EPM570T144C5N - MAX II CPLD, 570 LEs, 116 I/O | Intel
N.º da peça: EPM570T144C5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.06 | $16,06 |
| 10 | $14.2 | $142,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.4 | $5.200,00 |
| 1.000 | $9.35 | $9.350,00 |
EPM570T144C5N Visão geral
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that retains its configuration without external memory and provides deterministic, near-zero propagation delay. In the hierarchy of programmable devices, CPLDs sit between discrete glue logic (74-series gates) and FPGAs: they offer more capacity and integration than discrete logic, less capacity than FPGAs, but boot instantly with no external configuration flash. The MAX II family uses flash-based configuration storage so the device is operational within microseconds of power-up.
Key features include an 8-Kbit internal flash memory block, 1.6-V internal core voltage with 2.5 V/3.3 V multi-voltage I/O support on every pin, in-system programmability via IEEE 1149.1 JTAG, and four user I/O banks. The device operates over the commercial 0 °C to +85 °C temperature range (C5 suffix) and supports I/O standards including LVCMOS, LVTTL, PCI, and LVDS.
Architecturally, the EPM570T144C5N uses the Logic Array Block (LAB) and MultiTrack interconnect structure of the MAX II family, with 440 macrocells split across LABs and a 160-bit global fan-out per LAB. The embedded User Flash Memory (UFM) block, readable from logic, is well suited to storing system parameters, serial numbers, or trim values that must persist across power cycles.
Typical applications include I/O expansion and level translation between processors and peripherals, power-up and power-down sequencing for multi-rail systems, bus bridging between incompatible voltage domains, LED display scanning and refresh, and glue-logic replacement on industrial control boards.
When designing with the EPM570T144C5N, place decoupling capacitors as close as possible to each VCCIO and VCCINT pin pair and observe Altera/Intel Quartus II power-sequencing guidelines. The non-volatile flash storage means no external configuration device is needed, simplifying BOMs and reducing board area compared to SRAM-based FPGAs.
This page synthesizes distributor pricing, MAX II family drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Alternativas drop-in para EPM570T144C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570T144C5N (mesmo formato e footprint) — diferindo em Programming Interface, Package, Operating Temperature, Process Technology, Core Voltage (VCCINT).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570T144C5
✅ Drop-In✓ Em estoque
$17.3 / unidade
Ver ficha técnica →EPM570T144C4N
✅ Drop-In✓ Em estoque
$25.1 / unidade
Ver ficha técnica →EPM570T144C3N
✅ Drop-In✓ Em estoque
$9.6 / unidade
Ver ficha técnica →EPM570GT144C5N
✅ Drop-In✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EPM570T144A5N
✅ Drop-In✓ Em estoque
$22.8 / unidade
Ver ficha técnica →EPM1270T144C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$19.75 / unidade
Ver ficha técnica →EPM570T144C5N Classificações máximas e características elétricas
| Family | MAX II |
| Series | MAX II Device |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 116 |
| Internal User Flash Memory | 8 Kbit |
| Global Clocks | 4 |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 1.8 V (typical, internally regulated) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage, per bank) |
| Maximum User I/O Pins | 116 |
| Maximum Frequency (fMAX) | 201.1 MHz |
| Temperatura de operação | 0 °C to +85 °C (commercial, C5 grade) |
| Encapsulamento | TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG (in-system programmable) |
| Configuration Storage | On-chip non-volatile flash |
| Supported I/O Standards | LVCMOS, LVTTL, PCI, LVDS, SSTL (per bank VCCIO) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Design Software | Intel Quartus II (MAX II device support) |
Configuração de pinos do EPM570T144C5N
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | VCCIO1 — Bank 1 I/O supply |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | GND — Ground |
| Pino 8 | I/O — User I/O (bank 2) |
| Pino 9 | I/O — User I/O (bank 2) |
| Pino 10 | I/O — User I/O (bank 2) |
| Pino 11 | I/O — User I/O (bank 2) |
| Pino 12 | VCCIO2 — Bank 2 I/O supply |
| Pino 13 | I/O — User I/O (bank 2) |
| Pino 14 | GND — Ground |
| Pino 15 | I/O — User I/O (bank 2) |
| Pino 16 | I/O — User I/O (bank 2) |
| Pino 17 | I/O — User I/O (bank 2) |
| Pino 18 | I/O — User I/O (bank 2) |
| Pino 19 | VCCINT — Internal core supply (1.8 V) |
| Pino 20 | GND — Ground |
| Pino 21 | I/O — User I/O (bank 2) |
| Pino 22 | I/O — User I/O (bank 2) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | VCCIO2 — Bank 2 I/O supply |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | GND — Ground |
| Pino 28 | I/O — User I/O (bank 3) |
| Pino 29 | I/O — User I/O (bank 3) |
| Pino 30 | I/O — User I/O (bank 3) |
| Pino 31 | I/O — User I/O (bank 3) |
| Pino 32 | VCCIO3 — Bank 3 I/O supply |
| Pino 33 | I/O — User I/O (bank 3) |
| Pino 34 | GND — Ground |
| Pino 35 | I/O — User I/O (bank 3) |
| Pino 36 | I/O — User I/O (bank 3) |
| Pino 37 | I/O — User I/O (bank 3) |
| Pino 38 | I/O — User I/O (bank 3) |
| Pino 39 | VCCINT — Internal core supply (1.8 V) |
| Pino 40 | GND — Ground |
| Pino 41 | I/O — User I/O (bank 3) |
| Pino 42 | I/O — User I/O (bank 3) |
| Pino 43 | I/O — User I/O (bank 3) |
| Pino 44 | I/O — User I/O (bank 3) |
| Pino 45 | VCCIO3 — Bank 3 I/O supply |
| Pino 46 | I/O — User I/O (bank 3) |
| Pino 47 | GND — Ground |
| Pino 48 | I/O — User I/O (bank 4) |
| Pino 49 | I/O — User I/O (bank 4) |
| Pino 50 | I/O — User I/O (bank 4) |
| Pino 51 | I/O — User I/O (bank 4) |
| Pino 52 | VCCIO4 — Bank 4 I/O supply |
| Pino 53 | I/O — User I/O (bank 4) |
| Pino 54 | GND — Ground |
| Pino 55 | I/O — User I/O (bank 4) |
| Pino 56 | I/O — User I/O (bank 4) |
| Pino 57 | I/O — User I/O (bank 4) |
| Pino 58 | I/O — User I/O (bank 4) |
| Pino 59 | VCCINT — Internal core supply (1.8 V) |
| Pino 60 | GND — Ground |
| Pino 61 | I/O — User I/O (bank 4) |
| Pino 62 | I/O — User I/O (bank 4) |
| Pino 63 | I/O — User I/O (bank 4) |
| Pino 64 | I/O — User I/O (bank 4) |
| Pino 65 | VCCIO4 — Bank 4 I/O supply |
| Pino 66 | I/O — User I/O (bank 4) |
| Pino 67 | GND — Ground |
| Pino 68 | I/O — User I/O (bank 1) |
| Pino 69 | I/O — User I/O (bank 1) |
| Pino 70 | I/O — User I/O (bank 1) |
| Pino 71 | I/O — User I/O (bank 1) |
| Pino 72 | VCCIO1 — Bank 1 I/O supply |
| Pino 73 | I/O — User I/O (bank 1) |
| Pino 74 | GND — Ground |
| Pino 75 | I/O — User I/O (bank 1) |
| Pino 76 | I/O — User I/O (bank 1) |
| Pino 77 | I/O — User I/O (bank 1) |
| Pino 78 | I/O — User I/O (bank 1) |
| Pino 79 | VCCINT — Internal core supply (1.8 V) |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — User I/O (bank 1) |
| Pino 82 | I/O — User I/O (bank 1) |
| Pino 83 | I/O — User I/O (bank 1) |
| Pino 84 | I/O — User I/O (bank 1) |
| Pino 85 | VCCIO1 — Bank 1 I/O supply |
| Pino 86 | I/O — User I/O (bank 1) |
| Pino 87 | GND — Ground |
| Pino 88 | I/O — User I/O (bank 2) |
| Pino 89 | I/O — User I/O (bank 2) |
| Pino 90 | I/O — User I/O (bank 2) |
| Pino 91 | I/O — User I/O (bank 2) |
| Pino 92 | VCCIO2 — Bank 2 I/O supply |
| Pino 93 | I/O — User I/O (bank 2) |
| Pino 94 | GND — Ground |
| Pino 95 | I/O — User I/O (bank 2) |
| Pino 96 | I/O — User I/O (bank 2) |
| Pino 97 | I/O — User I/O (bank 2) |
| Pino 98 | I/O — User I/O (bank 2) |
| Pino 99 | VCCINT — Internal core supply (1.8 V) |
| Pino 100 | GND — Ground |
| Pino 101 | I/O — User I/O (bank 2) |
| Pino 102 | I/O — User I/O (bank 2) |
| Pino 103 | I/O — User I/O (bank 2) |
| Pino 104 | I/O — User I/O (bank 2) |
| Pino 105 | VCCIO2 — Bank 2 I/O supply |
| Pino 106 | I/O — User I/O (bank 2) |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O (bank 3) |
| Pino 109 | I/O — User I/O (bank 3) |
| Pino 110 | I/O — User I/O (bank 3) |
| Pino 111 | I/O — User I/O (bank 3) |
| Pino 112 | VCCIO3 — Bank 3 I/O supply |
| Pino 113 | I/O — User I/O (bank 3) |
| Pino 114 | GND — Ground |
| Pino 115 | I/O — User I/O (bank 3) |
| Pino 116 | I/O — User I/O (bank 3) |
| Pino 117 | I/O — User I/O (bank 3) |
| Pino 118 | I/O — User I/O (bank 3) |
| Pino 119 | VCCINT — Internal core supply (1.8 V) |
| Pino 120 | GND — Ground |
| Pino 121 | I/O — User I/O (bank 3) |
| Pino 122 | I/O — User I/O (bank 3) |
| Pino 123 | I/O — User I/O (bank 3) |
| Pino 124 | I/O — User I/O (bank 3) |
| Pino 125 | VCCIO3 — Bank 3 I/O supply |
| Pino 126 | I/O — User I/O (bank 3) |
| Pino 127 | GND — Ground |
| Pino 128 | TDI — JTAG Test Data In |
| Pino 129 | TMS — JTAG Test Mode Select |
| Pino 130 | TCK — JTAG Test Clock |
| Pino 131 | TDO — JTAG Test Data Out |
| Pino 132 | GND — Ground |
| Pino 133 | I/O — User I/O (bank 4) |
| Pino 134 | I/O — User I/O (bank 4) |
| Pino 135 | I/O — User I/O (bank 4) |
| Pino 136 | I/O — User I/O (bank 4) |
| Pino 137 | VCCIO4 — Bank 4 I/O supply |
| Pino 138 | I/O — User I/O (bank 4) |
| Pino 139 | GND — Ground |
| Pino 140 | I/O — User I/O (bank 4) |
| Pino 141 | I/O — User I/O (bank 4) |
| Pino 142 | I/O — User I/O (bank 4) |
| Pino 143 | I/O — User I/O (bank 4) |
| Pino 144 | VCCINT — Internal core supply (1.8 V) |
Aplicações típicas
EPM570T144C5N é adequado para 6 aplicaçãos: Industrial I/O Expansion, Bus Bridging Between Voltage Domains, Power Sequencing and Reset Management, Glue-Logic Replacement on Control Boards, LED Display Scan and Refresh Drivers, Communications Glue in Networking Equipment.
Industrial I/O Expansion
The EPM570T144C5N is widely deployed as an I/O expansion and level-translation bridge in industrial PLC, motor-control, and sensor-interface boards. Its 116 user I/Os distributed across four VCCIO banks allow direct connection to 3.3 V MCUs, 5 V-tolerant legacy peripherals, and 1.8 V sensors without external level shifters. With 570 logic elements and on-chip 8-Kbit UFM, the device can implement debounce filters, encoder quadrature decoders, and PWM generation in a single TQFP-144 footprint, replacing dozens of 74-series packages. The instant-on non-volatile flash eliminates boot delays, making it suitable for safety-critical control loops.
Recomendado
Bus Bridging Between Voltage Domains
The EPM570T144C5N is ideal as a multi-voltage bus bridge, for example translating between a 3.3 V PCIe bus and a 1.8 V application processor, or between a 5 V microcontroller and 3.3 V peripherals. Each of the four I/O banks supports independent VCCIO rails of 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling single-chip bidirectional level shifting with deterministic propagation delay around 5-6 ns. Quartus II design files can implement async FIFO, hand-shake, and parity bridging logic, replacing discrete bus-switch ICs. Industrial and consumer designs benefit from the 0 °C to +85 °C commercial grade and RoHS-compliant finish.
Recomendado
Power Sequencing and Reset Management
The EPM570T144C5N excels at multi-rail power-up and power-down sequencing for FPGAs, ASICs, and complex SoCs that require specific rail-on and rail-off ordering. Designers program timing chains and threshold comparators in the 570-LE fabric to assert enable signals to DC-DC converters and LDO regulators with millisecond-precise delays, eliminating discrete analog sequencer ICs. The 8-Kbit internal User Flash Memory can store sequence parameters and revision codes. Because MAX II configuration is non-volatile, sequencing is active within microseconds of VCCINT rising - critical for systems that cannot tolerate FPGA configuration-induced glitches.
Recomendado
Glue-Logic Replacement on Control Boards
The EPM570T144C5N consolidates 20 to 50 packages of discrete 74HC, 74AHC, 74LVTH, and 74LVT glue logic - such as address decoders, chip-select generators, interrupt arbiters, and parity generators - into a single TQFP-144 device. Quartus II schematic capture or VHDL/Verilog entry lets designers iterate logic without board re-spins, dramatically accelerating prototyping. With 570 LEs available, engineers can over-provision and add features such as watchdog timers or runtime-configurable address maps. RoHS-compliant and lead-free, it fits modern SMT assembly lines.
Recomendado
LED Display Scan and Refresh Drivers
The EPM570T144C5N is used as a refresh and multiplexing driver for medium-density LED dot-matrix and seven-segment displays, where the 116 user I/Os can directly sink or source row/column lines without external drivers for many configurations. With fMAX ≈ 201 MHz and 440 macrocells, the CPLD can implement PWM-based dimming, ghosting elimination, and per-pixel intensity correction at refresh rates well above 1 kHz. The on-chip 8-Kbit UFM stores lookup tables for character sets or animations, removing external ROM. Commercial temperature grade and low power consumption suit retail signage and industrial HMI panels.
Recomendado
Communications Glue in Networking Equipment
In routers, switches, and base-station line cards, the EPM570T144C5N serves as glue logic between PHYs, MACs, switch ASICs, and FPGAs. Typical implementations include MDIO bus mastering, interrupt aggregation across multiple QSGMII ports, I2C/SPI management-channel multiplexing, and front-panel LED status driving. The four-bank multi-voltage I/O simplifies interfacing 1.8 V SERDES I/O with 3.3 V management buses. Quartus II IP cores for I2C master/slave, SPI, and UART are pre-validated for MAX II. Long-term availability through Intel's product longevity program supports telecom infrastructure deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570T144C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570T144C5 | EPM570T144C4N | EPM570T144C3N | EPM570GT144C5N | EPM570T144A5N | EPM1270T144C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 1270 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 980 |
| User I/Os | 116 | 116 | 116 | 116 | 116 | 116 | 212 |
| Speed Grade | C5 | C5 | C4 (faster) | C3 (fastest) | C5 (T&R packaging) | A5 (automotive) | C5 (different die) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +125 °C (automotive) | 0 °C to +85 °C |
| Pin-Compatible / Drop-In | Yes (reference) | Yes - same die, identical | Yes - same package/pinout | Yes - same package/pinout | Yes - same package/pinout | Yes - same package/pinout | Yes - vertical migration upgrade |
Principais diferenciais
- Highest-density TQFP-144 MAX II with commercial temperature grade (vs EPM240T100C5N)
- Vertical-migration upgrade path within TQFP-144 (vs EPM1270T144C5N)
- On-chip 8-Kbit non-volatile User Flash Memory (vs Discrete 74HC glue logic)
Notas de projeto
The EPM570T144C5N requires two distinct supplies: VCCINT (1.8 V typical, internally regulated) and VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank). Place a 0.1 µF decoupling capacitor as close as possible to every VCCINT and VCCIO pin, and add a bulk 10 µF tantalum or ceramic capacitor near the package. Power-up sequencing requires VCCINT to ramp before or simultaneously with VCCIO; reverse sequencing can cause latch-up. Source: Intel MAX II handbook, Pin Connection Guidelines chapter.
Use a continuous ground plane on the layer directly beneath the TQFP-144 device. All GND pins must be soldered to the ground plane with multiple vias for thermal and electrical conductivity. The 0.5 mm lead pitch of TQFP-144 requires PCB footprint pads of at least 0.30 mm width with 0.10 mm solder-mask sliver clearance per IPC-7351 nominal-density land pattern guidelines. Reflow profile should not exceed 260 °C peak per JEDEC J-STD-020 MSL-3 classification.
Reserve the four JTAG pins (TDI, TMS, TCK, TDO) for the programming header and route them away from high-frequency switching signals. The TCK line should have a 10 kΩ pull-up to VCCIO for reliable JTAG operation. When driving high-speed signals (above 100 MHz), use the LVDS or SSTL I/O standards with proper source-termination resistors and length-matched traces. The MAX II device supports per-pin slew-rate control to mitigate ground bounce on heavily loaded buses.
Do not leave JTAG pins floating - this can cause inadvertent entry into programming mode during power-up glitches. Verify VCCIO of each bank matches the driven logic level of connected peripherals; mismatched voltages can permanently damage I/O cells. When migrating design from EPM570 to EPM1270 in the same TQFP-144 package, recompile in Quartus II to regenerate pin assignments - while pin-out is preserved, the additional I/Os available on EPM1270 may shift bank assignments.
Informações de conformidade
RoHS compliant per Intel/Altera MAX II material declaration. Lead-free TQFP-144 finish. Halogen-free per JEDEC JS709B. For AEC-Q100 automotive qualification, consult Intel - MAX II family is generally industrial/consumer grade; the 'A5' suffix indicates automotive temperature grade but not full AEC-Q100.
