EP2C8T144I8N - Cyclone II FPGA, 8K LEs, 144-TQFP | Intel
Référence : EP2C8T144I8N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $27.86 | $27,86 |
| 10 | $25.5 | $255,00 |
| 100 | $22.8 | $2 280,00 |
| 500 | $19.95 | $9 975,00 |
| 1 000 | $17.5 | $17 500,00 |
EP2C8T144I8N Présentation
An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be customized by the end user after manufacture using a hardware description language such as Verilog or VHDL. Within the broader semiconductor taxonomy, FPGAs sit at the top of the programmable-logic hierarchy above CPLDs (Complex Programmable Logic Devices) and below fixed-function ASICs (Application-Specific Integrated Circuits). The Cyclone II family specifically targets low-density, cost-sensitive applications where ASIC non-recurring engineering cost is not justified.
Key specifications include 36 embedded 18x18 multipliers supporting up to ~250 MHz DSP performance, two PLLs for clock management, configuration via active serial (AS), passive serial (PS), or JTAG, and an industrial temperature range of -40C to +100C. The 144-TQFP package exposes 85 user I/O pins and supports 1.2 V core operation with multi-voltage I/O banks at 1.5 V, 1.8 V, 2.5 V, or 3.3 V.
The Cyclone II architecture pairs 4-input look-up tables (LUTs) with embedded memory blocks to implement logic, DSP, and simple microcontroller functions on a single chip. The part is supported by the Quartus II design toolchain, which provides synthesis, place-and-route, timing analysis, and bitstream generation for configuration via a JTAG header or EPCS configuration flash.
Typical applications include industrial motor and motion control, video processing bridges, low-density communications glue logic, education and FPGA training platforms, and prototype ASIC replacement. Cyclone II devices were widely adopted in mid-2000s designs and remain useful for long-lifecycle industrial systems where re-qualification costs discourage migration to newer families.
When designing with this part, ensure the core decoupling network follows the Cyclone II handbook guidelines - typically 0.1 uF and 10 uF capacitors near every VCCINT/VCCIO pin pair. Configuration mode selection via MSEL pins must match the configuration device in use, and unused I/O pins should be set to tri-state with weak pull-up via Quartus device options to minimize in-rush current during configuration.
This page synthesizes distributor pricing, drop-in same-package alternatives sourced from the Site MPN list, and practical design notes compiled from the Cyclone II Device Handbook, providing information not available on a single distributor listing or in the raw datasheet alone.
Alternatives de remplacement direct pour EP2C8T144I8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C8T144I8N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C8T144I8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.5 / unité
Voir la fiche technique →EP2C8T144C8N
✅ Remplacement direct✓ En stock
$41.5 / unité
Voir la fiche technique →EP2C8T144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$20.85 / unité
Voir la fiche technique →EP2C8T144C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.2 / unité
Voir la fiche technique →EP2C5T144I8N
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →EP2C8AT144I8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2C8T144I8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone II |
| Logic Elements (LEs) | 8,256 |
| Total Memory Bits | 165,888 |
| Embedded Memory Blocks | 36 (M4K) |
| Embedded Multipliers (18x18) | 36 |
| Maximum User I/O Pins | 85 |
| Boîtier | 144-pin TQFP (TQFP-144) |
| Process Technology | 90 nm TSMC low-k dielectric |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| PLLs | 2 |
| Configuration Modes | AS, PS, JTAG |
| Maximum Operating Frequency | 402.58 MHz |
| Plage de température de fonctionnement | -40C to +100C (Industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Speed Grade | -8 |
Configuration des broches de EP2C8T144I8N
| Broche 1 | I/O — User I/O pin, bank 1 |
| Broche 2 | I/O — User I/O pin, bank 1 |
| Broche 3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 4 | I/O — User I/O pin, bank 1 |
| Broche 5 | I/O — User I/O pin, bank 1 |
| Broche 6 | I/O — User I/O pin, bank 1 |
| Broche 7 | I/O — User I/O pin, bank 1 |
| Broche 8 | GND — Ground |
| Broche 9 | I/O — User I/O pin, bank 1 |
| Broche 10 | I/O — User I/O pin, bank 1 |
| Broche 11 | I/O — User I/O pin, bank 1 |
| Broche 12 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 13 | I/O — User I/O pin, bank 1 |
| Broche 14 | I/O — User I/O pin, bank 1 |
| Broche 15 | I/O — User I/O pin, bank 1 |
| Broche 16 | GND — Ground |
| Broche 17 | I/O — User I/O pin, bank 1 |
| Broche 18 | I/O — User I/O pin, bank 1 |
| Broche 19 | I/O — User I/O pin, bank 1 |
| Broche 20 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 21 | I/O — User I/O pin, bank 1 |
| Broche 22 | I/O — User I/O pin, bank 1 |
| Broche 23 | I/O — User I/O pin, bank 1 |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin, bank 1 |
| Broche 26 | I/O — User I/O pin, bank 1 |
| Broche 27 | I/O — User I/O pin, bank 1 |
| Broche 28 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 29 | I/O — User I/O pin, bank 1 |
| Broche 30 | I/O — User I/O pin, bank 1 |
| Broche 31 | I/O — User I/O pin, bank 1 |
| Broche 32 | GND — Ground |
| Broche 33 | VCCINT — Core voltage 1.2 V supply |
| Broche 34 | I/O — User I/O pin, bank 2 |
| Broche 35 | I/O — User I/O pin, bank 2 |
| Broche 36 | I/O — User I/O pin, bank 2 |
| Broche 37 | I/O — User I/O pin, bank 2 |
| Broche 38 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 39 | I/O — User I/O pin, bank 2 |
| Broche 40 | I/O — User I/O pin, bank 2 |
| Broche 41 | I/O — User I/O pin, bank 2 |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O pin, bank 2 |
| Broche 44 | I/O — User I/O pin, bank 2 |
| Broche 45 | I/O — User I/O pin, bank 2 |
| Broche 46 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 47 | I/O — User I/O pin, bank 2 |
| Broche 48 | I/O — User I/O pin, bank 2 |
| Broche 49 | I/O — User I/O pin, bank 2 |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O pin, bank 2 |
| Broche 52 | I/O — User I/O pin, bank 2 |
| Broche 53 | I/O — User I/O pin, bank 2 |
| Broche 54 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 55 | I/O — User I/O pin, bank 2 |
| Broche 56 | I/O — User I/O pin, bank 2 |
| Broche 57 | I/O — User I/O pin, bank 2 |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O pin, bank 2 |
| Broche 60 | I/O — User I/O pin, bank 2 |
| Broche 61 | I/O — User I/O pin, bank 2 |
| Broche 62 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 63 | I/O — User I/O pin, bank 2 |
| Broche 64 | I/O — User I/O pin, bank 2 |
| Broche 65 | I/O — User I/O pin, bank 2 |
| Broche 66 | GND — Ground |
| Broche 67 | I/O — User I/O pin, bank 3 |
| Broche 68 | I/O — User I/O pin, bank 3 |
| Broche 69 | I/O — User I/O pin, bank 3 |
| Broche 70 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 71 | I/O — User I/O pin, bank 3 |
| Broche 72 | I/O — User I/O pin, bank 3 |
| Broche 73 | I/O — User I/O pin, bank 3 |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O pin, bank 3 |
| Broche 76 | I/O — User I/O pin, bank 3 |
| Broche 77 | I/O — User I/O pin, bank 3 |
| Broche 78 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 79 | I/O — User I/O pin, bank 3 |
| Broche 80 | I/O — User I/O pin, bank 3 |
| Broche 81 | I/O — User I/O pin, bank 3 |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O pin, bank 3 |
| Broche 84 | I/O — User I/O pin, bank 3 |
| Broche 85 | I/O — User I/O pin, bank 3 |
| Broche 86 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 87 | I/O — User I/O pin, bank 3 |
| Broche 88 | I/O — User I/O pin, bank 3 |
| Broche 89 | I/O — User I/O pin, bank 3 |
| Broche 90 | GND — Ground |
| Broche 91 | I/O — User I/O pin, bank 3 |
| Broche 92 | I/O — User I/O pin, bank 3 |
| Broche 93 | I/O — User I/O pin, bank 3 |
| Broche 94 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 95 | I/O — User I/O pin, bank 3 |
| Broche 96 | I/O — User I/O pin, bank 3 |
| Broche 97 | I/O — User I/O pin, bank 3 |
| Broche 98 | GND — Ground |
| Broche 99 | I/O — User I/O pin, bank 4 |
| Broche 100 | I/O — User I/O pin, bank 4 |
| Broche 101 | I/O — User I/O pin, bank 4 |
| Broche 102 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 103 | I/O — User I/O pin, bank 4 |
| Broche 104 | I/O — User I/O pin, bank 4 |
| Broche 105 | I/O — User I/O pin, bank 4 |
| Broche 106 | GND — Ground |
| Broche 107 | I/O — User I/O pin, bank 4 |
| Broche 108 | I/O — User I/O pin, bank 4 |
| Broche 109 | I/O — User I/O pin, bank 4 |
| Broche 110 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 111 | I/O — User I/O pin, bank 4 |
| Broche 112 | I/O — User I/O pin, bank 4 |
| Broche 113 | I/O — User I/O pin, bank 4 |
| Broche 114 | GND — Ground |
| Broche 115 | MSEL0 — Configuration mode select bit 0 |
| Broche 116 | MSEL1 — Configuration mode select bit 1 |
| Broche 117 | MSEL2 — Configuration mode select bit 2 |
| Broche 118 | TCK — JTAG test clock input |
| Broche 119 | TMS — JTAG test mode select input |
| Broche 120 | TDI — JTAG test data input |
| Broche 121 | TDO — JTAG test data output |
| Broche 122 | nCE — Chip enable (active low) |
| Broche 123 | nCONFIG — Configuration control (active low) |
| Broche 124 | nSTATUS — Configuration status (active low) |
| Broche 125 | CONF_DONE — Configuration done indicator |
| Broche 126 | DCLK — Configuration clock input |
| Broche 127 | DATA0 — Configuration data input bit 0 |
| Broche 128 | VCCINT — Core voltage 1.2 V supply |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — User I/O pin, bank 8 |
| Broche 131 | I/O — User I/O pin, bank 8 |
| Broche 132 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 133 | I/O — User I/O pin, bank 8 |
| Broche 134 | I/O — User I/O pin, bank 8 |
| Broche 135 | I/O — User I/O pin, bank 8 |
| Broche 136 | GND — Ground |
| Broche 137 | I/O — User I/O pin, bank 8 |
| Broche 138 | I/O — User I/O pin, bank 8 |
| Broche 139 | I/O — User I/O pin, bank 8 |
| Broche 140 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 141 | I/O — User I/O pin, bank 8 |
| Broche 142 | I/O — User I/O pin, bank 8 |
| Broche 143 | I/O — User I/O pin, bank 8 |
| Broche 144 | GND — Ground |
Applications typiques
EP2C8T144I8N convient pour 6 applications: Industrial Motor Control, Video Processing Bridges, Communications Glue Logic, FPGA Education and Training Platforms, Prototype ASIC Replacement, Legacy Industrial System Maintenance.
Industrial Motor Control
The EP2C8T144I8N is well suited to industrial motor control inverter logic where its 8,256 logic elements can implement field-oriented control (FOC) state machines, PWM generators, and encoder interfaces simultaneously on a single die. Its 36 embedded 18x18 multipliers execute the Clarke and Park transforms plus the inverse Park transform needed for stator current control, while the 85 user I/O pins accommodate three-phase PWM outputs, incremental encoder inputs, and parallel current-sense ADC interfaces. The industrial -40C to +100C temperature grade tolerates cabinet-mounted factory environments without derating. Designers should pair the FPGA with external gate drivers such as the IR2110 or UCC27211 because the FPGA outputs cannot directly switch the IGBT or SiC module gates.
Recommandé
Video Processing Bridges
The EP2C8T144I8N serves as a video format bridge converting between DVI, HDMI, VGA, and LVDS display interfaces in mid-complexity digital signage and industrial display products. The 165,888 bits of embedded RAM organize as 36 M4K blocks to implement line buffers for resolution scaling and frame-rate conversion, while the 36 18x18 multipliers accelerate color-space conversion from YCbCr to RGB. The 144-TQFP package exposes 85 user I/O pins, enough for 24-bit parallel RGB plus control signals and the LVDS link. Cyclone II has no hard HDMI transceiver, so external TFP410 / TFP401A serializer chips or ADV7513 HDMI transmitters handle the physical layer while the FPGA manages pixel clock generation and timing.
Recommandé
Communications Glue Logic
In telecom and networking hardware the EP2C8T144I8N provides protocol conversion and front-panel glue logic between ASICs, network processors, and SERDES devices. Its two PLLs generate the multiple clock domains typical in communications backplanes, while the 8K logic elements implement stateful protocol handlers for SPI, I2C, UART, MDIO, and PCIe-style sideband signals. The 85 user I/O pins easily accommodate 16-bit parallel buses plus differential LVDS pairs for inter-board links. Cyclone II lacks multi-gigabit transceivers, so the part is appropriate for control-plane glue rather than data-path packet processing, where it can replace a stack of discrete 74-series logic.
Recommandé
FPGA Education and Training Platforms
The EP2C8T144I8N appears in university FPGA teaching labs and on open-spec development boards where students learn Verilog and VHDL digital design. The 8K-LE density is large enough to host an entire 32-bit RISC-V soft core, a VGA framebuffer, and a UART bootloader simultaneously, yet small enough to fit comfortably in the Quartus II toolchain's free Web Edition license. The 144-TQFP package is hand-solderable with care on breakout boards, and the industrial temperature grade lets the same board survive laboratory and maker-fair environments. The mature Cyclone II device support in older Quartus versions means legacy lab tutorials and reference designs remain directly compilable for the part.
Recommandé
Prototype ASIC Replacement
Designers use the EP2C8T144I8N as a prototype vehicle for ASIC designs that have not yet taped out, allowing pre-silicon firmware development and system integration testing on real hardware. The Cyclone II silicon integrates 165 Kbits of RAM and 36 multipliers sufficient to model many common ASIC IP blocks, and the Quartus II toolchain provides full timing closure visibility so that ASIC sign-off scripts can be back-annotated. The 144-TQFP package exposes 85 user I/O pins that map comfortably onto typical ASIC ball-outs after a small interposer board, and the industrial temperature grade lets the prototype go into environmental chambers that mimic final product conditions.
Recommandé
Legacy Industrial System Maintenance
Long-lifecycle industrial systems installed in the late 2000s and early 2010s often contain Cyclone II FPGAs whose original bill of materials has since been discontinued, and the EP2C8T144I8N supports the field-replacement market for these products. The part's identical pin-out and Quartus II compatibility mean that a field engineer can swap a failed FPGA with a fresh unit loaded from the original programming file without board rework. The 144-TQFP footprint is well-documented in legacy design files, and remaining last-time-buy inventory on the open market supports repair depots through approximately the end of the decade.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C8T144I8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C8T144I8 | EP2C8T144C8N | EP2C8T144C7N | EP2C8T144C6N | EP2C5T144I8N | EP2C8AT144I8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP (TQFP-144) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 (-44%) | 8,256 |
| Total Memory Bits | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 | 119,808 | 165,888 |
| Embedded Multipliers (18x18) | 36 | 36 | 36 | 36 | 36 | 23 (-36%) | 36 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Automotive AEC-Q100 |
| Speed Grade | -8 | -8 | -8 | -7 (slower) | -6 (slowest) | -8 | -8 |
| Maximum User I/O | 85 | 85 | 85 | 85 | 85 | 89 (slightly more due to package) | 85 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Industrial temperature grade in the Cyclone II 8K-LE class (vs EP2C8T144C8N)
- Higher density than the EP2C5T144I8N in the same package (vs EP2C5T144I8N)
- Automotive-grade option exists with identical silicon (vs EP2C8AT144I8N)
Notes de conception
The EP2C8T144I8N requires a low-noise 1.2 V core supply on every VCCINT pin plus per-bank VCCIO supplies of 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard in use. Per the Cyclone II Device Handbook, place one 0.1 uF X7R ceramic bypass capacitor directly adjacent to every VCCINT and VCCIO pin pair, supplemented by a single 100 uF bulk tantalum or aluminum-polymer capacitor at the regulator output. Estimated: the 8K-LE Cyclone II typically draws 200 mA to 400 mA on VCCINT at 100 percent toggle activity, so the 1.2 V regulator must deliver at least 500 mA with 50 mV peak-to-peak ripple.
Route the JTAG chain (TCK, TMS, TDI, TDO) on the top layer with a continuous ground return path immediately below, and keep trace lengths matched to within 50 mil to avoid timing skew during boundary-scan testing. The MSEL[2:0] pins must be tied to VCCIO8 or GND through 4.7 K resistors and not left floating, since a floating MSEL can cause the device to enter an undefined configuration mode and appear as a configuration failure. Place the EPCS configuration flash within 4 inches of the FPGA DATA0 / DCLK pins to avoid signal-integrity issues during AS-mode boot.
The 144-pin TQFP package has no exposed thermal pad, so heat removal relies entirely on copper pours connected to the GND pins and forced airflow. Estimated: at 100 percent LE utilization and 100 MHz toggle rate, the part dissipates approximately 0.5 W to 1.0 W; this is manageable in a properly ventilated industrial enclosure but should be verified with a thermal probe at maximum ambient. Designers should fill unused package area with a continuous GND copper pour stitched with vias to the inner ground plane.
Do not leave unused I/O pins floating in the Quartus II pin planner - set them to 'As input tri-stated with weak pull-up' via Device Options, otherwise the inputs can float into the linear region and draw extra supply current during configuration. Cyclone II does not support hot-socketing on JTAG pins, so add 4.7 K series resistors on TCK, TMS, TDI, and TDO if the board will be mated while powered. Configuration failures from corrupted bitstreams are almost always traced to insufficient VCCINT decoupling or to a CONFIG_DONE pin pulled low by leakage; verify both before assuming a silicon failure.
LVDS outputs on the EP2C8T144I8N require a 100 ohm differential termination resistor placed within 250 mil of the receiver input, and the differential pair must be routed with a 100 ohm controlled-impedance trace on a stripline or microstrip layer stack. Single-ended I/O signals exceeding 50 MHz should be series-terminated at the source with a 33 ohm resistor to dampen reflections on long traces. Use the Quartus II TimeQuest timing analyzer with a properly constrained SDC file to verify all paths meet setup and hold requirements before generating the final bitstream.
Informations de conformité
RoHS and lead-free per Altera / Intel product page. The standard EP2C8T144I8N is not AEC-Q100 qualified; the EP2C8AT144I8N variant carries automotive qualification. Halogen-free status not explicitly stated in the verified data.