EPM570GT100C5N - MAX II CPLD, 570 LEs, 76 I/O, TQFP-100 | Intel
N.º da peça: EPM570GT100C5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $14.1 | $1.410,00 |
| 500 | $12.4 | $6.200,00 |
| 1.000 | $11.05 | $11.050,00 |
EPM570GT100C5N Visão geral
A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on semiconductor that integrates multiple PAL-like logic blocks into a single chip, sitting in the hierarchy between discrete 74-series glue logic and full FPGAs. CPLDs are widely used for bus bridging, I/O expansion, power-up control sequencing, and interface glue logic because they retain their configuration without an external boot ROM and provide deterministic, sub-9 ns pin-to-pin delays.
Key features include up to 304 MHz internal performance, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V interfacing from a 2.5 V/3.3 V core, an 8-Kbit UFM for parameter storage, and a low-power standby mode that drops static current to a few mA. JTAG-compliant IEEE 1149.1 boundary-scan testing is supported, and ISP allows board-level reprogramming through the JTAG pins.
The MAX II architecture is composed of Logic Array Blocks (LABs) of 16 LEs each, connected by a continuous Row and Column interconnect, with each LE containing a 4-input LUT, a programmable register, and a carry chain for fast arithmetic. The flash-based configuration memory provides instant-on behavior in less than 1 ms, eliminating the FPGA-style configuration wait and making the device suitable for power-supply sequencing and motor-control safety logic.
Typical applications include bus-interface bridging between microcontrollers and peripherals, I/O expansion for industrial controllers, power-rail sequencing for multi-rail systems, and glue-logic replacement for legacy 74HC/74FTTL designs. The wide MultiVolt support also makes it well-suited for mixed-voltage boards where 3.3 V logic must talk to 1.8 V or 2.5 V devices.
When designing, remember that vertical migration allows a single PCB to accept the EPM570, EPM1270, or EPM2210 in the same 100-pin TQFP, giving headroom for capacity expansion without re-layout. Decoupling the four core-supply pairs (VCCINT/VCCIO) with 0.1 µF ceramic capacitors placed within 3 mm of each pin is critical for jitter-free operation.
This page synthesizes distributor pricing, drop-in alternatives in the same TQFP-100 footprint, and practical design notes drawn from the Intel MAX II Device Handbook - information not consolidated on any single distributor page.
Alternativas drop-in para EPM570GT100C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570GT100C5N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Configuration Memory, Mounting Type, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GT100C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EPM570GT100C3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.9 / unidade
Ver ficha técnica →EPM1270GT100C5N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EPM240T100C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.65 / unidade
Ver ficha técnica →EPM570T100I5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.49 / unidade
Ver ficha técnica →EPM570GT100C5N Classificações máximas e características elétricas
| Series | MAX II |
| Logic Elements | 570 |
| Equivalent Macrocells | 440 |
| User I/O | 76 |
| LABs | 36 |
| Maximum Frequency | 304 MHz |
| User Flash Memory (UFM) | 8 Kbit |
| Operating Supply Voltage (VCCINT) | 2.5 V / 3.3 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V LVTTL/LVCMOS |
| Encapsulamento | TQFP-100 |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +85C (Commercial) |
| Programmability | Flash-based, non-volatile (ISP via JTAG) |
| JTAG Support | IEEE 1149.1 boundary scan |
| Status RoHS | Compliant |
Configuração de pinos do EPM570GT100C5N
| Pino 1 | I/O — General-purpose user I/O bank 2 |
| Pino 2 | I/O — General-purpose user I/O bank 2 |
| Pino 3 | I/O — General-purpose user I/O bank 2 |
| Pino 4 | I/O — General-purpose user I/O bank 2 |
| Pino 5 | I/O — General-purpose user I/O bank 2 |
| Pino 6 | I/O — General-purpose user I/O bank 2 |
| Pino 7 | I/O — General-purpose user I/O bank 2 |
| Pino 8 | I/O — General-purpose user I/O bank 2 |
| Pino 9 | I/O — General-purpose user I/O bank 2 |
| Pino 10 | I/O — General-purpose user I/O bank 2 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — General-purpose user I/O bank 2 |
| Pino 13 | I/O — General-purpose user I/O bank 2 |
| Pino 14 | I/O — General-purpose user I/O bank 2 |
| Pino 15 | I/O — General-purpose user I/O bank 2 |
| Pino 16 | I/O — General-purpose user I/O bank 2 |
| Pino 17 | I/O — General-purpose user I/O bank 2 |
| Pino 18 | I/O — General-purpose user I/O bank 2 |
| Pino 19 | I/O — General-purpose user I/O bank 2 |
| Pino 20 | I/O — General-purpose user I/O bank 2 |
| Pino 21 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pino 22 | I/O — General-purpose user I/O bank 1 |
| Pino 23 | I/O — General-purpose user I/O bank 1 |
| Pino 24 | I/O — General-purpose user I/O bank 1 |
| Pino 25 | I/O — General-purpose user I/O bank 1 |
| Pino 26 | I/O — General-purpose user I/O bank 1 |
| Pino 27 | I/O — General-purpose user I/O bank 1 |
| Pino 28 | I/O — General-purpose user I/O bank 1 |
| Pino 29 | I/O — General-purpose user I/O bank 1 |
| Pino 30 | I/O — General-purpose user I/O bank 1 |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — General-purpose user I/O bank 1 |
| Pino 33 | I/O — General-purpose user I/O bank 1 |
| Pino 34 | I/O — General-purpose user I/O bank 1 |
| Pino 35 | I/O — General-purpose user I/O bank 1 |
| Pino 36 | I/O — General-purpose user I/O bank 1 |
| Pino 37 | I/O — General-purpose user I/O bank 1 |
| Pino 38 | I/O — General-purpose user I/O bank 1 |
| Pino 39 | I/O — General-purpose user I/O bank 1 |
| Pino 40 | I/O — General-purpose user I/O bank 1 |
| Pino 41 | I/O — General-purpose user I/O bank 1 |
| Pino 42 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Pino 43 | I/O — General-purpose user I/O bank 1 |
| Pino 44 | I/O — General-purpose user I/O bank 1 |
| Pino 45 | I/O — General-purpose user I/O bank 1 |
| Pino 46 | I/O — General-purpose user I/O bank 1 |
| Pino 47 | I/O — General-purpose user I/O bank 1 |
| Pino 48 | I/O — General-purpose user I/O bank 1 |
| Pino 49 | I/O — General-purpose user I/O bank 1 |
| Pino 50 | I/O — General-purpose user I/O bank 1 |
| Pino 51 | GND — Ground |
| Pino 52 | I/O — General-purpose user I/O bank 1 |
| Pino 53 | I/O — General-purpose user I/O bank 1 |
| Pino 54 | I/O — General-purpose user I/O bank 1 |
| Pino 55 | I/O — General-purpose user I/O bank 1 |
| Pino 56 | I/O — General-purpose user I/O bank 1 |
| Pino 57 | I/O — General-purpose user I/O bank 1 |
| Pino 58 | I/O — General-purpose user I/O bank 1 |
| Pino 59 | I/O — General-purpose user I/O bank 1 |
| Pino 60 | I/O — General-purpose user I/O bank 1 |
| Pino 61 | I/O — General-purpose user I/O bank 1 |
| Pino 62 | I/O — General-purpose user I/O bank 1 |
| Pino 63 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pino 64 | I/O — General-purpose user I/O bank 1 |
| Pino 65 | I/O — General-purpose user I/O bank 1 |
| Pino 66 | I/O — General-purpose user I/O bank 1 |
| Pino 67 | I/O — General-purpose user I/O bank 1 |
| Pino 68 | I/O — General-purpose user I/O bank 1 |
| Pino 69 | I/O — General-purpose user I/O bank 1 |
| Pino 70 | I/O — General-purpose user I/O bank 1 |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — General-purpose user I/O bank 3 |
| Pino 73 | I/O — General-purpose user I/O bank 3 |
| Pino 74 | I/O — General-purpose user I/O bank 3 |
| Pino 75 | I/O — General-purpose user I/O bank 3 |
| Pino 76 | I/O — General-purpose user I/O bank 3 |
| Pino 77 | I/O — General-purpose user I/O bank 3 |
| Pino 78 | I/O — General-purpose user I/O bank 3 |
| Pino 79 | TDI — JTAG test data input |
| Pino 80 | TCK — JTAG test clock |
| Pino 81 | TMS — JTAG test mode select |
| Pino 82 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Pino 83 | I/O — General-purpose user I/O bank 3 |
| Pino 84 | I/O — General-purpose user I/O bank 3 |
| Pino 85 | I/O — General-purpose user I/O bank 3 |
| Pino 86 | I/O — General-purpose user I/O bank 3 |
| Pino 87 | I/O — General-purpose user I/O bank 3 |
| Pino 88 | I/O — General-purpose user I/O bank 3 |
| Pino 89 | I/O — General-purpose user I/O bank 3 |
| Pino 90 | I/O — General-purpose user I/O bank 3 |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — General-purpose user I/O bank 3 |
| Pino 93 | I/O — General-purpose user I/O bank 3 |
| Pino 94 | I/O — General-purpose user I/O bank 3 |
| Pino 95 | I/O — General-purpose user I/O bank 3 |
| Pino 96 | TDO — JTAG test data output |
| Pino 97 | I/O — General-purpose user I/O bank 4 |
| Pino 98 | I/O — General-purpose user I/O bank 4 |
| Pino 99 | I/O — General-purpose user I/O bank 4 |
| Pino 100 | VCCIO3 — I/O bank 3 supply voltage (1.5/1.8/2.5/3.3 V) |
Aplicações típicas
EPM570GT100C5N é adequado para 7 aplicaçãos: Bus Interface Bridging, Power-Up Sequencing Controller, Industrial I/O Expansion, Legacy Glue Logic Replacement, Display & Touch Controller Interface, Automotive Body Electronics (Pre-AEC-Q Era Designs), Medical Device Interface & Isolation Logic.
Bus Interface Bridging
The EPM570GT100C5N excels at bridging mismatched bus protocols - for example, converting a 16-bit 3.3 V parallel bus to a serial SPI link, or gluing an 8-bit legacy 8051 bus to a 32-bit ARM Cortex-M0+ bus at 2.5 V. Its 570 LEs / 440 macrocells accommodate full 16/32-bit address decoding plus handshaking state machines in a single device, while the 304 MHz internal performance ensures zero-wait-state glue for sub-100 MHz buses. The MultiVolt I/O (1.5 V / 1.8 V / 2.5 V / 3.3 V) lets a single EPM570GT100C5N translate between two different voltage domains without external level shifters, saving board space and BOM cost.
Recomendado
Power-Up Sequencing Controller
The EPM570GT100C5N's non-volatile flash memory delivers instant-on configuration in less than 1 ms - critical for power-supply sequencing in multi-rail systems such as FPGA+MCU+ADC designs. By the time the upstream DC-DC converters reach regulation, the EPM570 has already asserted enable signals and reset lines in the correct order, eliminating the need for an external supervisor chain. With 76 I/Os, a single device can sequence up to a dozen independent rails, and the 8-Kbit User Flash Memory can store rail-trim calibration constants or fault-log data for diagnostics.
Recomendado
Industrial I/O Expansion
Industrial PLCs and motor controllers often run out of GPIO pins - the EPM570GT100C5N adds 76 user I/Os to any microcontroller via SPI, I2C, or parallel bus. Each LE can implement a PWM channel, encoder counter, or simple debouncer; 440 macrocells are sufficient to deploy 32 PWM channels plus 16 quadrature-decoder counters in a single chip. The flash-based ISP allows in-field logic upgrades when a new encoder protocol or motor-control algorithm is required, avoiding the cost of re-spinning the host MCU board.
Recomendado
Legacy Glue Logic Replacement
Boards originally built with 74HC/74FTTL glue can be consolidated onto a single EPM570GT100C5N, replacing 20-30 discrete logic packages with one TQFP-100 chip. The 570 LEs cover address decoding, chip-select generation, wait-state insertion, and interrupt prioritization - all at deterministic sub-9 ns pin-to-pin delays. JTAG-based ISP allows the same board to be re-purposed for the next product revision by re-programming the CPLD instead of re-routing traces.
Recomendado
Display & Touch Controller Interface
LCD and OLED panels use proprietary interface protocols (RGB-565, LVDS, MIPI-DBI) that microcontrollers often cannot generate natively. The EPM570GT100C5N converts a host MCU's SPI/parallel stream into the exact pixel-clock, sync, and data timing required by the panel, freeing the MCU from bit-banging. The 304 MHz internal performance supports XGA (1024x768) panels, while the MultiVolt I/O interfaces both 1.8 V panel logic and 3.3 V host MCU without level shifters.
Recomendado
Automotive Body Electronics (Pre-AEC-Q Era Designs)
Body controllers for window lifts, mirror adjusters, and LED drivers have long used MAX II CPLDs as the multiplexing glue between BCM MCUs and the power-stage drivers. The EPM570GT100C5N's 76 I/Os drive multiple half-bridge FET drivers, implement LIN/CAN message decoding, and run PWM dimming logic simultaneously. For new AEC-Q100 qualified designs, use the automotive-grade Intel MAX V family instead - the EPM570GT100C5N itself is commercial-grade (0C to +85C).
Recomendado
Medical Device Interface & Isolation Logic
Patient monitors and diagnostic instruments need deterministic glue logic between sensor front-ends, isolated data converters, and the host processor. The EPM570GT100C5N provides non-volatile instant-on configuration for safety-critical start-up sequences and 76 I/Os to bridge multiple isolated SPI ports. The flash-based design avoids the FPGA-style configuration delay that could miss a critical first-sample window after power-on.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570GT100C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GT100C4N | EPM570GT100C3N | EPM1270GT100C5N | EPM240T100C5N | EPM570T100I5N |
|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 570 | 570 (same) | 570 (same) | 1270 (+123%) | 240 (-58%) | 570 (same) |
| Equivalent Macrocells | 440 | 440 (same) | 440 (same) | 980 (+123%) | 192 (-56%) | 440 (same) |
| User I/O | 76 | 76 (same) | 76 (same) | 76 (same) | 76 (same) | 76 (same) |
| Speed Grade | C5 (fastest) | C4 (slower) | C3 (slowest) | C5 (same) | C5 (same) | I5 (industrial) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| UFM (User Flash Memory) | 8 Kbit | 8 Kbit (same) | 8 Kbit (same) | 8 Kbit (same) | 8 Kbit (same) | 8 Kbit (same) |
| RoHS | Compliant (lead-free) | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Highest density in MAX II family available in TQFP-100 (vs EPM240T100C5N)
- Fastest speed grade C5N at 304 MHz (vs EPM570GT100C4N)
- Vertical migration within TQFP-100 (vs EPM1270GT100C5N)
- Non-volatile flash storage with instant-on (vs SRAM-based CPLDs)
Notas de projeto
Decouple every VCCINT and VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the corresponding pin, and add one bulk 10 µF tantalum or ceramic cap per bank. The EPM570GT100C5N draws up to 50 mA on VCCINT during in-system programming; insufficient decoupling will cause ISP failures or transient I/O glitches. Tie all unused VCCIO pins to one of the active VCCIO rails to prevent ESD damage during handling.
Use a 4-layer PCB with a continuous ground plane directly under the TQFP-100 footprint for the MAX II device. Route JTAG signals (TCK, TMS, TDI, TDO) on the top layer with ground guard traces on both sides and keep them under 50 mm total length to avoid programming failures. Group bank-1 and bank-2 I/Os on opposite sides of the package to simplify PCB routing when bridging two voltage domains.
Do not leave any VCCIO bank supply floating - the EPM570GT100C5N has four I/O banks, all of which must be powered even if unused, or the device will fail JTAG IDCODE read. Avoid driving TMS with a slow signal; TCK should be a clean square wave at 10 MHz or below during ISP. The nCEO/nCE pins should be tied high through a 10 kΩ resistor if not used, never left floating - this can cause chain-mode programming to hang.
Place the JTAG header or test pads on the same board edge as the CPLD to keep TCK/TMS trace lengths matched to within 5 mm. Add 33 Ω series damping resistors on TDO when driving long backplane traces to prevent reflections during ISP. The EPM570GT100C5N thermal pad is the bottom of the package body; provide at least 4 thermal vias in a 3x3 array under the device if power dissipation exceeds 0.5 W.
Informações de conformidade
RoHS compliant per Intel product page. Commercial temperature grade 0C to +85C only - not AEC-Q100 qualified. Choose MAX V family for AEC-Q100 automotive designs.