rush current during configuration.
This page synthesizes distributor pricing, drop-in same-package alternatives sourced from the Site MPN list, and practical design notes compiled from the Cyclone II Device Handbook, providing information not available on a single distributor listing or in the raw datasheet alone.
Alternativas drop-in para EP2C8T144I8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2C8T144I8N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2C8T144I8
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.5 / unidade
Ver ficha técnica →EP2C8T144C8N
✅ Drop-In✓ Em estoque
$41.5 / unidade
Ver ficha técnica →EP2C8T144C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$20.85 / unidade
Ver ficha técnica →EP2C8T144C6N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EP2C5T144I8N
✅ Drop-In✓ Em estoque
$11.2 / unidade
Ver ficha técnica →EP2C8AT144I8N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2C8T144I8N Classificações máximas e características elétricas
| Family | Cyclone II |
| Logic Elements (LEs) | 8,256 |
| Total Memory Bits | 165,888 |
| Embedded Memory Blocks | 36 (M4K) |
| Embedded Multipliers (18x18) | 36 |
| Maximum User I/O Pins | 85 |
| Encapsulamento | 144-pin TQFP (TQFP-144) |
| Process Technology | 90 nm TSMC low-k dielectric |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| PLLs | 2 |
| Configuration Modes | AS, PS, JTAG |
| Maximum Operating Frequency | 402.58 MHz |
| Faixa de temperatura de operação | -40C to +100C (Industrial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Speed Grade | -8 |
Configuração de pinos do EP2C8T144I8N
| Pino 1 | I/O — User I/O pin, bank 1 |
| Pino 2 | I/O — User I/O pin, bank 1 |
| Pino 3 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 4 | I/O — User I/O pin, bank 1 |
| Pino 5 | I/O — User I/O pin, bank 1 |
| Pino 6 | I/O — User I/O pin, bank 1 |
| Pino 7 | I/O — User I/O pin, bank 1 |
| Pino 8 | GND — Ground |
| Pino 9 | I/O — User I/O pin, bank 1 |
| Pino 10 | I/O — User I/O pin, bank 1 |
| Pino 11 | I/O — User I/O pin, bank 1 |
| Pino 12 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 13 | I/O — User I/O pin, bank 1 |
| Pino 14 | I/O — User I/O pin, bank 1 |
| Pino 15 | I/O — User I/O pin, bank 1 |
| Pino 16 | GND — Ground |
| Pino 17 | I/O — User I/O pin, bank 1 |
| Pino 18 | I/O — User I/O pin, bank 1 |
| Pino 19 | I/O — User I/O pin, bank 1 |
| Pino 20 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 21 | I/O — User I/O pin, bank 1 |
| Pino 22 | I/O — User I/O pin, bank 1 |
| Pino 23 | I/O — User I/O pin, bank 1 |
| Pino 24 | GND — Ground |
| Pino 25 | I/O — User I/O pin, bank 1 |
| Pino 26 | I/O — User I/O pin, bank 1 |
| Pino 27 | I/O — User I/O pin, bank 1 |
| Pino 28 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 29 | I/O — User I/O pin, bank 1 |
| Pino 30 | I/O — User I/O pin, bank 1 |
| Pino 31 | I/O — User I/O pin, bank 1 |
| Pino 32 | GND — Ground |
| Pino 33 | VCCINT — Core voltage 1.2 V supply |
| Pino 34 | I/O — User I/O pin, bank 2 |
| Pino 35 | I/O — User I/O pin, bank 2 |
| Pino 36 | I/O — User I/O pin, bank 2 |
| Pino 37 | I/O — User I/O pin, bank 2 |
| Pino 38 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 39 | I/O — User I/O pin, bank 2 |
| Pino 40 | I/O — User I/O pin, bank 2 |
| Pino 41 | I/O — User I/O pin, bank 2 |
| Pino 42 | GND — Ground |
| Pino 43 | I/O — User I/O pin, bank 2 |
| Pino 44 | I/O — User I/O pin, bank 2 |
| Pino 45 | I/O — User I/O pin, bank 2 |
| Pino 46 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 47 | I/O — User I/O pin, bank 2 |
| Pino 48 | I/O — User I/O pin, bank 2 |
| Pino 49 | I/O — User I/O pin, bank 2 |
| Pino 50 | GND — Ground |
| Pino 51 | I/O — User I/O pin, bank 2 |
| Pino 52 | I/O — User I/O pin, bank 2 |
| Pino 53 | I/O — User I/O pin, bank 2 |
| Pino 54 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 55 | I/O — User I/O pin, bank 2 |
| Pino 56 | I/O — User I/O pin, bank 2 |
| Pino 57 | I/O — User I/O pin, bank 2 |
| Pino 58 | GND — Ground |
| Pino 59 | I/O — User I/O pin, bank 2 |
| Pino 60 | I/O — User I/O pin, bank 2 |
| Pino 61 | I/O — User I/O pin, bank 2 |
| Pino 62 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 63 | I/O — User I/O pin, bank 2 |
| Pino 64 | I/O — User I/O pin, bank 2 |
| Pino 65 | I/O — User I/O pin, bank 2 |
| Pino 66 | GND — Ground |
| Pino 67 | I/O — User I/O pin, bank 3 |
| Pino 68 | I/O — User I/O pin, bank 3 |
| Pino 69 | I/O — User I/O pin, bank 3 |
| Pino 70 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 71 | I/O — User I/O pin, bank 3 |
| Pino 72 | I/O — User I/O pin, bank 3 |
| Pino 73 | I/O — User I/O pin, bank 3 |
| Pino 74 | GND — Ground |
| Pino 75 | I/O — User I/O pin, bank 3 |
| Pino 76 | I/O — User I/O pin, bank 3 |
| Pino 77 | I/O — User I/O pin, bank 3 |
| Pino 78 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 79 | I/O — User I/O pin, bank 3 |
| Pino 80 | I/O — User I/O pin, bank 3 |
| Pino 81 | I/O — User I/O pin, bank 3 |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O pin, bank 3 |
| Pino 84 | I/O — User I/O pin, bank 3 |
| Pino 85 | I/O — User I/O pin, bank 3 |
| Pino 86 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 87 | I/O — User I/O pin, bank 3 |
| Pino 88 | I/O — User I/O pin, bank 3 |
| Pino 89 | I/O — User I/O pin, bank 3 |
| Pino 90 | GND — Ground |
| Pino 91 | I/O — User I/O pin, bank 3 |
| Pino 92 | I/O — User I/O pin, bank 3 |
| Pino 93 | I/O — User I/O pin, bank 3 |
| Pino 94 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 95 | I/O — User I/O pin, bank 3 |
| Pino 96 | I/O — User I/O pin, bank 3 |
| Pino 97 | I/O — User I/O pin, bank 3 |
| Pino 98 | GND — Ground |
| Pino 99 | I/O — User I/O pin, bank 4 |
| Pino 100 | I/O — User I/O pin, bank 4 |
| Pino 101 | I/O — User I/O pin, bank 4 |
| Pino 102 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 103 | I/O — User I/O pin, bank 4 |
| Pino 104 | I/O — User I/O pin, bank 4 |
| Pino 105 | I/O — User I/O pin, bank 4 |
| Pino 106 | GND — Ground |
| Pino 107 | I/O — User I/O pin, bank 4 |
| Pino 108 | I/O — User I/O pin, bank 4 |
| Pino 109 | I/O — User I/O pin, bank 4 |
| Pino 110 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 111 | I/O — User I/O pin, bank 4 |
| Pino 112 | I/O — User I/O pin, bank 4 |
| Pino 113 | I/O — User I/O pin, bank 4 |
| Pino 114 | GND — Ground |
| Pino 115 | MSEL0 — Configuration mode select bit 0 |
| Pino 116 | MSEL1 — Configuration mode select bit 1 |
| Pino 117 | MSEL2 — Configuration mode select bit 2 |
| Pino 118 | TCK — JTAG test clock input |
| Pino 119 | TMS — JTAG test mode select input |
| Pino 120 | TDI — JTAG test data input |
| Pino 121 | TDO — JTAG test data output |
| Pino 122 | nCE — Chip enable (active low) |
| Pino 123 | nCONFIG — Configuration control (active low) |
| Pino 124 | nSTATUS — Configuration status (active low) |
| Pino 125 | CONF_DONE — Configuration done indicator |
| Pino 126 | DCLK — Configuration clock input |
| Pino 127 | DATA0 — Configuration data input bit 0 |
| Pino 128 | VCCINT — Core voltage 1.2 V supply |
| Pino 129 | GND — Ground |
| Pino 130 | I/O — User I/O pin, bank 8 |
| Pino 131 | I/O — User I/O pin, bank 8 |
| Pino 132 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 133 | I/O — User I/O pin, bank 8 |
| Pino 134 | I/O — User I/O pin, bank 8 |
| Pino 135 | I/O — User I/O pin, bank 8 |
| Pino 136 | GND — Ground |
| Pino 137 | I/O — User I/O pin, bank 8 |
| Pino 138 | I/O — User I/O pin, bank 8 |
| Pino 139 | I/O — User I/O pin, bank 8 |
| Pino 140 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 141 | I/O — User I/O pin, bank 8 |
| Pino 142 | I/O — User I/O pin, bank 8 |
| Pino 143 | I/O — User I/O pin, bank 8 |
| Pino 144 | GND — Ground |
Aplicações típicas
EP2C8T144I8N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Processing Bridges, Communications Glue Logic, FPGA Education and Training Platforms, Prototype ASIC Replacement, Legacy Industrial System Maintenance.
Industrial Motor Control
The EP2C8T144I8N is well suited to industrial motor control inverter logic where its 8,256 logic elements can implement field-oriented control (FOC) state machines, PWM generators, and encoder interfaces simultaneously on a single die. Its 36 embedded 18x18 multipliers execute the Clarke and Park transforms plus the inverse Park transform needed for stator current control, while the 85 user I/O pins accommodate three-phase PWM outputs, incremental encoder inputs, and parallel current-sense ADC interfaces. The industrial -40C to +100C temperature grade tolerates cabinet-mounted factory environments without derating. Designers should pair the FPGA with external gate drivers such as the IR2110 or UCC27211 because the FPGA outputs cannot directly switch the IGBT or SiC module gates.
Recomendado
Video Processing Bridges
The EP2C8T144I8N serves as a video format bridge converting between DVI, HDMI, VGA, and LVDS display interfaces in mid-complexity digital signage and industrial display products. The 165,888 bits of embedded RAM organize as 36 M4K blocks to implement line buffers for resolution scaling and frame-rate conversion, while the 36 18x18 multipliers accelerate color-space conversion from YCbCr to RGB. The 144-TQFP package exposes 85 user I/O pins, enough for 24-bit parallel RGB plus control signals and the LVDS link. Cyclone II has no hard HDMI transceiver, so external TFP410 / TFP401A serializer chips or ADV7513 HDMI transmitters handle the physical layer while the FPGA manages pixel clock generation and timing.
Recomendado
Communications Glue Logic
In telecom and networking hardware the EP2C8T144I8N provides protocol conversion and front-panel glue logic between ASICs, network processors, and SERDES devices. Its two PLLs generate the multiple clock domains typical in communications backplanes, while the 8K logic elements implement stateful protocol handlers for SPI, I2C, UART, MDIO, and PCIe-style sideband signals. The 85 user I/O pins easily accommodate 16-bit parallel buses plus differential LVDS pairs for inter-board links. Cyclone II lacks multi-gigabit transceivers, so the part is appropriate for control-plane glue rather than data-path packet processing, where it can replace a stack of discrete 74-series logic.
Recomendado
FPGA Education and Training Platforms
The EP2C8T144I8N appears in university FPGA teaching labs and on open-spec development boards where students learn Verilog and VHDL digital design. The 8K-LE density is large enough to host an entire 32-bit RISC-V soft core, a VGA framebuffer, and a UART bootloader simultaneously, yet small enough to fit comfortably in the Quartus II toolchain's free Web Edition license. The 144-TQFP package is hand-solderable with care on breakout boards, and the industrial temperature grade lets the same board survive laboratory and maker-fair environments. The mature Cyclone II device support in older Quartus versions means legacy lab tutorials and reference designs remain directly compilable for the part.
Recomendado
Prototype ASIC Replacement
Designers use the EP2C8T144I8N as a prototype vehicle for ASIC designs that have not yet taped out, allowing pre-silicon firmware development and system integration testing on real hardware. The Cyclone II silicon integrates 165 Kbits of RAM and 36 multipliers sufficient to model many common ASIC IP blocks, and the Quartus II toolchain provides full timing closure visibility so that ASIC sign-off scripts can be back-annotated. The 144-TQFP package exposes 85 user I/O pins that map comfortably onto typical ASIC ball-outs after a small interposer board, and the industrial temperature grade lets the prototype go into environmental chambers that mimic final product conditions.
Recomendado
Legacy Industrial System Maintenance
Long-lifecycle industrial systems installed in the late 2000s and early 2010s often contain Cyclone II FPGAs whose original bill of materials has since been discontinued, and the EP2C8T144I8N supports the field-replacement market for these products. The part's identical pin-out and Quartus II compatibility mean that a field engineer can swap a failed FPGA with a fresh unit loaded from the original programming file without board rework. The 144-TQFP footprint is well-documented in legacy design files, and remaining last-time-buy inventory on the open market supports repair depots through approximately the end of the decade.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2C8T144I8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2C8T144I8 | EP2C8T144C8N | EP2C8T144C7N | EP2C8T144C6N | EP2C5T144I8N | EP2C8AT144I8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP (TQFP-144) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 (-44%) | 8,256 |
| Total Memory Bits | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 | 119,808 | 165,888 |
| Embedded Multipliers (18x18) | 36 | 36 | 36 | 36 | 36 | 23 (-36%) | 36 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Automotive AEC-Q100 |
| Speed Grade | -8 | -8 | -8 | -7 (slower) | -6 (slowest) | -8 | -8 |
| Maximum User I/O | 85 | 85 | 85 | 85 | 85 | 89 (slightly more due to package) | 85 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principais diferenciais
- Industrial temperature grade in the Cyclone II 8K-LE class (vs EP2C8T144C8N)
- Higher density than the EP2C5T144I8N in the same package (vs EP2C5T144I8N)
- Automotive-grade option exists with identical silicon (vs EP2C8AT144I8N)
Notas de projeto
The EP2C8T144I8N requires a low-noise 1.2 V core supply on every VCCINT pin plus per-bank VCCIO supplies of 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard in use. Per the Cyclone II Device Handbook, place one 0.1 uF X7R ceramic bypass capacitor directly adjacent to every VCCINT and VCCIO pin pair, supplemented by a single 100 uF bulk tantalum or aluminum-polymer capacitor at the regulator output. Estimated: the 8K-LE Cyclone II typically draws 200 mA to 400 mA on VCCINT at 100 percent toggle activity, so the 1.2 V regulator must deliver at least 500 mA with 50 mV peak-to-peak ripple.
Route the JTAG chain (TCK, TMS, TDI, TDO) on the top layer with a continuous ground return path immediately below, and keep trace lengths matched to within 50 mil to avoid timing skew during boundary-scan testing. The MSEL[2:0] pins must be tied to VCCIO8 or GND through 4.7 K resistors and not left floating, since a floating MSEL can cause the device to enter an undefined configuration mode and appear as a configuration failure. Place the EPCS configuration flash within 4 inches of the FPGA DATA0 / DCLK pins to avoid signal-integrity issues during AS-mode boot.
The 144-pin TQFP package has no exposed thermal pad, so heat removal relies entirely on copper pours connected to the GND pins and forced airflow. Estimated: at 100 percent LE utilization and 100 MHz toggle rate, the part dissipates approximately 0.5 W to 1.0 W; this is manageable in a properly ventilated industrial enclosure but should be verified with a thermal probe at maximum ambient. Designers should fill unused package area with a continuous GND copper pour stitched with vias to the inner ground plane.
Do not leave unused I/O pins floating in the Quartus II pin planner - set them to 'As input tri-stated with weak pull-up' via Device Options, otherwise the inputs can float into the linear region and draw extra supply current during configuration. Cyclone II does not support hot-socketing on JTAG pins, so add 4.7 K series resistors on TCK, TMS, TDI, and TDO if the board will be mated while powered. Configuration failures from corrupted bitstreams are almost always traced to insufficient VCCINT decoupling or to a CONFIG_DONE pin pulled low by leakage; verify both before assuming a silicon failure.
LVDS outputs on the EP2C8T144I8N require a 100 ohm differential termination resistor placed within 250 mil of the receiver input, and the differential pair must be routed with a 100 ohm controlled-impedance trace on a stripline or microstrip layer stack. Single-ended I/O signals exceeding 50 MHz should be series-terminated at the source with a 33 ohm resistor to dampen reflections on long traces. Use the Quartus II TimeQuest timing analyzer with a properly constrained SDC file to verify all paths meet setup and hold requirements before generating the final bitstream.
Informações de conformidade
RoHS and lead-free per Altera / Intel product page. The standard EP2C8T144I8N is not AEC-Q100 qualified; the EP2C8AT144I8N variant carries automotive qualification. Halogen-free status not explicitly stated in the verified data.