EP4CE6E22C9L - Cyclone IV E FPGA, 6.3K LE, 144-LQFP | Intel
N.º da peça: EP4CE6E22C9L ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.09 | $14,09 |
| 10 | $12.85 | $128,50 |
| 100 | $11.4 | $1.140,00 |
| 500 | $9.95 | $4.975,00 |
| 1.000 | $8.75 | $8.750,00 |
EP4CE6E22C9L Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and I/O pads that can be reconfigured by the designer after manufacturing. FPGAs sit above fixed-function ASICs and microcontrollers in the programmable logic hierarchy, offering parallel processing, deterministic timing, and hardware-level flexibility for glue logic, digital signal processing, and custom interface bridging.
Key features of the EP4CE6E22C9L include 15 embedded 18x18 multipliers (up to 266 MHz), up to 270 Kbits of distributed RAM, configuration via standard serial/parallel modes, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V interfacing. The device family integrates PLL-based clock management and supports LVDS, SSTL, and LVTTL I/O standards.
The Cyclone IV E architecture uses a 60 nm process and emphasizes low static and dynamic power consumption, making it well-suited for battery-powered and thermally constrained embedded designs. The 144-LQFP exposed-pad package improves thermal dissipation and allows hand-solderable assembly for prototypes and low-volume builds.
Typical applications include industrial control and motor drives, video processing pipelines, software-defined radio front ends, portable test and measurement equipment, and LED display controllers. The combination of 6,272 logic elements and 91 user I/O provides headroom for medium-complexity glue logic, custom peripherals, and parallel DSP functions.
When designing with this device, ensure adequate decoupling on each VCCINT and VCCA rail and follow Intel's pin connection guidelines for the EP4CE6 family. The exposed pad must be soldered to a properly sized copper pour for thermal and electrical performance, especially when running the multipliers near their maximum frequency.
This page synthesizes drop-in alternatives, distributor pricing, and practical design considerations not consolidated in the manufacturer datasheet, helping engineers shorten evaluation cycles and avoid common PCB layout pitfalls.
Alternativas drop-in para EP4CE6E22C9L — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CE6E22C9L (mesmo formato e footprint) — diferindo em Package, Speed Grade, PLLs, RoHS Status, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4CE6E22C8N
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →EP4CE6E22C7N
✅ Drop-In✓ Em estoque
$18.5 / unidade
Ver ficha técnica →EP4CE6E22C6N
✅ Drop-In✓ Em estoque
$11.2 / unidade
Ver ficha técnica →EP4CE10E22C8N
✅ Drop-In✓ Em estoque
$11.1 / unidade
Ver ficha técnica →EP4CE15E22C8N
✅ Drop-In✓ Em estoque
$15.95 / unidade
Ver ficha técnica →EP4CE6E22A7N
✅ Drop-In✓ Em estoque
$17.4 / unidade
Ver ficha técnica →EP4CE6E22C9L Classificações máximas e características elétricas
| Series | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Total RAM Bits | 276,480 bits |
| Embedded Multipliers (18x18) | 15 |
| Maximum User I/O | 91 |
| Core Voltage (VCCINT) | 1.2 V |
| Encapsulamento | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm |
| Lead Pitch | 0.5 mm |
| Tipo de montagem | Surface Mount |
| Process Node | 60 nm |
| Temperatura de operação | 0C to +85C (Commercial) |
| Speed Grade | C9 |
| Status RoHS | Compliant |
Configuração de pinos do EP4CE6E22C9L
| Pino 1 | I/O — User I/O pin (bank-specific voltage) |
| Pino 2 | I/O — User I/O pin (bank-specific voltage) |
| Pino 3 | I/O — User I/O pin (bank-specific voltage) |
| Pino 4 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 5 | I/O — User I/O pin (bank-specific voltage) |
| Pino 6 | I/O — User I/O pin (bank-specific voltage) |
| Pino 7 | I/O — User I/O pin (bank-specific voltage) |
| Pino 8 | GND — Ground |
| Pino 9 | I/O — User I/O pin (bank-specific voltage) |
| Pino 10 | I/O — User I/O pin (bank-specific voltage) |
| Pino 11 | I/O — User I/O pin (bank-specific voltage) |
| Pino 12 | VCCINT — Core supply voltage (1.2 V) |
| Pino 13 | I/O — User I/O pin (bank-specific voltage) |
| Pino 14 | I/O — User I/O pin (bank-specific voltage) |
| Pino 15 | I/O — User I/O pin (bank-specific voltage) |
| Pino 16 | GND — Ground |
| Pino 17 | I/O — User I/O pin (bank-specific voltage) |
| Pino 18 | I/O — User I/O pin (bank-specific voltage) |
| Pino 19 | I/O — User I/O pin (bank-specific voltage) |
| Pino 20 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 21 | I/O — User I/O pin (bank-specific voltage) |
| Pino 22 | I/O — User I/O pin (bank-specific voltage) |
| Pino 23 | I/O — User I/O pin (bank-specific voltage) |
| Pino 24 | GND — Ground |
| Pino 25 | I/O — User I/O pin (bank-specific voltage) |
| Pino 26 | I/O — User I/O pin (bank-specific voltage) |
| Pino 27 | I/O — User I/O pin (bank-specific voltage) |
| Pino 28 | VCCINT — Core supply voltage (1.2 V) |
| Pino 29 | I/O — User I/O pin (bank-specific voltage) |
| Pino 30 | I/O — User I/O pin (bank-specific voltage) |
| Pino 31 | I/O — User I/O pin (bank-specific voltage) |
| Pino 32 | GND — Ground |
| Pino 33 | I/O — User I/O pin (bank-specific voltage) |
| Pino 34 | I/O — User I/O pin (bank-specific voltage) |
| Pino 35 | I/O — User I/O pin (bank-specific voltage) |
| Pino 36 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 37 | I/O — User I/O pin (bank-specific voltage) |
| Pino 38 | I/O — User I/O pin (bank-specific voltage) |
| Pino 39 | I/O — User I/O pin (bank-specific voltage) |
| Pino 40 | GND — Ground |
| Pino 41 | I/O — User I/O pin (bank-specific voltage) |
| Pino 42 | I/O — User I/O pin (bank-specific voltage) |
| Pino 43 | I/O — User I/O pin (bank-specific voltage) |
| Pino 44 | VCCINT — Core supply voltage (1.2 V) |
| Pino 45 | I/O — User I/O pin (bank-specific voltage) |
| Pino 46 | I/O — User I/O pin (bank-specific voltage) |
| Pino 47 | I/O — User I/O pin (bank-specific voltage) |
| Pino 48 | GND — Ground |
| Pino 49 | I/O — User I/O pin (bank-specific voltage) |
| Pino 50 | I/O — User I/O pin (bank-specific voltage) |
| Pino 51 | I/O — User I/O pin (bank-specific voltage) |
| Pino 52 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 53 | I/O — User I/O pin (bank-specific voltage) |
| Pino 54 | I/O — User I/O pin (bank-specific voltage) |
| Pino 55 | I/O — User I/O pin (bank-specific voltage) |
| Pino 56 | GND — Ground |
| Pino 57 | I/O — User I/O pin (bank-specific voltage) |
| Pino 58 | I/O — User I/O pin (bank-specific voltage) |
| Pino 59 | I/O — User I/O pin (bank-specific voltage) |
| Pino 60 | VCCINT — Core supply voltage (1.2 V) |
| Pino 61 | I/O — User I/O pin (bank-specific voltage) |
| Pino 62 | I/O — User I/O pin (bank-specific voltage) |
| Pino 63 | I/O — User I/O pin (bank-specific voltage) |
| Pino 64 | GND — Ground |
| Pino 65 | I/O — User I/O pin (bank-specific voltage) |
| Pino 66 | I/O — User I/O pin (bank-specific voltage) |
| Pino 67 | I/O — User I/O pin (bank-specific voltage) |
| Pino 68 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 69 | I/O — User I/O pin (bank-specific voltage) |
| Pino 70 | I/O — User I/O pin (bank-specific voltage) |
| Pino 71 | I/O — User I/O pin (bank-specific voltage) |
| Pino 72 | GND — Ground |
| Pino 73 | I/O — User I/O pin (bank-specific voltage) |
| Pino 74 | I/O — User I/O pin (bank-specific voltage) |
| Pino 75 | I/O — User I/O pin (bank-specific voltage) |
| Pino 76 | VCCINT — Core supply voltage (1.2 V) |
| Pino 77 | I/O — User I/O pin (bank-specific voltage) |
| Pino 78 | I/O — User I/O pin (bank-specific voltage) |
| Pino 79 | I/O — User I/O pin (bank-specific voltage) |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — User I/O pin (bank-specific voltage) |
| Pino 82 | I/O — User I/O pin (bank-specific voltage) |
| Pino 83 | I/O — User I/O pin (bank-specific voltage) |
| Pino 84 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 85 | I/O — User I/O pin (bank-specific voltage) |
| Pino 86 | I/O — User I/O pin (bank-specific voltage) |
| Pino 87 | I/O — User I/O pin (bank-specific voltage) |
| Pino 88 | GND — Ground |
| Pino 89 | I/O — User I/O pin (bank-specific voltage) |
| Pino 90 | I/O — User I/O pin (bank-specific voltage) |
| Pino 91 | I/O — User I/O pin (bank-specific voltage) |
| Pino 92 | VCCINT — Core supply voltage (1.2 V) |
| Pino 93 | I/O — User I/O pin (bank-specific voltage) |
| Pino 94 | I/O — User I/O pin (bank-specific voltage) |
| Pino 95 | I/O — User I/O pin (bank-specific voltage) |
| Pino 96 | GND — Ground |
| Pino 97 | I/O — User I/O pin (bank-specific voltage) |
| Pino 98 | I/O — User I/O pin (bank-specific voltage) |
| Pino 99 | I/O — User I/O pin (bank-specific voltage) |
| Pino 100 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 101 | I/O — User I/O pin (bank-specific voltage) |
| Pino 102 | I/O — User I/O pin (bank-specific voltage) |
| Pino 103 | I/O — User I/O pin (bank-specific voltage) |
| Pino 104 | GND — Ground |
| Pino 105 | I/O — User I/O pin (bank-specific voltage) |
| Pino 106 | I/O — User I/O pin (bank-specific voltage) |
| Pino 107 | I/O — User I/O pin (bank-specific voltage) |
| Pino 108 | VCCINT — Core supply voltage (1.2 V) |
| Pino 109 | I/O — User I/O pin (bank-specific voltage) |
| Pino 110 | I/O — User I/O pin (bank-specific voltage) |
| Pino 111 | I/O — User I/O pin (bank-specific voltage) |
| Pino 112 | GND — Ground |
| Pino 113 | I/O — User I/O pin (bank-specific voltage) |
| Pino 114 | I/O — User I/O pin (bank-specific voltage) |
| Pino 115 | I/O — User I/O pin (bank-specific voltage) |
| Pino 116 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 117 | I/O — User I/O pin (bank-specific voltage) |
| Pino 118 | I/O — User I/O pin (bank-specific voltage) |
| Pino 119 | I/O — User I/O pin (bank-specific voltage) |
| Pino 120 | GND — Ground |
| Pino 121 | I/O — User I/O pin (bank-specific voltage) |
| Pino 122 | I/O — User I/O pin (bank-specific voltage) |
| Pino 123 | I/O — User I/O pin (bank-specific voltage) |
| Pino 124 | VCCINT — Core supply voltage (1.2 V) |
| Pino 125 | I/O — User I/O pin (bank-specific voltage) |
| Pino 126 | I/O — User I/O pin (bank-specific voltage) |
| Pino 127 | I/O — User I/O pin (bank-specific voltage) |
| Pino 128 | GND — Ground |
| Pino 129 | I/O — User I/O pin (bank-specific voltage) |
| Pino 130 | I/O — User I/O pin (bank-specific voltage) |
| Pino 131 | I/O — User I/O pin (bank-specific voltage) |
| Pino 132 | VCCA_PLL — PLL analog supply voltage |
| Pino 133 | I/O — User I/O pin (bank-specific voltage) |
| Pino 134 | I/O — User I/O pin (bank-specific voltage) |
| Pino 135 | I/O — User I/O pin (bank-specific voltage) |
| Pino 136 | GND — Ground |
| Pino 137 | nCONFIG — Configuration control (active-low) |
| Pino 138 | nSTATUS — Configuration status (active-low) |
| Pino 139 | CONFIG_DONE — Configuration done signal |
| Pino 140 | TCK — JTAG test clock |
| Pino 141 | TMS — JTAG test mode select |
| Pino 142 | TDI — JTAG test data in |
| Pino 143 | TDO — JTAG test data out |
| Pino 144 | EPAD — Exposed thermal pad (tie to GND) |
Aplicações típicas
EP4CE6E22C9L é adequado para 6 aplicaçãos: Industrial Motor Control (FOC / Servo Drive), LED Video Wall Display Controller, Software Defined Radio (SDR) Front End, Portable Test and Measurement Equipment, Automotive Infotainment / CAN Gateway, Educational FPGA Development Boards.
Industrial Motor Control (FOC / Servo Drive)
The EP4CE6E22C9L fits industrial motor control drives because its 15 embedded 18x18 multipliers and 91 user I/O pins support field-oriented control (FOC) algorithms, space-vector PWM generation, encoder quadrature decoding, and multi-axis timing. The 6,272 logic elements handle state machines for commutation, current-loop PI controllers, and safety interlocks. The 0C to +85C commercial temperature range suits sealed drive enclosures, while the 1.2 V core supply keeps dissipation low in always-on factory automation systems. The exposed-pad 144-LQFP package enables a compact, hand-solderable PCB layout suitable for low-volume industrial SKUs.
Recomendado
LED Video Wall Display Controller
The EP4CE6E22C9L is well-matched to LED video wall controllers, where its 91 user I/O drive parallel data and clock lines to hundreds of LED driver ICs while its 6,272 logic elements handle scan-line multiplexing, gamma correction, and refresh-rate conversion. The 276,480 bits of embedded RAM serve as line buffers for color-space conversion (RGB to LED PWM duty cycles). Compared with a microcontroller, the FPGA's parallel fabric supports higher refresh rates without taxing a single CPU core, eliminating visible flicker on large panels. The LQFP-144 footprint eases prototype builds in custom display enclosures.
Recomendado
Software Defined Radio (SDR) Front End
For SDR baseband processing, the EP4CE6E22C9L provides sufficient logic density to implement digital down-conversion (DDC), finite impulse response (FIR) filters, and quadrature demodulation. Its 15 hardware 18x18 multipliers accelerate complex-mix multiply-accumulate operations required for tuner I/Q channelization. The 276 Kbits of block RAM hold FIR coefficients and small FFT windows without needing external memory. Combined with an external ADC and DAC pair, the EP4CE6E22C9L can implement a single-channel HF or VHF SDR receiver. The 144-LQFP exposed-pad package fits a credit-card-sized PCB for portable SDR kits.
Recomendado
Portable Test and Measurement Equipment
Battery-powered oscilloscopes, logic analyzers, and protocol testers benefit from the EP4CE6E22C9L's low dynamic power and 91 flexible user I/O. Logic analyzers use the FPGA for sampling-channel multiplexing and trigger-pattern matching, while arbitrary waveform generators use the embedded multipliers for DDS (direct digital synthesis) phase accumulators. The 1.2 V core supply combined with multi-voltage I/O banks (1.2 V to 3.3 V) lets the same board interface legacy 5 V-tolerant signals via external level shifters. The LQFP-144 exposed pad supports hand assembly for prototype instruments.
Recomendado
Automotive Infotainment / CAN Gateway
Inside vehicle infotainment head units and CAN-to-Ethernet gateways, the EP4CE6E22C9L bridges multiple automotive buses (CAN, LIN, FlexRay) and routes audio/video streams to display controllers. Its 91 user I/O support several CAN controllers, audio I2S buses, and LVDS display links. The 6,272 logic elements accommodate protocol state machines and audio sample-rate conversion. Designers should pair this part with the industrial-temperature EP4CE6E22A7N variant for AEC-Q100-grade thermal profiles, since the EP4CE6E22C9L itself is commercial-grade. The exposed-pad package aids thermal dissipation behind dashboard enclosures.
Recomendado
Educational FPGA Development Boards
University digital logic courses and FPGA training kits favor the EP4CE6E22C9L because it pairs the Intel Quartus Prime toolchain with a hand-solderable 144-LQFP exposed-pad package, eliminating BGA rework equipment for student labs. Its 6,272 logic elements are sufficient for full RISC-V soft-core implementations, VGA controllers, and UART peripherals commonly assigned in coursework. The exposed pad also simplifies thermal benchmarking and oscilloscope probing. Combined with low unit pricing, this makes the EP4CE6E22C9L a cost-effective platform for instructors building lab kits in volume.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4CE6E22C9L — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22C6N | EP4CE10E22C8N | EP4CE15E22C8N | EP4CE6E22A7N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 (same) | 6,272 (same) | 6,272 (same) | 10,320 (+64%) | 15,408 (+145%) | 6,272 (same) |
| Speed Grade | C9 | C8 (slower) | C7 (slower) | C6 (slowest) | C8 | C8 | A7 (industrial) |
| Embedded RAM (bits) | 276,480 | 276,480 (same) | 276,480 (same) | 276,480 (same) | 423,936 (+53%) | 516,096 (+87%) | 276,480 (same) |
| Embedded 18x18 Multipliers | 15 | 15 (same) | 15 (same) | 15 (same) | 23 (+53%) | 56 (+273%) | 15 (same) |
| Maximum User I/O | 91 | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Principais diferenciais
- Fastest Cyclone IV E speed grade in the 144-LQFP package (vs EP4CE6E22C8N)
- 6,272 logic elements - lowest density in Cyclone IV E 144-LQFP family (vs EP4CE15E22C8N)
- Commercial 0C to +85C temperature range (vs EP4CE6E22A7N)
Notas de projeto
Decouple every VCCINT pin (1.2 V core) with a 0.1 uF X7R ceramic capacitor placed within 3 mm of each pin, plus a bulk 10 uF tantalum or polymer capacitor near the FPGA. Each VCCIO bank (1.2 V to 3.3 V) requires its own 0.1 uF bypass cap. Failure to decouple each pin individually is a common cause of JTAG communication failures and intermittent configuration errors on Cyclone IV E devices.
The exposed pad (pin 144 / EPAD) on the 144-LQFP package MUST be soldered to a copper pour of at least 100 mm^2 on the top or bottom PCB layer, with thermal vias (0.3 mm drill, 0.5 mm pitch grid) connecting to internal ground planes. For designs running the 15 embedded multipliers near 266 MHz, the junction temperature can exceed 100C without adequate thermal copper, leading to timing failures or device damage.
Follow Intel's Pin Connection Guidelines for the Cyclone IV E family - unused I/O pins should be left floating or driven to a defined logic level per Quartus Prime device settings. Do not tie unused I/O to ground without checking the unused-pin report, as some I/O cells feed internal configuration logic that expects a default high state during power-up. Always run the Quartus Prime fitter with all pin assignments finalized before PCB layout freeze.
A frequent mistake is selecting the wrong speed grade for timing closure. The C9 grade in EP4CE6E22C9L is the fastest Cyclone IV E speed; substituting a C8 or C7 pin-compatible part can fail hold-time analysis in pipelines clocked above 200 MHz. Estimated: at 200 MHz fMAX, a C8 part provides roughly 10-15% less timing margin than C9. Always re-run timing analysis after substituting any speed grade variant.
Place the JTAG header (TCK, TMS, TDI, TDO) within 50 mm of the FPGA with 33 ohm series termination resistors on each JTAG signal to suppress ringing during programming. Route JTAG traces away from switching power supply nodes and high-speed differential pairs. For multi-FPGA JTAG chains, add a 1k pull-up on TCK and TMS to keep the chain in a benign state during board power-up.
Informações de conformidade
RoHS and lead-free compliant per Cyclone IV E product page. Commercial temperature grade - not AEC-Q100 qualified. Choose EP4CE6E22A7N for industrial-grade thermal profiles.