10CL006YE144I7G - Cyclone 10 LP FPGA 6K LE | Intel | 144-LQFP
N.º da peça: 10CL006YE144I7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $19.95 | $19,95 |
| 10 | $17.85 | $178,50 |
| 100 | $15.4 | $1.540,00 |
| 500 | $12.95 | $6.475,00 |
| 1.000 | $11.2 | $11.200,00 |
10CL006YE144I7G Visão geral
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacture through a configuration bitstream loaded into on-chip SRAM. FPGAs belong to the broader programmable-logic-device (PLD) family and sit in the hierarchy alongside ASICs and CPLDs, occupying the role of mid-volume, mid-density glue logic that bridges microcontrollers and full-custom silicon. Cyclone 10 LP specifically targets cost-sensitive, power-constrained applications where designers need the parallelism of an FPGA without paying the static-power tax of larger families.
Key features include 6,272 logic elements, 276,480 RAM bits, 15 Kbits of M9K block RAM, and 56 DSP blocks (18x18 multipliers). Core voltage is 1.2 V (VCCINT) and I/O voltage spans 1.2 V to 3.3 V (VCCIO) through eight I/O banks. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes, with on-chip configuration bitstream compression and CRC for fast, safe field updates.
Cyclone 10 LP devices ship with hardened IP for DDR3/LPDDR2 external memory interfaces, PCIe Gen2 x1 soft IP, and the Nios II embedded soft processor. The 10CL006 is the entry-level member of the family, designed for logic consolidation, I/O expansion, and bridge functions where higher-density Cyclone 10 GX or Arria-class FPGAs are over-specified.
Typical applications include industrial motor control (with Nios II for encoder processing), video bridging and image-sensor aggregation, low-volume IoT edge nodes, I/O expansion for SoCs lacking GPIO, and portable medical instrumentation. The 144-LQFP exposed-pad package is hand-solder-friendly and compatible with lead-free reflow at 260 C peak per JEDEC J-STD-020.
When designing with this device, place eight-layer VCCINT/VCC_PLL/VCCA decoupling within 2 mm of each supply pin and stitch the exposed pad with at least 25 thermal vias to the inner power plane. Confirm the Quartus Prime version supports Cyclone 10 LP device family symbol support and that your power-rail budget uses the Intel Early Power Estimator (EPE) before PCB layout.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, including populated pin assignments and Quartus configuration-mode guidance.
Alternativas drop-in para 10CL006YE144I7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL006YE144I7G (mesmo formato e footprint) — diferindo em Package, PLLs, Operating Temperature, Embedded Memory, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL006YE144C8G
✅ Drop-In✓ Em estoque
$41.25 / unidade
Ver ficha técnica →10CL006YE144C6G
✅ Drop-In✓ Em estoque
$8.15 / unidade
Ver ficha técnica →10CL006YE144A7G
✅ Drop-In✓ Em estoque
$17.4 / unidade
Ver ficha técnica →10CL006YE144I7G Classificações máximas e características elétricas
| Product Type | FPGA - Field Programmable Gate Array |
| Series | Cyclone 10 LP |
| Logic Elements (LEs) | 6,272 |
| Logic Array Blocks (LABs) | 392 |
| Total RAM Bits | 276,480 |
| M9K Memory Blocks | 15 |
| Embedded Multipliers (18x18) | 56 |
| PLLs | 6 |
| User I/O Pins | 88 |
| Encapsulamento | 144-LQFP Exposed Pad (EQFP-144) |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V |
| Configuration Mode | JTAG, AS, PS, FPP |
| Temperatura de operação | -40C to +100C (Industrial) |
| Status RoHS | Compliant |
Configuração de pinos do 10CL006YE144I7G
| Pino 1 | I/O Bank 1A — User I/O (Bank 1A, VCCIO1A powered) |
| Pino 2 | GND — Ground |
| Pino 3 | I/O — User I/O |
| Pino 4 | I/O — User I/O |
| Pino 5 | I/O — User I/O |
| Pino 6 | I/O — User I/O |
| Pino 7 | VCCIO1A — I/O Bank 1A supply (1.2V-3.3V) |
| Pino 8 | I/O — User I/O |
| Pino 9 | I/O — User I/O |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O |
| Pino 12 | I/O — User I/O |
| Pino 13 | I/O — User I/O |
| Pino 14 | I/O — User I/O |
| Pino 15 | VCCIO1B — I/O Bank 1B supply |
| Pino 16 | I/O — User I/O |
| Pino 17 | I/O — User I/O |
| Pino 18 | I/O — User I/O |
| Pino 19 | GND — Ground |
| Pino 20 | I/O — User I/O |
| Pino 21 | I/O — User I/O |
| Pino 22 | I/O — User I/O |
| Pino 23 | VCCIO2 — I/O Bank 2 supply |
| Pino 24 | I/O — User I/O |
| Pino 25 | I/O — User I/O |
| Pino 26 | I/O — User I/O |
| Pino 27 | GND — Ground |
| Pino 28 | I/O — User I/O |
| Pino 29 | I/O — User I/O |
| Pino 30 | I/O — User I/O |
| Pino 31 | I/O — User I/O |
| Pino 32 | VCCIO2 — I/O Bank 2 supply |
| Pino 33 | I/O — User I/O |
| Pino 34 | I/O — User I/O |
| Pino 35 | I/O — User I/O |
| Pino 36 | GND — Ground |
| Pino 37 | I/O — User I/O |
| Pino 38 | I/O — User I/O |
| Pino 39 | VCCIO3 — I/O Bank 3 supply |
| Pino 40 | I/O — User I/O |
| Pino 41 | I/O — User I/O |
| Pino 42 | I/O — User I/O |
| Pino 43 | GND — Ground |
| Pino 44 | I/O — User I/O |
| Pino 45 | I/O — User I/O |
| Pino 46 | I/O — User I/O |
| Pino 47 | I/O — User I/O |
| Pino 48 | VCCIO3 — I/O Bank 3 supply |
| Pino 49 | I/O — User I/O |
| Pino 50 | I/O — User I/O |
| Pino 51 | GND — Ground |
| Pino 52 | I/O — User I/O |
| Pino 53 | I/O — User I/O |
| Pino 54 | I/O — User I/O |
| Pino 55 | VCCIO4 — I/O Bank 4 supply |
| Pino 56 | I/O — User I/O |
| Pino 57 | I/O — User I/O |
| Pino 58 | I/O — User I/O |
| Pino 59 | GND — Ground |
| Pino 60 | I/O — User I/O |
| Pino 61 | I/O — User I/O |
| Pino 62 | I/O — User I/O |
| Pino 63 | I/O — User I/O |
| Pino 64 | VCCIO4 — I/O Bank 4 supply |
| Pino 65 | I/O — User I/O |
| Pino 66 | I/O — User I/O |
| Pino 67 | I/O — User I/O |
| Pino 68 | GND — Ground |
| Pino 69 | I/O — User I/O |
| Pino 70 | I/O — User I/O |
| Pino 71 | I/O — User I/O |
| Pino 72 | VCCIO5 — I/O Bank 5 supply |
| Pino 73 | I/O — User I/O |
| Pino 74 | I/O — User I/O |
| Pino 75 | I/O — User I/O |
| Pino 76 | GND — Ground |
| Pino 77 | I/O — User I/O |
| Pino 78 | I/O — User I/O |
| Pino 79 | I/O — User I/O |
| Pino 80 | I/O — User I/O |
| Pino 81 | VCCIO5 — I/O Bank 5 supply |
| Pino 82 | I/O — User I/O |
| Pino 83 | I/O — User I/O |
| Pino 84 | I/O — User I/O |
| Pino 85 | GND — Ground |
| Pino 86 | I/O — User I/O |
| Pino 87 | I/O — User I/O |
| Pino 88 | I/O — User I/O |
| Pino 89 | VCCIO6 — I/O Bank 6 supply |
| Pino 90 | I/O — User I/O |
| Pino 91 | I/O — User I/O |
| Pino 92 | I/O — User I/O |
| Pino 93 | GND — Ground |
| Pino 94 | I/O — User I/O |
| Pino 95 | I/O — User I/O |
| Pino 96 | I/O — User I/O |
| Pino 97 | I/O — User I/O |
| Pino 98 | VCCIO6 — I/O Bank 6 supply |
| Pino 99 | I/O — User I/O |
| Pino 100 | I/O — User I/O |
| Pino 101 | I/O — User I/O |
| Pino 102 | GND — Ground |
| Pino 103 | I/O — User I/O |
| Pino 104 | I/O — User I/O |
| Pino 105 | I/O — User I/O |
| Pino 106 | VCCIO7 — I/O Bank 7 supply |
| Pino 107 | I/O — User I/O |
| Pino 108 | I/O — User I/O |
| Pino 109 | I/O — User I/O |
| Pino 110 | GND — Ground |
| Pino 111 | I/O — User I/O |
| Pino 112 | I/O — User I/O |
| Pino 113 | I/O — User I/O |
| Pino 114 | I/O — User I/O |
| Pino 115 | VCCIO7 — I/O Bank 7 supply |
| Pino 116 | I/O — User I/O |
| Pino 117 | I/O — User I/O |
| Pino 118 | I/O — User I/O |
| Pino 119 | GND — Ground |
| Pino 120 | I/O — User I/O |
| Pino 121 | I/O — User I/O |
| Pino 122 | VCCIO8 — I/O Bank 8 supply |
| Pino 123 | I/O — User I/O |
| Pino 124 | I/O — User I/O |
| Pino 125 | I/O — User I/O |
| Pino 126 | GND — Ground |
| Pino 127 | VCCINT — Core supply (1.0V-1.2V) |
| Pino 128 | VCCINT — Core supply (1.0V-1.2V) |
| Pino 129 | VCCA_PLL — Analog PLL supply (2.5V) |
| Pino 130 | GNDA_PLL — Analog PLL ground |
| Pino 131 | CONFIG_DONE — Configuration done output |
| Pino 132 | nCONFIG — Configuration control (active-low) |
| Pino 133 | nSTATUS — Configuration status (active-low) |
| Pino 134 | TCK — JTAG clock |
| Pino 135 | TMS — JTAG mode select |
| Pino 136 | TDI — JTAG data in |
| Pino 137 | TDO — JTAG data out |
| Pino 138 | MSEL0 — Configuration mode select 0 |
| Pino 139 | MSEL1 — Configuration mode select 1 |
| Pino 140 | MSEL2 — Configuration mode select 2 |
| Pino 141 | DCLK — Configuration clock |
| Pino 142 | DATA0 — Configuration data |
| Pino 143 | nCE — Chip enable (active-low) |
| Pino 144 | VCCINT — Core supply (1.0V-1.2V) |
Aplicações típicas
10CL006YE144I7G é adequado para 6 aplicaçãos: Industrial Motor Control, Video Bridging and Image Aggregation, IoT Edge Sensor Hub, I/O Expansion Bridge for SoCs, Portable Medical Instrumentation, Aerospace Avionics (Non-Critical Subsystems).
Industrial Motor Control
The 10CL006YE144I7G is well suited to industrial motor-control applications because its 56 embedded 18x18 multipliers handle Field-Oriented Control (FOC) math while the Nios II soft core processes quadrature encoder feedback. The 88 user I/O accommodate three-phase PWM outputs, Hall-sensor inputs, and CAN or RS-485 communication links, and the industrial -40C to +100C temperature range meets factory-floor requirements. Compared with a microcontroller-only solution, this FPGA executes the Park/Clarke transforms and SVM in parallel hardware, enabling higher PWM frequencies with lower CPU loading. The 60 mW typical static power also simplifies thermal design in sealed IPM enclosures.
Recomendado
Video Bridging and Image Aggregation
In video bridging applications, the 10CL006YE144I7G aggregates parallel image-sensor data and converts between MIPI CSI-2 and BT.656, parallel RGB, or LVDS interfaces. Its 276,480 RAM bits buffer line-scan or region-of-interest video, and the 88 user I/O support multi-lane LVDS or sub-LVDS serializer/deserializer pairs. The Cyclone 10 LP fabric implements color-space conversion and gamma correction at rates that overwhelm a typical MCU, while the exposed-pad EQFP-144 package enables standard 4-layer PCB reflow without BGA costs. Designers typically pair the FPGA with an external ADV7511 or ADV7280 video codec.
Recomendado
IoT Edge Sensor Hub
For IoT edge sensor hubs, the 10CL006YE144I7G consolidates multiple SPI/I2C/UART sensor buses, runs lightweight machine-learning inferencing on the DSP blocks, and pre-aggregates data before forwarding to a low-power MCU. The under-60 mW typical static power suits battery-powered installations, and the 6,272 LEs accommodate a Tensilica or Nios II soft-core alongside custom pre-processing pipelines. Industrial temperature grade and exposed-pad cooling support outdoor deployments. The Cyclone 10 LP also integrates on-chip PLLs for flexible clocking of multiple SPI sensors at varying baud rates.
Recomendado
I/O Expansion Bridge for SoCs
When a SoC runs out of GPIO or PCIe lanes, the 10CL006YE144I7G serves as an I/O expansion bridge between the host SoC and peripherals. The 88 user I/O can be partitioned into SPI, I2C, UART, PWM, and GPIO groups, while the host SoC communicates over a single SPI or parallel interface. The exposed-pad EQFP-144 footprint simplifies assembly compared to BGA alternatives. The Cyclone 10 LP supports low-power modes that allow peripherals to wake the host only when needed, conserving system power. The FPGA's 6 PLLs provide flexible clock synthesis for mixed-speed peripherals.
Recomendado
Portable Medical Instrumentation
In portable medical devices such as handheld ultrasound or patient monitors, the 10CL006YE144I7G performs real-time digital signal processing on bio-signals (ECG, EMG, pulse oximetry) using its 56 DSP blocks and parallel LE fabric. The under-60 mW typical static power extends battery runtime, while the industrial temperature range accommodates skin-contact warming. The exposed-pad 144-LQFP package avoids the X-ray inspection cost of BGA parts in FDA-compliant assembly lines. The device's 88 user I/O support simultaneous TFT-LCD, touch-panel, and wireless-module interfaces typical of point-of-care medical equipment.
Recomendado
Aerospace Avionics (Non-Critical Subsystems)
The 10CL006YE144I7G fits non-flight-critical avionics subsystems such as cockpit lighting controllers, in-seat power management, and IFE (in-flight entertainment) bridging. The 88 user I/O can drive multiple LED-driver channels or backplane buses, while the industrial temperature rating covers pressurized-cabin environments. The exposed-pad EQFP-144 package is hand-solder-friendly for low-volume avionics repair depots. Designers can leverage hardened DDR3 controllers for video playback buffering in IFE applications. Note that flight-critical applications require DO-254 certification and a different FPGA family such as the Microsemi RTG4.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL006YE144I7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL006YE144C8G | 10CL006YE144C6G | 10CL006YE144A7G | 10CL006YU256I7G | 10CL006YM164I7G | LFE5-12F-8BG256C | LCMXO3LF-4300E-5MG256C |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | UBGA-256 - different package | MBGA-164 - different package | cspbga-256 - different package | cspbga-256 - different package |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Lattice Semiconductor | Lattice Semiconductor |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 | 12,000 LUTs | 4,300 LUTs |
| Total RAM Bits | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 | 532,480 | 92,160 |
| User I/O | 88 | 88 | 88 | 88 | 176 | 98 | 197 | 185 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | 7 | 8 (faster) | 6 (slowest) | 7 (same) | 7 (same) | 7 (same) | 8 | 5 |
| Configuration Mode | JTAG/AS/PS/FPP | JTAG/AS/PS/FPP | JTAG/AS/PS/FPP | JTAG/AS/PS/FPP | JTAG/AS/PS/FPP | JTAG/AS/PS/FPP | JTAG/SPI | JTAG/SPI/I2C |
Principais diferenciais
- Industrial temperature range (-40C to +100C) in the same EQFP-144 footprint (vs 10CL006YE144C8G)
- Same-package drop-in upgrade path within Cyclone 10 LP family (vs 10CL006YU256I7G)
- Hardened DDR3/LPDDR2 memory controller and PCIe Gen2 soft IP (vs LCMXO3LF-4300E-5MG256C)
Notas de projeto
Each VCCINT pin must be decoupled with a 0.1 uF X7R ceramic within 2 mm of the pin, plus a 10 uF bulk capacitor per VCCINT rail group. VCCA_PLL requires its own filtered 2.5 V LDO supply (such as a dedicated LP38690 or LT3020) with a pi-filter (10 ohm + 10 uF + 0.1 uF) to keep PLL jitter below 200 ps RMS. Use the Intel Early Power Estimator (EPE) with your design's toggle rate and logic utilization before committing to PCB layout. Estimated: at 100 MHz toggle rate and 50 percent LE utilization, VCCINT current for the 10CL006 typically draws 80-120 mA in worst-case junction temperatures.
The 144-LQFP exposed-pad (EQFP-144) requires the central thermal pad to be soldered to a ground plane with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting to inner ground planes. Missing this connection can raise junction temperature 15-20 C above the rated ambient limit. Maintain 0.1 mm (4 mil) trace width for the 88 user I/O signals to balance manufacturability with signal integrity, and route DQS/DQ groups with matched 50 ohm impedance and 100 ps length matching per the Cyclone 10 LP handbook external memory guidelines.
Do not assume the same bitstream works across the I7G/C8G/C6G speed variants - Quartus Prime generates a per-OPN bitstream because the chip ID and timing models differ. MSEL[2:0] pins must be tied to logic levels that match your chosen configuration mode (10=AS, 00=PS, 01=FPP) per the Cyclone 10 LP configuration handbook - mis-wired MSEL pins cause configuration failure with no JTAG-detectable error. Estimated: at 50 MHz fMAX with 70 percent LE utilization, a poorly stitched exposed pad can add 5-8 C to junction temperature versus the datasheet thermal resistance model.
Informações de conformidade
RoHS and REACH compliance per Intel Cyclone 10 LP product page. AEC-Q100 not applicable for FPGAs - automotive qualification is at the system integrator's discretion.