EP2C8T144C6N - Cyclone II FPGA, 8K LE, 144-LQFP | Intel
N.º da peça: EP2C8T144C6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $35.37 | $35,37 |
| 10 | $30.5 | $305,00 |
| 100 | $22.8 | $2.280,00 |
| 500 | $17.95 | $8.975,00 |
| 1.000 | $14.2 | $14.200,00 |
EP2C8T144C6N Visão geral
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows designers to implement arbitrary digital logic functions through an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. FPGAs sit in the digital logic hierarchy alongside ASICs and CPLDs, offering higher density than CPLDs while providing lower non-recurring engineering cost than ASICs. The Cyclone II family is positioned as a low-power, low-cost alternative to ASICs for volume production in consumer, industrial, and automotive applications.
Key features of the EP2C8T144C6N include 8,256 logic elements distributed across 36 logic array blocks (LABs), 36 embedded 18x18 multipliers for DSP-style arithmetic, two PLLs for clock synthesis, and embedded memory totaling approximately 165 Kbits. The 144-pin LQFP package exposes 85 user I/O pins supporting LVTTL, LVCMOS, PCI, SSTL, and LVDS I/O standards, enabling flexible interfacing with a wide range of external peripherals and memory devices.
The Cyclone II architecture uses a 4-input lookup table (LUT) as its fundamental logic element, with embedded multiplier blocks and M4K memory blocks providing dedicated arithmetic and storage resources. Configuration data is stored in SRAM cells, requiring a configuration device (such as the EPCS series) or a JTAG/microcontroller-based scheme to load the bitstream at power-up. The 90 nm process provides an optimal balance between cost, power, and density for mid-range FPGA designs.
Typical applications include digital signal processing front-ends, motor control, video processing bridges, industrial automation controllers, telecommunications glue logic, and educational FPGA platforms. The combination of low unit cost and ample DSP resources makes the EP2C8T144C6N particularly attractive for prototyping and small-to-medium volume production runs.
When designing with the EP2C8T144C6N, plan a robust configuration strategy using JTAG for development and an EPCS configuration flash for production. The 144-pin LQFP package supports hand-solderable prototypes, but multi-layer PCB design with dedicated ground and power planes is essential for signal integrity at higher toggle rates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers the complete picture for selecting and sourcing the EP2C8T144C6N.
Alternativas drop-in para EP2C8T144C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2C8T144C6N (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2C8T144C8N
✅ Drop-In✓ Em estoque
$41.5 / unidade
Ver ficha técnica →EP2C8T144C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$20.85 / unidade
Ver ficha técnica →EP2C8T144I8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.5 / unidade
Ver ficha técnica →EP2C8T144I7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2C8T144C6
✅ Drop-In✓ Em estoque
$22.62 / unidade
Ver ficha técnica →EP2C5T144C8N
✅ Drop-In✓ Em estoque
$19.8 / unidade
Ver ficha técnica →EP2C5T144C6N
✅ Drop-In✓ Em estoque
$5.1 / unidade
Ver ficha técnica →EP2C8T144C6N Classificações máximas e características elétricas
| Family | Cyclone II |
| Logic Elements | 8,256 |
| Total RAM Bits | 165,888 |
| Number of Logic Elements / Cells | 8,256 |
| Total Memory Bits | 165,888 |
| Number of I/O | 85 |
| Voltage - Supply | 1.15 V to 1.25 V (core) |
| Temperatura de operação | 0C to +85C (commercial) |
| Encapsulamento / Caixa | 144-LQFP (TQFP) |
| Supplier Device Package | 144-TQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Process Technology | 90 nm CMOS SRAM |
| Configuration Method | SRAM - volatile (EPCS/JTAG required) |
Configuração de pinos do EP2C8T144C6N
| Pino 1 | I/O — User I/O (Bank 1) |
| Pino 2 | I/O — User I/O (Bank 1) |
| Pino 3 | I/O — User I/O (Bank 1) |
| Pino 4 | I/O — User I/O (Bank 1) |
| Pino 5 | I/O — User I/O (Bank 1) |
| Pino 6 | I/O — User I/O (Bank 1) |
| Pino 7 | I/O — User I/O (Bank 1) |
| Pino 8 | I/O — User I/O (Bank 1) |
| Pino 9 | I/O — User I/O (Bank 1) |
| Pino 10 | I/O — User I/O (Bank 1) |
| Pino 11 | VCCIO1 — I/O Bank 1 supply voltage |
| Pino 12 | I/O — User I/O (Bank 1) |
| Pino 13 | I/O — User I/O (Bank 1) |
| Pino 14 | I/O — User I/O (Bank 1) |
| Pino 15 | I/O — User I/O (Bank 1) |
| Pino 16 | I/O — User I/O (Bank 1) |
| Pino 17 | I/O — User I/O (Bank 1) |
| Pino 18 | I/O — User I/O (Bank 1) |
| Pino 19 | I/O — User I/O (Bank 1) |
| Pino 20 | I/O — User I/O (Bank 1) |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O (Bank 2) |
| Pino 23 | I/O — User I/O (Bank 2) |
| Pino 24 | I/O — User I/O (Bank 2) |
| Pino 25 | I/O — User I/O (Bank 2) |
| Pino 26 | I/O — User I/O (Bank 2) |
| Pino 27 | I/O — User I/O (Bank 2) |
| Pino 28 | I/O — User I/O (Bank 2) |
| Pino 29 | I/O — User I/O (Bank 2) |
| Pino 30 | I/O — User I/O (Bank 2) |
| Pino 31 | I/O — User I/O (Bank 2) |
| Pino 32 | I/O — User I/O (Bank 2) |
| Pino 33 | VCCIO2 — I/O Bank 2 supply voltage |
| Pino 34 | I/O — User I/O (Bank 2) |
| Pino 35 | I/O — User I/O (Bank 2) |
| Pino 36 | I/O — User I/O (Bank 2) |
| Pino 37 | I/O — User I/O (Bank 2) |
| Pino 38 | I/O — User I/O (Bank 2) |
| Pino 39 | I/O — User I/O (Bank 2) |
| Pino 40 | I/O — User I/O (Bank 2) |
| Pino 41 | I/O — User I/O (Bank 2) |
| Pino 42 | I/O — User I/O (Bank 2) |
| Pino 43 | GND — Ground |
| Pino 44 | I/O — User I/O (Bank 3) |
| Pino 45 | I/O — User I/O (Bank 3) |
| Pino 46 | I/O — User I/O (Bank 3) |
| Pino 47 | I/O — User I/O (Bank 3) |
| Pino 48 | I/O — User I/O (Bank 3) |
| Pino 49 | I/O — User I/O (Bank 3) |
| Pino 50 | I/O — User I/O (Bank 3) |
| Pino 51 | I/O — User I/O (Bank 3) |
| Pino 52 | I/O — User I/O (Bank 3) |
| Pino 53 | I/O — User I/O (Bank 3) |
| Pino 54 | I/O — User I/O (Bank 3) |
| Pino 55 | VCCIO3 — I/O Bank 3 supply voltage |
| Pino 56 | I/O — User I/O (Bank 3) |
| Pino 57 | I/O — User I/O (Bank 3) |
| Pino 58 | I/O — User I/O (Bank 3) |
| Pino 59 | I/O — User I/O (Bank 3) |
| Pino 60 | I/O — User I/O (Bank 3) |
| Pino 61 | I/O — User I/O (Bank 3) |
| Pino 62 | I/O — User I/O (Bank 3) |
| Pino 63 | I/O — User I/O (Bank 3) |
| Pino 64 | I/O — User I/O (Bank 3) |
| Pino 65 | I/O — User I/O (Bank 3) |
| Pino 66 | GND — Ground |
| Pino 67 | nSTATUS — Configuration status (open-drain) |
| Pino 68 | DCLK — Configuration clock (PS mode) |
| Pino 69 | DATA0 — Configuration data input (PS mode) |
| Pino 70 | nCONFIG — Configuration control (active-low) |
| Pino 71 | CONF_DONE — Configuration done (open-drain) |
| Pino 72 | MSEL0 — Configuration mode select bit 0 |
| Pino 73 | MSEL1 — Configuration mode select bit 1 |
| Pino 74 | MSEL2 — Configuration mode select bit 2 |
| Pino 75 | VCCINT — Core supply voltage (1.2V) |
| Pino 76 | GND — Ground |
| Pino 77 | TDI — JTAG test data input |
| Pino 78 | TMS — JTAG test mode select |
| Pino 79 | TCK — JTAG test clock |
| Pino 80 | TDO — JTAG test data output |
| Pino 81 | nCE — Chip enable (active-low) |
| Pino 82 | VCCIO4 — I/O Bank 4 supply voltage |
| Pino 83 | I/O — User I/O (Bank 4) |
| Pino 84 | I/O — User I/O (Bank 4) |
| Pino 85 | I/O — User I/O (Bank 4) |
| Pino 86 | I/O — User I/O (Bank 4) |
| Pino 87 | I/O — User I/O (Bank 4) |
| Pino 88 | I/O — User I/O (Bank 4) |
| Pino 89 | I/O — User I/O (Bank 4) |
| Pino 90 | I/O — User I/O (Bank 4) |
| Pino 91 | I/O — User I/O (Bank 4) |
| Pino 92 | I/O — User I/O (Bank 4) |
| Pino 93 | VCCIO4 — I/O Bank 4 supply voltage |
| Pino 94 | I/O — User I/O (Bank 4) |
| Pino 95 | I/O — User I/O (Bank 4) |
| Pino 96 | I/O — User I/O (Bank 4) |
| Pino 97 | I/O — User I/O (Bank 4) |
| Pino 98 | I/O — User I/O (Bank 4) |
| Pino 99 | I/O — User I/O (Bank 4) |
| Pino 100 | I/O — User I/O (Bank 4) |
| Pino 101 | I/O — User I/O (Bank 4) |
| Pino 102 | I/O — User I/O (Bank 4) |
| Pino 103 | I/O — User I/O (Bank 4) |
| Pino 104 | GND — Ground |
| Pino 105 | I/O — User I/O (Bank 1) |
| Pino 106 | I/O — User I/O (Bank 1) |
| Pino 107 | I/O — User I/O (Bank 1) |
| Pino 108 | I/O — User I/O (Bank 1) |
| Pino 109 | I/O — User I/O (Bank 1) |
| Pino 110 | I/O — User I/O (Bank 1) |
| Pino 111 | I/O — User I/O (Bank 1) |
| Pino 112 | I/O — User I/O (Bank 1) |
| Pino 113 | I/O — User I/O (Bank 1) |
| Pino 114 | I/O — User I/O (Bank 1) |
| Pino 115 | I/O — User I/O (Bank 1) |
| Pino 116 | I/O — User I/O (Bank 1) |
| Pino 117 | VCCIO1 — I/O Bank 1 supply voltage |
| Pino 118 | I/O — User I/O (Bank 1) |
| Pino 119 | I/O — User I/O (Bank 1) |
| Pino 120 | I/O — User I/O (Bank 1) |
| Pino 121 | I/O — User I/O (Bank 1) |
| Pino 122 | I/O — User I/O (Bank 1) |
| Pino 123 | I/O — User I/O (Bank 1) |
| Pino 124 | I/O — User I/O (Bank 1) |
| Pino 125 | I/O — User I/O (Bank 1) |
| Pino 126 | I/O — User I/O (Bank 1) |
| Pino 127 | I/O — User I/O (Bank 1) |
| Pino 128 | GND — Ground |
| Pino 129 | CLK0 — PLL Clock input 0 (Bank 3) |
| Pino 130 | CLK1 — PLL Clock input 1 (Bank 3) |
| Pino 131 | I/O — User I/O (Bank 3) |
| Pino 132 | I/O — User I/O (Bank 3) |
| Pino 133 | I/O — User I/O (Bank 3) |
| Pino 134 | I/O — User I/O (Bank 3) |
| Pino 135 | I/O — User I/O (Bank 3) |
| Pino 136 | I/O — User I/O (Bank 3) |
| Pino 137 | I/O — User I/O (Bank 3) |
| Pino 138 | I/O — User I/O (Bank 3) |
| Pino 139 | I/O — User I/O (Bank 3) |
| Pino 140 | I/O — User I/O (Bank 3) |
| Pino 141 | I/O — User I/O (Bank 3) |
| Pino 142 | I/O — User I/O (Bank 3) |
| Pino 143 | VCCIO3 — I/O Bank 3 supply voltage |
| Pino 144 | VCCINT — Core supply voltage (1.2V) |
Aplicações típicas
EP2C8T144C6N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Processing Bridge, Digital Signal Processing Front-End, Industrial Communications and Glue Logic, Educational and Prototyping Platform, Consumer Electronics Control Logic.
Industrial Motor Control
The EP2C8T144C6N's 8,256 logic elements and 36 embedded 18x18 multipliers make it a strong fit for industrial motor control loops, including field-oriented control (FOC) and space-vector PWM (SVPWM). With 85 user I/O in the 144-LQFP package, designers can interface directly to Hall sensors, encoder inputs, gate drivers, and ADC feedback channels without external logic. The two PLLs allow flexible clock generation for encoder sampling and PWM switching frequencies, while the M4K memory blocks provide lookup-table storage for sine and Clarke transforms. Drop-in speed-grade flexibility (C6 to C8) gives design teams a margin to handle timing closure without PCB redesign.
Recomendado
Video Processing Bridge
For bridging between image sensors, video processors, and display panels, the EP2C8T144C6N provides ample LUT capacity for color-space conversion, frame-rate conversion, and timing generator logic. The 36 embedded 18x18 multipliers support real-time scaling and chroma resampling at standard video rates (480p to 720p). Its 85 I/O are sufficient to handle parallel RGB, BT.656, or LVDS video interfaces directly, while the 165,888 bits of RAM buffer a full video line for deinterlacing or scaling. The 144-LQFP package is hand-solderable, making it ideal for prototype video bridges used in surveillance, signage, or machine-vision applications.
Recomendado
Digital Signal Processing Front-End
With 36 dedicated 18x18 multipliers and 8,256 logic elements, the EP2C8T144C6N implements FIR filters, FFTs, and other DSP functions at baseband or audio sample rates. The M4K memory blocks (totaling 165,888 bits) can store filter coefficients and sample buffers, while the PLLs generate the precise clocks needed for ADC/DAC interfaces. Its low unit cost makes it attractive for production DSP front-ends in audio processing, biomedical instrumentation, or software-defined radio baseband. Quartus II DSP Builder and Verilog/VHDL flows are fully supported, with reference designs available from Intel for common FIR and FFT implementations.
Recomendado
Industrial Communications and Glue Logic
The EP2C8T144C6N is well suited for industrial protocol bridging, protocol conversion, and complex glue logic between microcontrollers, sensors, and communication transceivers. It can implement Modbus, CANopen, EtherCAT slave, PROFINET IRT, or custom industrial protocols in parallel with protocol translation. The 144-LQFP package's 85 I/O are sufficient to bridge multiple UART/SPI/I2C buses, while the embedded RAM supports packet buffering and protocol state machines. The commercial temperature grade (0C to +85C) is adequate for indoor cabinet environments; for harsher industrial sites, choose the EP2C8T144I8N drop-in alternative with -40C to +100C support.
Recomendado
Educational and Prototyping Platform
The combination of low unit cost, hand-solderable 144-LQFP package, and free Quartus II Web Edition toolchain makes the EP2C8T144C6N a popular choice for university FPGA courses, hobbyist projects, and engineering prototypes. The 8,256 logic elements provide enough capacity for full RISC-V soft cores (e.g. PicoRV32), custom instruction sets, and graduate-level projects without immediately running out of resources. Reference boards (e.g. Altera Cyclone II Starter Kit) pair this FPGA with EPCS configuration flash, SDRAM, VGA, and GPIO headers - enabling end-to-end learning of HDL design, synthesis, place-and-route, and verification.
Recomendado
Consumer Electronics Control Logic
In consumer products such as smart appliances, set-top boxes, and home entertainment peripherals, the EP2C8T144C6N provides the logic capacity to handle user-interface decoding, LED matrix driving, IR receiver decoding, and peripheral multiplexing. Its 85 I/O are sufficient to drive 7-segment displays, key-scan matrices, and multiple PWM channels for backlight or motor control. The low unit cost and proven Cyclone II reliability make it attractive for consumer volumes where ASIC NRE cannot be amortized. Reference designs from Intel cover I2C/SPI master-slave bridging, HDMI CEC handling, and IR protocol decoding.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2C8T144C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2C8T144C8N | EP2C8T144C7N | EP2C8T144I8N | EP2C5T144C8N | EP2C5T144C6N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 | 4,608 |
| Speed Grade | -C6 (fast) | -C8 (slower) | -C7 (intermediate) | -I8 (industrial) | -C8 (slower) | -C6 (matches) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O | 85 | 85 | 85 | 85 | 89 | 89 |
| Embedded RAM (bits) | 165,888 | 165,888 | 165,888 | 165,888 | 119,808 | 119,808 |
Principais diferenciais
- Largest Cyclone II LE density in the 144-LQFP package (vs EP2C5T144C6N)
- Fastest speed grade available in 144-LQFP (-C6) (vs EP2C8T144C8N)
- Commercial temperature only - industrial variant is a drop-in upgrade (vs EP2C8T144I8N)
Notas de projeto
The EP2C8T144C6N requires separate VCCINT (core, 1.15-1.25 V) and VCCIO1/VCCIO2/VCCIO3/VCCIO4 (I/O banks, 1.5/1.8/2.5/3.3 V) supplies. Decouple each VCCINT pin with one 0.1 uF ceramic plus one 10 uF bulk capacitor placed within 5 mm of the pin. Each VCCIO bank should have its own 0.1 uF + 10 uF decoupling pair to prevent switching noise from coupling between banks and corrupting logic levels on adjacent I/O standards.
Use a 4-layer PCB stackup (signal-GND-VCC-signal) with one continuous GND plane and one continuous VCC plane. The 144-TQFP package has a 0.5 mm pin pitch - route two traces between adjacent pads using 0.20 mm trace width with 0.20 mm clearance. Place a 4x4 via array (0.3 mm drilled, 0.5 mm pad) under the package thermal pad area (none for LQFP, but place ground vias around the package perimeter for thermal spreading and signal return paths).
Do not leave MSEL[2:0] floating - tie them to VCCINT or GND through 1 kohm resistors to define configuration mode. CONF_DONE and nSTATUS are open-drain and require a 10 kohm pull-up to VCCIO. The Cyclone II configuration sequence is sensitive to nCONFIG rising-edge timing - ensure power supplies have stabilized and PLL clock inputs are stable before nCONFIG is released, otherwise configuration may fail intermittently.
Cyclone II LVDS inputs require an external 100-ohm differential termination resistor across the pair placed within 5 mm of the FPGA pin. SSTL and HSTL I/O standards require external VTT termination at the receiver end. For clock inputs CLK0/CLK1, keep traces short and impedance-controlled (50-ohm single-ended or 100-ohm differential) to avoid jitter exceeding the PLL input specification. Always refer to the Cyclone II Device Handbook chapter 'I/O Features' for the specific standard being used.
Informações de conformidade
RoHS, REACH, halogen-free, and conflict-mineral status were not explicitly confirmed in the Verified Web Data for this part - see Intel/Altera product page for current compliance documentation. The 'N' suffix in the MPN indicates lead-free / Pb-free plating per Altera's legacy naming convention.